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AMD XC6SLX150T-3FG900C
- Part No.:
- XC6SLX150T-3FG900C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA
- Datasheet:
-
XC6SLX150T-3FG900C.pdf
- Description:
- IC FPGA 540 I/O 900FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,739
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Product details
Overview
XC6SLX150T-3FG900C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 180 DSP48E1 slices, 4.2 MB of total block RAM, and operates at -3 speed grade with 1.2 V core voltage. It is used in industrial control systems requiring deterministic I/O timing and high-density logic integration.
For engineers reviewing the XC6SLX150T-3FG900C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (544 user I/Os), LVDS support, embedded memory depth, and thermal performance in compact PCB layouts.
Technical Context
The XC6SLX150T-3FG900C implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It integrates six CMT clock management tiles-each containing two DCMs and one PLL-for multi-phase clock synthesis and jitter reduction.
It supports SelectIO standards including LVCMOS, LVTTL, SSTL, HSTL, and differential standards such as LVDS, Mini-LVDS, RSDS, and BLVDS across its 544 user I/O pins. Configuration is performed via Master SPI, Slave Serial, or JTAG interfaces with bitstream encryption support.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - determines maximum combinational/sequential logic capacity for HDL implementation |
| User I/O Pins | 544 - supports high-pin-count interface bridging (e.g., parallel bus to PCIe bridge logic) |
| Block RAM | 4.2 MB - enables large on-chip data buffering without external memory |
| DSP Slices | 180 × DSP48E1 - provides fixed-point multiply-accumulate for motor control or digital filtering |
| Speed Grade | -3 - guarantees timing closure up to 500 MHz system clock in worst-case industrial temperature |
| Core Voltage | 1.2 V ±3% - requires tight-regulation DC-DC supply with <15 mV ripple |
| Package | FG900 - 900-pin Fine-Pitch BGA, 35 × 35 mm, 1.0 mm pitch, RoHS-compliant |
Pinout & Package
XC6SLX150T-3FG900C is housed in a 900-pin Fine-Pitch Ball Grid Array (FG900) package with 35 × 35 mm body size, 1.0 mm ball pitch, and standard JEDEC MO-251AC footprint. Thermal pad exposed on underside supports conduction cooling in industrial enclosures.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCO_0 | I/O Bank Power | Supplies 1.2–3.3 V to Bank 0 I/Os; must be decoupled per Xilinx UG381 guidelines |
| VCCAUX | Auxiliary Rail | Provides 2.5 V to configuration logic, clock management, and JTAG circuitry |
| GND | Ground Reference | Multiple dedicated balls per bank ensure low-inductance return paths for signal integrity |
| PROGRAM_B | Configuration Control | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration |
| CCLK | Configuration Clock | Drives internal configuration shift register during Master SPI mode; max 50 MHz |
| INIT_B | Status Indicator | Open-drain output signals configuration success/failure; pulled high externally |
Key Features
| Feature | Design Value |
|---|---|
| Embedded Memory | 4.2 MB block RAM + 1.2 Mb distributed RAM - enables dual-port FIFOs and frame buffers without external SRAM |
| DSP Performance | 180 × DSP48E1 slices operating at 500 MHz - delivers 180 GMAC/s for real-time FIR filtering |
| Multi-standard I/O | Supports 21 I/O standards including LVDS, SSTL-2, and HSTL-I - eliminates level-shifter ICs in mixed-voltage systems |
| Clock Management | Six CMTs (each with 2 DCMs + 1 PLL) - allows independent clock domain crossing for video + control + comms subsystems |
| Configuration Security | Bitstream encryption via AES-256 and HMAC authentication - prevents IP cloning in deployed equipment |
Applications
| Industrial Motion Control | Video Interface Bridge |
|---|---|
Use Scenario: Real-time servo loop execution with encoder feedback and PWM generation in CNC machines. IC Role / Device Role / Timing Role: FPGA fabric implements closed-loop PID controller with sub-1 µs latency; CMTs generate synchronized 20 MHz encoder sampling and 100 kHz PWM clocks. Use Value: Eliminates need for separate motion ASIC and reduces BOM by integrating encoder interface, PWM modulator, and safety logic. | Use Scenario: Converting MIPI CSI-2 camera streams to parallel BT.656 video for legacy display controllers. IC Role / Device Role / Timing Role: XC6SLX150T-3FG900C acts as protocol translator and pixel clock domain synchronizer using IDELAY/ODELAY primitives. Use Value: Enables reuse of existing display hardware while supporting modern image sensors without redesigning PCB layout. |
| Programmable Logic PLC | Communications Backplane Interface |
Use Scenario: Replacing fixed-function ladder logic controllers in modular I/O chassis with field-upgradable logic. IC Role / Device Role / Timing Role: Configurable state machine processes discrete I/O scans at 10 kHz; embedded BRAM stores user-defined logic tables. Use Value: Reduces firmware update cycle time from weeks to minutes via partial reconfiguration over Ethernet. | Use Scenario: Aggregating eight 1 GbE PHY lanes into a single 8-lane PCIe Gen2 x8 root port for network appliance line cards. IC Role / Device Role / Timing Role: XC6SLX150T-3FG900C implements PCIe endpoint logic, SerDes alignment, and traffic shaping with deterministic latency. Use Value: Achieves full line-rate packet forwarding at 4 Gbps aggregate bandwidth with <200 ns jitter tolerance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic integration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-3FG900C | Omits Transceiver (GTP) blocks; same logic density and I/O count but no serial interface capability | Not suitable for designs requiring embedded 3.2 Gbps serial links (e.g., SATA, DisplayPort) | Select XC6SLX150-3FG900C only when transceivers are unused and cost reduction is critical |
| XC7A100T-2CSG324C | Artix-7 architecture: higher logic density (101,440 LUTs), 2.5x DSP slices, but smaller 324-pin CSP package and no pin compatibility | Requires PCB redesign; better suited for new designs needing lower power and higher DSP throughput | Choose XC7A100T-2CSG324C for greenfield projects prioritizing power efficiency and future scalability over drop-in replacement |
Compared with XC6SLX150-3FG900C, the XC6SLX150T-3FG900C adds GTP transceivers for serial protocols, while XC7A100T-2CSG324C offers architectural improvements but mandates layout changes and toolchain migration.
Availability
XC6SLX150T-3FG900C is available at Aetrix Electronics and suitable for industrial automation, video processing, and programmable logic controller applications requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX150T-3FG900C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for data center, AI, and embedded markets.
The Spartan-6 family-including XC6SLX150T-3FG900C-was designed for cost-sensitive, high-volume industrial and automotive applications requiring reliable operation at extended temperature ranges and long-term availability.
FAQ
What is the maximum operating junction temperature for XC6SLX150T-3FG900C?
The XC6SLX150T-3FG900C has a maximum junction temperature of 100°C under industrial-grade conditions (–40°C to +100°C ambient). This rating is validated per Xilinx DS162 and applies when using the FG900 package with recommended PCB copper pour and thermal vias beneath the thermal pad.
Does XC6SLX150T-3FG900C support partial reconfiguration?
Yes, XC6SLX150T-3FG900C supports partial reconfiguration through Xilinx ISE Design Suite v14.7 and later. The feature enables dynamic logic module swapping without resetting the entire device, which is used in applications like runtime protocol adaptation in the XC6SLX150T-3FG900C.
How many GTP transceivers does XC6SLX150T-3FG900C include?
The XC6SLX150T-3FG900C includes eight GTP transceivers, each capable of 3.2 Gbps line rates. These are distributed across four quads and support protocols including SATA, PCI Express Gen1, and DisplayPort 1.1 as specified in Xilinx DS162.
What configuration modes are supported by XC6SLX150T-3FG900C?
XC6SLX150T-3FG900C supports Master SPI, Slave Serial, JTAG, and Boundary Scan configuration modes. Master SPI is most common for standalone boot; JTAG is used for debugging and programming during development of the XC6SLX150T-3FG900C.
Is XC6SLX150T-3FG900C pin-compatible with other Spartan-6 devices in the FG900 package?
No, XC6SLX150T-3FG900C is not fully pin-compatible with other Spartan-6 FG900 variants due to differing I/O bank assignments and power pin allocations. For example, XC6SLX75T-3FG900C uses fewer VCCO rails and lacks GTP-related pins present in the XC6SLX150T-3FG900C.
XC6SLX150T-3FG900C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 900-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 540
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FBGA (31x31)
XC6SLX150T-3FG900C FAQ
1.How can I place an order for XC6SLX150T-3FG900C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150T-3FG900C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150T-3FG900C reliable?
The price and inventory of XC6SLX150T-3FG900C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150T-3FG900C is usually 5 days.
3.What payment methods are accepted for XC6SLX150T-3FG900C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150T-3FG900C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150T-3FG900C?
XC6SLX150T-3FG900C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150T-3FG900C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150T-3FG900C?
For technical support, including XC6SLX150T-3FG900C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150T-3FG900C requirements.
6.How does Aetrix verify that XC6SLX150T-3FG900C is sourced from the original manufacturer or authorized distributors?
All XC6SLX150T-3FG900C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150T-3FG900C meets industry standards.
7.What is the process for return or replacement of XC6SLX150T-3FG900C?
All XC6SLX150T-3FG900C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150T-3FG900C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150T-3FG900C part is unused and in its original packaging.
Return procedure for XC6SLX150T-3FG900C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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