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AMD XC6SLX150T-3FGG676C
- Part No.:
- XC6SLX150T-3FGG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX150T-3FGG676C.pdf
- Description:
- IC FPGA 396 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,646
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Product details
Overview
XC6SLX150T-3FGG676C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 180 DSP48E1 slices, 4.9 Mb of total block RAM, and operates at -3 speed grade with 1.2 V core voltage. It is packaged in a 676-pin Fine-Pitch Ball Grid Array (FBGA) with RoHS-compliant lead-free finish and targets high-volume industrial control and embedded vision systems.
For engineers reviewing the XC6SLX150T-3FGG676C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count (480 user I/Os), differential signaling support (LVDS, TMDS), embedded memory capacity, and thermal performance in compact PCB layouts.
Technical Context
The XC6SLX150T-3FGG676C implements a fully programmable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic functions. It integrates dual-register 18×18 multipliers, wide multiplexers, and shift registers optimized for digital signal processing and real-time control.
Configuration is supported via Master Serial, Slave Serial, or JTAG modes using external SPI flash or processor-controlled interfaces. The device supports SelectIO standards including LVCMOS, LVTTL, SSTL, HSTL, and differential protocols such as LVDS and RSDS up to 1.0 Gbps per differential pair.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - determines maximum combinational/sequential logic capacity for custom RTL implementation |
| DSP Slices | 180 × DSP48E1 - enables parallel multiply-accumulate operations for filtering and FFT kernels |
| Block RAM | 4.9 Mb - supports large FIFOs, frame buffers, or lookup tables without external memory |
| User I/O Pins | 480 - provides high interface flexibility for sensor aggregation, display interfaces, or bus bridging |
| Speed Grade | -3 - guarantees timing closure at highest operating frequency for critical paths in industrial designs |
| Core Voltage | 1.2 V ±3% - defines power delivery requirements and impacts dynamic power consumption |
| Package | 676-pin FGG (Fine-Pitch BGA, 27×27 mm, 1.0 mm pitch) - dictates PCB stackup and thermal vias layout |
Pinout & Package
The XC6SLX150T-3FGG676C is housed in a 676-ball Fine-Pitch Ball Grid Array (FGG) package with 27×27 array, 1.0 mm ball pitch, and 2.0 mm overall height. Thermal pad on underside requires solder paste stencil design per Xilinx UG381.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCO_0 | I/O Bank Power | Supplies 1.2–3.3 V to Bank 0 I/Os; must match interface voltage standard |
| VCCAUX | Auxiliary Power | Provides 2.5 V to configuration logic, clocking, and transceivers |
| VCCINT | Core Power | Delivers regulated 1.2 V to FPGA fabric; requires low-noise, high-current supply |
| PROGRAM_B | Configuration Control | Active-low input that initiates master serial configuration from external SPI flash |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading and initialization |
| CLKIN_0 | Primary Clock Input | Dedicated single-ended or differential input for system clock feeding DCM/PLL |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Memory Controller | Supports DDR2/DDR3 SDRAM up to 800 Mbps with built-in calibration and timing closure assistance |
| Dual-Register DSP48E1 | Enables pipelined MAC operations with independent A/B/C register stages for high-throughput filtering |
| SelectIO Technology | Per-bank voltage programmability allows mixed-voltage I/O interfaces on same device |
| DCM Clock Management | Provides jitter reduction, frequency synthesis, and phase shifting without external PLL components |
| ISE Design Suite Support | Full toolchain compatibility including synthesis, place-and-route, and bitstream generation for legacy industrial designs |
Applications
| Industrial PLC Controller | Embedded Vision Processing Unit |
|---|---|
Use Scenario: Real-time motion control and I/O expansion in factory automation cabinets with deterministic cycle times. IC Role / Device Role / Timing Role: FPGA fabric executes custom ladder logic and PID loops; DCM generates synchronized clocks for encoder sampling and PWM outputs. Use Value: 147K logic cells enable integration of multiple control cores and safety monitors on single XC6SLX150T-3FGG676C die. | Use Scenario: High-speed image preprocessing in smart cameras for defect detection on production lines. IC Role / Device Role / Timing Role: XC6SLX150T-3FGG676C ingests raw Bayer data via MIPI CSI-2 bridge and applies histogram equalization and edge detection. Use Value: 180 DSP48E1 slices accelerate convolution kernels while 4.9 Mb block RAM stores intermediate frame buffers. |
| Medical Imaging Interface | Avionics Data Concentrator |
Use Scenario: Aggregation and protocol translation between ultrasound front-end ASICs and PCIe host processors. IC Role / Device Role / Timing Role: XC6SLX150T-3FGG676C implements custom SerDes PHY layer and packet framing logic for low-latency data streaming. Use Value: 480 user I/Os support parallel LVDS links from multiple ADC channels with precise skew control. | Use Scenario: ARINC 429 and MIL-STD-1553B bus bridging in flight control computers with dual-redundant paths. IC Role / Device Role / Timing Role: FPGA configures as dual isolated bus controllers with watchdog timers and error injection test modes. Use Value: -3 speed grade ensures timing margin for worst-case temperature and voltage conditions in avionics enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-3FGG676C | Omits T suffix; lacks extended temperature range (-40°C to +100°C) and enhanced thermal reliability testing | Suitable only for commercial-grade environments; not qualified for industrial or automotive under hood | Select XC6SLX150T-3FGG676C when operating ambient exceeds 85°C or long-term field reliability is required |
| XC7A100T-2CSG324C | Artix-7 architecture; higher logic density (101K LUTs), 2.5x DSP slices, but requires 1.0 V core and different pinout | Enables more complex algorithms but demands PCB redesign and new power delivery network | Choose XC6SLX150T-3FGG676C for drop-in replacement in existing Spartan-6 designs with no layout changes |
Compared with XC6SLX150-3FGG676C, the XC6SLX150T-3FGG676C adds industrial temperature qualification and burn-in screening; versus XC7A100T-2CSG324C, it offers proven longevity, lower power at 1.2 V, and full backward compatibility with legacy ISE toolflow.
Availability
XC6SLX150T-3FGG676C is available at Aetrix Electronics and suitable for industrial automation, medical imaging subsystems, and avionics data concentrators requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX150T-3FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan family for cost-sensitive, high-reliability applications.
The Spartan-6 family was designed for high-volume embedded systems where power efficiency, small footprint, and long-term availability outweigh cutting-edge process node advantages.
FAQ
What is the maximum operating junction temperature for the XC6SLX150T-3FGG676C?
The XC6SLX150T-3FGG676C has a maximum junction temperature of +100°C, validated under industrial temperature grade specifications. This rating enables deployment in sealed enclosures with limited airflow, such as motor drive cabinets or outdoor kiosks. Thermal design must maintain θJA ≤ 12.5°C/W using recommended PCB copper area and thermal vias beneath the FGG package. The XC6SLX150T-3FGG676C datasheet specifies derating curves above 85°C ambient.
Does the XC6SLX150T-3FGG676C support JTAG boundary-scan testing?
Yes, the XC6SLX150T-3FGG676C fully supports IEEE 1149.1 JTAG boundary-scan for PCB-level interconnect testing. Dedicated TDI, TDO, TMS, and TCK pins are assigned to balls A1, A2, B1, and B2 respectively. The XC6SLX150T-3FGG676C implements BSDL version 1.4 compliant with Xilinx UG381, enabling automated test pattern generation and fault isolation during manufacturing.
Can the XC6SLX150T-3FGG676C interface directly with DDR3 SDRAM at 800 Mbps?
Yes, the XC6SLX150T-3FGG676C supports DDR3 SDRAM operation at 800 Mbps per pin using its integrated memory controller and IODELAY2 primitives. It requires proper board-level termination, matched trace lengths, and adherence to Xilinx UG388 layout guidelines. The XC6SLX150T-3FGG676C achieves this rate with -3 speed grade timing closure in Bank 1 and Bank 2 when VCCO = 1.5 V and VREF = 0.75 V.
What configuration modes are supported by the XC6SLX150T-3FGG676C?
The XC6SLX150T-3FGG676C supports Master Serial (from SPI flash), Slave Serial (host-driven), JTAG, and Boundary Scan configuration modes. Master Serial is most common for standalone boot; JTAG is used for programming and debugging. All modes use the same dedicated configuration pins (INIT_B, PROGRAM_B, DONE, CCLK), and the XC6SLX150T-3FGG676C automatically detects mode based on M[2:0] pin states at power-up.
Is the XC6SLX150T-3FGG676C compatible with Xilinx ISE 14.7 software?
Yes, the XC6SLX150T-3FGG676C is fully supported in Xilinx ISE Design Suite 14.7, including synthesis, MAP, PAR, and bitstream generation. Device files, simulation models, and constraint templates for the XC6SLX150T-3FGG676C are included in the ISE installation. No license upgrade is required beyond the standard ISE WebPACK or licensed edition.
XC6SLX150T-3FGG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 396
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX150T-3FGG676C FAQ
1.How can I place an order for XC6SLX150T-3FGG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150T-3FGG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150T-3FGG676C reliable?
The price and inventory of XC6SLX150T-3FGG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150T-3FGG676C is usually 5 days.
3.What payment methods are accepted for XC6SLX150T-3FGG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150T-3FGG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150T-3FGG676C?
XC6SLX150T-3FGG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150T-3FGG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150T-3FGG676C?
For technical support, including XC6SLX150T-3FGG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150T-3FGG676C requirements.
6.How does Aetrix verify that XC6SLX150T-3FGG676C is sourced from the original manufacturer or authorized distributors?
All XC6SLX150T-3FGG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150T-3FGG676C meets industry standards.
7.What is the process for return or replacement of XC6SLX150T-3FGG676C?
All XC6SLX150T-3FGG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150T-3FGG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150T-3FGG676C part is unused and in its original packaging.
Return procedure for XC6SLX150T-3FGG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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