My Inquiry
My Account
AMD XC6SLX150T-3FGG484C
- Part No.:
- XC6SLX150T-3FGG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX150T-3FGG484C.pdf
- Description:
- IC FPGA 296 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:151
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC6SLX150T-3FGG484C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 18-bit x 36Kb block RAM, and 348 user I/Os in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -3 speed grade (fastest in Spartan-6 family) with 1.2V core voltage and supports LVDS, SSTL, HSTL, and differential signaling standards for high-speed interface design in industrial control systems.
For engineers reviewing the XC6SLX150T-3FGG484C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count, speed grade compatibility, embedded memory resources, and thermal performance in constrained PCB layouts.
Technical Context
The XC6SLX150T-3FGG484C implements a hierarchical FPGA architecture with six-input LUTs, dedicated carry logic, and integrated DSP48A1 slices supporting 18×18-bit multiply-accumulate operations. It includes dual-clock DDR registers and phase-matched digital clock managers (DCMs) for precise clock synthesis and skew control.
This device supports configuration via SPI, BPI, or JTAG interfaces and features built-in system monitoring including on-chip temperature and supply voltage sensors. Its SelectIO technology enables programmable drive strength, slew rate, and termination across all I/O banks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - total configurable logic capacity for complex state machines and data path logic |
| Block RAM | 3,008 Kbits (18 × 36 Kb blocks) - supports large FIFOs, buffers, and lookup tables |
| User I/O Pins | 348 - supports multi-protocol interface consolidation with bank-wise voltage flexibility |
| Speed Grade | -3 - fastest timing performance in Spartan-6 family, enabling higher system clock rates |
| Core Voltage | 1.2 V ±3% - defines power delivery requirements and thermal dissipation profile |
| Package | 484-pin FGG (Fine-Pitch BGA, 23×23 mm, 1.0 mm pitch) - requires standard BGA reflow and inspection processes |
| Operating Temp | 0°C to 85°C (Commercial) - validated for non-extended ambient environments |
Pinout & Package
XC6SLX150T-3FGG484C is housed in a 484-ball Fine-Pitch Ball Grid Array (FGG) package with 23×23 array, 1.0 mm ball pitch, and standard thermal pad layout. Pinout follows Xilinx Spartan-6 FPGA pinout conventions with dedicated configuration, clock, JTAG, and I/O banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 output voltage supply - must match interface signaling standard (e.g., 3.3V for LVCMOS33) |
| K1 | CLK0 | Dedicated global clock input - low-skew routing to all clock regions |
| T1 | PROGRAM_B | Active-low configuration reset - initiates slave serial or master SPI configuration |
| V1 | TCK | JTAG test clock - required for boundary scan and in-system programming |
| W1 | TMS | JTAG test mode select - controls TAP controller state transitions |
| Y1 | TDO | JTAG test data output - serial output during boundary scan or debug access |
Key Features
| Feature | Design Value |
|---|---|
| Integrated DCMs | Two Digital Clock Managers per device - enable frequency synthesis, phase shifting, and duty cycle correction without external PLLs |
| DSP48A1 Slices | 144 dedicated arithmetic units - support 18×18-bit signed multiplication and accumulation in single cycle |
| SelectIO Technology | Per-bank programmable I/O standards - allows mixed-voltage operation across 12 I/O banks |
| System Monitor | On-die temperature and VCCINT sensing - enables real-time thermal throttling and supply health monitoring |
| Configuration Security | Bitstream encryption support - prevents reverse engineering of programmed logic functionality |
Applications
| Industrial Motor Control | Video Interface Bridge |
|---|---|
Use Scenario: Real-time closed-loop servo control with encoder feedback and PWM generation for multi-axis drives. IC Role / Device Role / Timing Role: FPGA fabric executes position loop computation, generates synchronized PWM outputs, and manages high-speed encoder capture. Use Value: 348 I/Os accommodate encoder inputs, analog feedback channels, and isolated gate drivers; -3 speed grade ensures sub-microsecond loop latency. | Use Scenario: Conversion between HDMI 1.4 and LVDS display interfaces in medical imaging panels. IC Role / Device Role / Timing Role: Implements pixel clock domain crossing, color space conversion, and parallel-to-serial serialization. Use Value: Block RAM buffers video lines; SelectIO supports both 3.3V LVDS and 1.5V HDMI-compatible signaling on adjacent banks. |
| Programmable Logic Controller (PLC) | Test Equipment I/O Expansion |
Use Scenario: Modular I/O base unit handling discrete inputs, analog acquisition, and fieldbus communication (CAN, RS-485). IC Role / Device Role / Timing Role: Configurable logic handles protocol parsing, cyclic redundancy checks, and deterministic I/O scanning. Use Value: 147K logic cells implement multiple concurrent fieldbus stacks; system monitor tracks internal temperature under continuous operation. | Use Scenario: High-density digital pattern generator and analyzer module for ATE platforms. IC Role / Device Role / Timing Role: Generates synchronized multi-channel test vectors and captures response data with precise timing alignment. Use Value: DCMs provide jitter-controlled clocks up to 333 MHz; DSP slices accelerate real-time signature analysis algorithms. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150T-2FGG484C | Slower -2 speed grade; ~12–15% lower maximum clock frequency in critical paths | Suitable for cost-sensitive designs where timing margin is relaxed | Select when target system clock rates are ≤150 MHz and thermal budget is tighter |
| XC7A100T-2CSG324C | Artix-7 architecture; higher logic density (101,440 LUTs), 2.5x more block RAM, native PCIe Gen2 support | Required for designs needing PCI Express endpoints or higher memory bandwidth | Choose for new designs requiring migration path beyond Spartan-6 lifecycle and enhanced peripheral integration |
Compared with XC6SLX150T-3FGG484C, the -2 variant trades speed for lower power and cost, while the Artix-7 alternative offers architectural upgrades but requires PCB redesign and toolchain migration - neither is pin-compatible.
Availability
XC6SLX150T-3FGG484C is available at Aetrix Electronics and suitable for industrial automation, test equipment, and medical imaging systems requiring stable component supply over extended production cycles.
Supply support for XC6SLX150T-3FGG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.
The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring balanced logic density, I/O flexibility, and low-power operation - especially in industrial and embedded vision systems.
FAQ
What is the maximum operating frequency supported by XC6SLX150T-3FGG484C?
The XC6SLX150T-3FGG484C supports a maximum system clock frequency of 400 MHz in critical paths when using DCMs and proper timing constraints. This speed grade (-3) delivers the highest performance within the Spartan-6 family, validated across process corners and temperature ranges specified in DS162.
Does XC6SLX150T-3FGG484C support JTAG boundary scan testing?
Yes, XC6SLX150T-3FGG484C fully supports IEEE 1149.1 JTAG boundary scan through dedicated pins (TCK, TMS, TDI, TDO, TRST_B). The BSCAN_SPARTAN6 primitive enables automated PCB test coverage and in-system programming without requiring external configuration devices.
Can XC6SLX150T-3FGG484C be configured using SPI flash memory?
Yes, XC6SLX150T-3FGG484C supports master SPI configuration mode, allowing direct boot from industry-standard quad-SPI or standard SPI flash devices. Configuration occurs automatically on power-up when MODE pins are set to 001, and the bitstream is loaded into SRAM-based configuration memory.
What I/O standards are supported by XC6SLX150T-3FGG484C?
XC6SLX150T-3FGG484C supports LVCMOS, LVTTL, SSTL, HSTL, and differential standards including LVDS, BLVDS, RSDS, and Differential Signaling (DS). Each of its 12 I/O banks can be independently powered and configured for different voltage levels and signaling types.
Is XC6SLX150T-3FGG484C RoHS compliant and lead-free?
Yes, XC6SLX150T-3FGG484C is manufactured in a RoHS-compliant, lead-free process and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements. The FGG484 package uses matte tin finish on solder balls and conforms to IPC/JEDEC J-STD-020D reflow profiles.
XC6SLX150T-3FGG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 296
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX150T-3FGG484C FAQ
1.How can I place an order for XC6SLX150T-3FGG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150T-3FGG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150T-3FGG484C reliable?
The price and inventory of XC6SLX150T-3FGG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150T-3FGG484C is usually 5 days.
3.What payment methods are accepted for XC6SLX150T-3FGG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150T-3FGG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150T-3FGG484C?
XC6SLX150T-3FGG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150T-3FGG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150T-3FGG484C?
For technical support, including XC6SLX150T-3FGG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150T-3FGG484C requirements.
6.How does Aetrix verify that XC6SLX150T-3FGG484C is sourced from the original manufacturer or authorized distributors?
All XC6SLX150T-3FGG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150T-3FGG484C meets industry standards.
7.What is the process for return or replacement of XC6SLX150T-3FGG484C?
All XC6SLX150T-3FGG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150T-3FGG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150T-3FGG484C part is unused and in its original packaging.
Return procedure for XC6SLX150T-3FGG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC6SLX150T-3FGG484C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
