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AMD XC6SLX150T-3FG484I
- Part No.:
- XC6SLX150T-3FG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX150T-3FG484I.pdf
- Description:
- IC FPGA 296 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,679
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Product details
Overview
XC6SLX150T-3FG484I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 18-bit x 36Kb block RAM, 576 DSP48A1 slices, and operates at -3 speed grade with industrial temperature range (-40°C to +100°C). It is used in high-reliability industrial control and video processing systems requiring deterministic timing and multi-standard I/O support.
For engineers reviewing the XC6SLX150T-3FG484I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O bank voltage flexibility (1.2V/1.8V/2.5V/3.3V), LVDS/MLVDS/SSTL/HSTL interface compliance, and JTAG boundary-scan test capability.
Technical Context
The XC6SLX150T-3FG484I implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic functions. It integrates six CMT clock management tiles-each containing two DCMs-for phase alignment, frequency synthesis, and jitter reduction across multiple clock domains.
I/O banks are organized into eight groups supporting independent VCCO and VREF settings. Each bank supports programmable slew rate, drive strength, and on-chip termination (up to 100Ω differential), enabling robust signal integrity in mixed-voltage system interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - total available LUT+FF pairs for combinational and sequential logic implementation |
| Block RAM | 3,004 kbits (18 × 36 Kb) - supports dual-port operation and true dual-port mode for FIFO/buffering |
| DSP Slices | 576 DSP48A1 - each performs 18×18 multiply, 48-bit accumulator, and pre-adder for filter pipelines |
| Speed Grade | -3 - guarantees timing closure at highest operating frequency for this device family |
| Operating Temp | -40°C to +100°C - qualified for industrial environments without derating |
| I/O Standards | LVDS, MLVDS, SSTL-2, SSTL-18, HSTL-I, HSTL-II, LVCMOS - enables direct interfacing to memory, sensors, and FPD-Link |
| Config Interface | Master SPI, Slave SelectMAP, JTAG - supports in-system programming and debug via standard tools |
Pinout & Package
XC6SLX150T-3FG484I is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 23 mm × 23 mm body size, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. The package supports thermal dissipation up to 3.5 W under typical industrial operating conditions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply input - must be filtered with local 10 µF + 100 nF decoupling |
| P2 | VCCAUX | 2.5 V auxiliary supply - powers configuration logic, PLLs, and I/O banks' internal circuitry |
| A1 | GND | Ground reference for core and analog circuits - requires low-inductance connection to PCB ground plane |
| T1 | M0 | Configuration mode select - sets boot source (SPI vs. BPI) during power-up reset |
| R1 | PROGRAM_B | Active-low asynchronous reset - initiates reconfiguration and clears internal state |
| H1 | CLKIN | Dedicated single-ended clock input - connects to external oscillator or system clock source |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Clock Management | Six CMTs with dual DCMs per tile - enable precise clock division, phase shifting, and duty-cycle correction without external PLLs |
| Flexible I/O Banking | Eight independent I/O banks - allow concurrent use of 1.8 V, 2.5 V, and 3.3 V interfaces on same device |
| On-Chip Termination | Programmable 25–100 Ω series/differential termination - eliminates need for external resistors in point-to-point links |
| Partial Reconfiguration Support | Dynamic module swapping without full device reset - enables runtime adaptation in communication baseband or radar processing |
| JTAG Boundary Scan | IEEE 1149.1 compliant - provides structural test coverage for PCB interconnects and solder joint integrity |
Applications
| Industrial Motion Control | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time servo loop execution and encoder feedback processing in CNC machines and robotic arms. IC Role / Device Role / Timing Role: FPGA acts as deterministic real-time controller with sub-microsecond interrupt latency and synchronized PWM generation. Use Value: Enables tight position control using integrated DSP slices for PID computation and block RAM for trajectory buffering. | Use Scenario: High-speed data aggregation from ultrasound transducer arrays and time-aligned ADC sampling. IC Role / Device Role / Timing Role: FPGA serves as time-critical front-end processor handling LVDS-based sensor data ingestion and channel multiplexing. Use Value: Leverages 576 DSP48A1 slices for beamforming coefficient application and 18-bit block RAM for delay-line storage. |
| Avionics Data Concentrator | Test & Measurement Equipment |
Use Scenario: ARINC 429 and MIL-STD-1553 bus bridging in flight control subsystems with deterministic latency. IC Role / Device Role / Timing Role: FPGA implements protocol engines and time-stamped message routing with hardware-level arbitration. Use Value: Uses dedicated I/O banks with programmable slew rate to meet avionics EMI requirements and ensure signal integrity over long traces. | Use Scenario: Multi-channel digital pattern generation and acquisition in automated test equipment (ATE). IC Role / Device Role / Timing Role: FPGA functions as high-precision timing sequencer with jitter-controlled outputs and synchronous capture windows. Use Value: Achieves <150 ps clock-to-output jitter via CMT-based clock synthesis and on-die delay calibration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-3FG484C | Commercial temperature range (0°C to +85°C); identical logic resources and I/O count | Limited to non-industrial environments; unsuitable for extended ambient or sealed enclosures | Select when cost sensitivity outweighs environmental qualification needs |
| XCKU035-2FFVA676I | Kintex UltraScale architecture; 215K logic cells, higher bandwidth transceivers, but no native LVDS I/O | Targets high-speed serial protocols (PCIe Gen3, 10G Ethernet); requires redesign for parallel I/O systems | Choose for bandwidth-intensive upgrades where migration path justifies layout change |
Compared with XC6SLX150-3FG484C, the XC6SLX150T-3FG484I offers guaranteed operation at -40°C and +100°C, while XCKU035-2FFVA676I delivers greater throughput but lacks pin-compatible replacement and requires new board design due to different I/O architecture and package.
Availability
XC6SLX150T-3FG484I is available at Aetrix Electronics and suitable for industrial motion control, medical imaging interface, avionics data concentrators, and test & measurement equipment requiring stable component supply across extended temperature ranges.
Supply support for XC6SLX150T-3FG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Spartan-6 family, including XC6SLX150T-3FG484I, was designed for cost-sensitive, high-volume applications demanding low-power logic density, flexible I/O, and industrial-grade reliability without sacrificing performance.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX150T-3FG484I?
The XC6SLX150T-3FG484I supports I/O standards up to 3.3 V across its eight configurable I/O banks. Each bank allows independent VCCO settings of 1.2 V, 1.8 V, 2.5 V, or 3.3 V, enabling mixed-voltage interface designs without level shifters. This capability is confirmed in the Spartan-6 FPGA Electrical Characteristics Data Sheet (DS162, v1.9).
Does XC6SLX150T-3FG484I include built-in configuration memory?
No, XC6SLX150T-3FG484I does not include on-chip non-volatile configuration memory. It relies on external SPI flash or PROM for bitstream storage and loads configuration upon power-up. Configuration can be initiated via Master SPI, Slave SelectMAP, or JTAG, with fallback mechanisms supported through PROGRAM_B and INIT_B pins.
Can XC6SLX150T-3FG484I operate in partial reconfiguration mode?
Yes, XC6SLX150T-3FG484I supports partial reconfiguration as defined in the Spartan-6 FPGA Configuration User Guide (UG380). This allows dynamic swapping of functional modules during runtime without resetting the entire device, which is used in applications like adaptive filtering or protocol switching in communication systems.
What clocking resources are available in XC6SLX150T-3FG484I?
XC6SLX150T-3FG484I contains six Clock Management Tiles (CMTs), each with two Digital Clock Managers (DCMs). These provide frequency synthesis, phase shifting, duty-cycle correction, and jitter reduction. No PLLs are present-only DCM-based clocking, limiting maximum output frequency to 500 MHz per DCM output.
Is XC6SLX150T-3FG484I RoHS compliant and lead-free?
Yes, XC6SLX150T-3FG484I is RoHS compliant and features a lead-free, matte tin finish on all 484 solder balls. The FBGA package meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) and is compatible with standard Pb-free reflow profiles per IPC/JEDEC J-STD-020D.2.
XC6SLX150T-3FG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 296
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX150T-3FG484I FAQ
1.How can I place an order for XC6SLX150T-3FG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150T-3FG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150T-3FG484I reliable?
The price and inventory of XC6SLX150T-3FG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150T-3FG484I is usually 5 days.
3.What payment methods are accepted for XC6SLX150T-3FG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150T-3FG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150T-3FG484I?
XC6SLX150T-3FG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150T-3FG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150T-3FG484I?
For technical support, including XC6SLX150T-3FG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150T-3FG484I requirements.
6.How does Aetrix verify that XC6SLX150T-3FG484I is sourced from the original manufacturer or authorized distributors?
All XC6SLX150T-3FG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150T-3FG484I meets industry standards.
7.What is the process for return or replacement of XC6SLX150T-3FG484I?
All XC6SLX150T-3FG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150T-3FG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150T-3FG484I part is unused and in its original packaging.
Return procedure for XC6SLX150T-3FG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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