My Inquiry
My Account
AMD XC6SLX150T-3FG676I
- Part No.:
- XC6SLX150T-3FG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX150T-3FG676I.pdf
- Description:
- IC FPGA 396 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,499
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC6SLX150T-3FG676I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 480 DSP48E1 slices, 4.9 Mb of total block RAM, and operates at -3 speed grade with industrial temperature range (–40°C to +100°C). It is packaged in a 676-pin Fine-Pitch Ball Grid Array (FBGA) and used in high-reliability industrial control and video processing systems.
For engineers reviewing the XC6SLX150T-3FG676I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count (480 user I/Os), embedded memory capacity, DSP resource availability, and industrial-grade thermal performance.
Technical Context
The XC6SLX150T-3FG676I implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It integrates SelectIO™ technology supporting LVCMOS, LVDS, SSTL, and HSTL standards across its 480 user I/O pins.
Configuration is performed via Master Serial, Slave Serial, or JTAG modes using external SPI flash or processor-controlled interfaces. The device includes internal clock management with DCMs (Digital Clock Managers) supporting frequency synthesis, phase shifting, and duty cycle correction for up to eight independent clock domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - determines maximum combinational/sequential logic capacity for custom digital functions |
| DSP Slices | 480 × DSP48E1 - enables parallel multiply-accumulate operations for filtering and math-intensive algorithms |
| Block RAM | 4.9 Mb - supports large on-chip data buffering, FIFOs, and lookup tables without external memory |
| User I/O Pins | 480 - provides high interface flexibility for multi-protocol connectivity and board-level signal routing |
| Speed Grade | -3 - guarantees timing closure at highest operating frequencies within industrial temperature range |
| Operating Temp | –40°C to +100°C - ensures functional reliability in uncontrolled industrial environments |
| Package | 676-pin FBGA (FG676) - 27×27 mm body with 1.0 mm ball pitch, compatible with standard reflow profiles |
Pinout & Package
XC6SLX150T-3FG676I is housed in a 676-ball fine-pitch BGA (FG676) package with 27×27 array, 1.0 mm ball pitch, and standard thermal pad configuration. Pin assignments follow Xilinx SP605 and SP606 reference board layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - sets output voltage level (1.2V/1.5V/1.8V/2.5V/3.3V) for associated pins |
| A2 | IO_L0N_0 | Differential input pair (negative) for Bank 0 - used in LVDS, TMDS, or RSDS signaling |
| B2 | IO_L0P_0 | Differential input pair (positive) for Bank 0 - requires matched trace length to A2 for signal integrity |
| T17 | CCLK | Configuration clock input - drives internal configuration shift registers during master serial mode |
| V17 | DONE | Open-drain status output - goes high when configuration completes and device enters user mode |
| W18 | INIT_B | Active-low initialization indicator - asserts low during configuration error or reset |
Key Features
| Feature | Design Value |
|---|---|
| Integrated DCMs | Two Digital Clock Managers per device - provide jitter-tolerant clock synthesis and phase alignment without external PLL ICs |
| SelectIO™ Technology | Supports 19 I/O standards including LVDS, SSTL-2, and HSTL - eliminates level-shifting components for mixed-voltage system interfacing |
| Embedded Memory | 4.9 Mb distributed and block RAM - enables dual-port RAM, FIFO, and ROM implementation with deterministic latency |
| Configurable Logic | 6-input LUTs with optional distributed RAM or shift register - allows efficient mapping of wide logic functions and pipeline stages |
| Industrial Temp Range | –40°C to +100°C operation - validated for continuous use in motor drives, factory automation, and outdoor video enclosures |
Applications
| Industrial Motion Control | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time servo loop execution and encoder feedback processing in CNC machines and robotic arms. IC Role / Device Role / Timing Role: FPGA fabric implements closed-loop PID controllers and high-speed quadrature decoder logic with sub-microsecond latency. Use Value: 480 user I/Os enable direct connection to multiple axis drivers and sensors; -3 speed grade ensures deterministic timing for 20 kHz update rates. | Use Scenario: Pixel data aggregation and preprocessing from multiple ultrasound or MRI sensor modules before transmission to host CPU. IC Role / Device Role / Timing Role: XC6SLX150T-3FG676I acts as a parallel-to-serial bridge and real-time image buffer controller. Use Value: 4.9 Mb block RAM stores full-frame buffers; DSP48E1 slices accelerate windowing and noise reduction kernels. |
| Video Surveillance Encoder | Avionics Data Concentrator |
Use Scenario: Multi-channel HD video encoding with motion detection and metadata overlay in edge-based security appliances. IC Role / Device Role / Timing Role: Configurable logic handles pixel stream synchronization, compression pre-processing, and Ethernet MAC offload. Use Value: SelectIO™ supports simultaneous LVDS camera inputs and RMII Ethernet outputs; industrial temp rating suits outdoor enclosures. | Use Scenario: Aggregation and protocol translation between ARINC 429, MIL-STD-1553, and CAN FD buses in flight control subsystems. IC Role / Device Role / Timing Role: XC6SLX150T-3FG676I serves as a deterministic interconnect hub with time-triggered scheduling logic. Use Value: Dual DCMs generate synchronized clocks for each bus domain; 147K logic cells accommodate multiple concurrent protocol state machines. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic acceleration and interface bridging applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-3FG676I | Commercial temperature range (0°C to +85°C); identical logic resources, I/O count, and package | Suitable only for controlled-environment applications such as lab equipment or indoor computing | Select XC6SLX150-3FG676I only if ambient operating temperature remains within commercial range and industrial qualification is not required. |
| XC7A100T-3CSG324I | Artix-7 architecture; higher logic density (101,440 LUTs), lower static power, but different pinout and configuration interface | Enables more complex designs with PCIe Gen2 or DDR3 controller IP, but requires PCB redesign and toolchain migration | Choose XC7A100T-3CSG324I for new designs needing higher integration or lower power, not as drop-in replacement for XC6SLX150T-3FG676I. |
Compared with XC6SLX150-3FG676I, the XC6SLX150T-3FG676I adds guaranteed operation at –40°C to +100°C, while XC7A100T-3CSG324I offers architectural improvements but demands layout and firmware changes - making XC6SLX150T-3FG676I optimal for legacy industrial upgrades requiring no hardware revision.
Availability
XC6SLX150T-3FG676I is available at Aetrix Electronics and suitable for industrial motion control, medical imaging interface, and video surveillance encoder applications requiring stable component supply over extended product lifecycles.
Supply support for XC6SLX150T-3FG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and related software tools for heterogeneous compute acceleration.
The Spartan-6 family, including XC6SLX150T-3FG676I, was designed for cost-sensitive, high-volume applications demanding reliable I/O interfacing, moderate logic density, and industrial temperature resilience - especially in factory automation and embedded vision.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX150T-3FG676I?
The XC6SLX150T-3FG676I supports VCCO voltages from 1.2 V to 3.3 V per I/O bank, enabling interoperability with LVCMOS12, LVCMOS15, LVCMOS18, LVCMOS25, LVCMOS33, SSTL15, SSTL18, and HSTL_I standards. Each bank's VCCO must be set independently, and all pins in a bank share the same output voltage level. This flexibility allows direct connection to diverse peripheral voltage domains without level shifters.
Does XC6SLX150T-3FG676I include built-in configuration memory?
No, XC6SLX150T-3FG676I does not include on-chip non-volatile configuration memory. It relies on external serial PROM (e.g., XCFxx series) or processor-controlled configuration via JTAG or slave selectMAP mode. Configuration bitstream is loaded at power-up into volatile SRAM-based CLBs and routing resources, requiring persistent external storage for automatic reconfiguration.
Can XC6SLX150T-3FG676I support DDR2 memory interfaces?
Yes, XC6SLX150T-3FG676I supports DDR2 SDRAM interfaces up to 400 Mbps data rate using its SelectIO™ I/Os and DCM-based clocking. Xilinx UG382 confirms verified DDR2 PHY implementations with write leveling and read/write calibration support in Spartan-6 devices. External termination and careful PCB layout (length matching, impedance control) are required for reliable operation.
What configuration modes are supported by XC6SLX150T-3FG676I?
XC6SLX150T-3FG676I supports Master Serial (via dedicated CCLK and DIN pins), Slave Serial, Slave SelectMAP, and JTAG boundary-scan configuration modes. Master Serial is most common for standalone operation with SPI flash; JTAG is used for debugging and programming during development. Mode selection is controlled by MODE pins (M0–M2) at power-up.
Is XC6SLX150T-3FG676I RoHS compliant and lead-free?
Yes, XC6SLX150T-3FG676I is RoHS-compliant and manufactured with lead-free (Pb-free) packaging. The FG676 package uses matte tin surface finish on solder balls, meeting JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements. Full compliance documentation, including substance declarations and test reports, is available through AMD's Product Change Notifications (PCNs).
XC6SLX150T-3FG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 396
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX150T-3FG676I FAQ
1.How can I place an order for XC6SLX150T-3FG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150T-3FG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150T-3FG676I reliable?
The price and inventory of XC6SLX150T-3FG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150T-3FG676I is usually 5 days.
3.What payment methods are accepted for XC6SLX150T-3FG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150T-3FG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150T-3FG676I?
XC6SLX150T-3FG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150T-3FG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150T-3FG676I?
For technical support, including XC6SLX150T-3FG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150T-3FG676I requirements.
6.How does Aetrix verify that XC6SLX150T-3FG676I is sourced from the original manufacturer or authorized distributors?
All XC6SLX150T-3FG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150T-3FG676I meets industry standards.
7.What is the process for return or replacement of XC6SLX150T-3FG676I?
All XC6SLX150T-3FG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150T-3FG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150T-3FG676I part is unused and in its original packaging.
Return procedure for XC6SLX150T-3FG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC6SLX150T-3FG676I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
