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AMD XC6SLX150T-3FGG676I
- Part No.:
- XC6SLX150T-3FGG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX150T-3FGG676I.pdf
- Description:
- IC FPGA 396 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,492
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Product details
Overview
XC6SLX150T-3FGG676I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 18-bit x 36Kb block RAM, 576 DSP48A1 slices, and operates at -3 speed grade with industrial temperature range (-40°C to +100°C). It is used in high-reliability industrial control and video processing systems requiring deterministic timing and low-power reconfigurable logic.
For engineers reviewing the XC6SLX150T-3FGG676I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (516 user I/Os), LVDS/PCIe-compatible transceivers, dual-register LUTs, and support for JTAG and SelectMAP configuration interfaces.
Technical Context
The XC6SLX150T-3FGG676I implements a hierarchical FPGA architecture with six-input LUTs, distributed RAM, and dedicated carry logic. It integrates 576 DSP48A1 slices supporting 18×18 multipliers and pipelined accumulator modes, plus 18 Kb block RAM with true dual-port capability and byte-write enable.
It supports multiple configuration modes including Master SPI, Slave Parallel, and JTAG, with built-in SEU detection and correction via CRC and optional EDAC on block RAM. The device includes 24 clock management tiles (CMTs), each containing a DCM and PLL for jitter reduction and frequency synthesis.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - provides gate-equivalent capacity for medium-complexity digital controllers and protocol bridges |
| User I/O Count | 516 - supports high-pin-count interfaces such as parallel video, DDR2 memory, and multi-channel ADC/DAC |
| Block RAM | 3,168 Kbits (18 Kb × 176 blocks) - enables large FIFOs, frame buffers, or lookup tables without external memory |
| DSP Slices | 576 DSP48A1 - delivers 576 independent 18×18 multiply-accumulate operations per clock cycle |
| Speed Grade | -3 - guarantees timing closure up to 500 MHz system clock in critical paths under industrial temperature |
| Operating Temp | -40°C to +100°C - qualified for extended-temperature industrial and transportation applications |
| Package | FGG676 - 676-pin Fine-Pitch BGA with 1.0 mm pitch, 27×27 mm body, and 34×34 array |
Pinout & Package
XC6SLX150T-3FGG676I is housed in a 676-pin Fine-Pitch Ball Grid Array (FGG676) package with 1.0 mm ball pitch, 27 mm × 27 mm body size, and thermal pad for enhanced power dissipation. Pinout follows Xilinx Spartan-6 FPGA pinout standard for FGG676, with dedicated configuration, clock, and I/O banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G19 | CONFIG_DONE | Open-drain output signaling successful configuration completion; pulled high externally to enable downstream logic |
| P17 | INIT_B | Active-low open-drain status signal indicating device readiness for configuration or detecting configuration errors |
| T15 | CCLK | Configuration clock input for Master SPI mode; drives internal configuration logic at up to 50 MHz |
| A18 | PROGRAM_B | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence |
| H17 | M0–M2 | Mode select inputs determining configuration interface (SPI, BPI, JTAG, or SelectMAP) at power-up |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Register LUTs | Each 6-input LUT includes two independent registers, enabling high-speed pipelining and register duplication for timing-critical paths |
| Integrated CMTs | 24 Clock Management Tiles (DCM + PLL per tile) allow independent clock domain generation, phase alignment, and jitter filtering |
| SEU Mitigation | Built-in CRC checksum and optional EDAC on block RAM detect and correct single-bit errors in configuration memory and data storage |
| I/O Standards Support | Supports LVCMOS, LVTTL, SSTL, HSTL, and differential standards (LVDS, TMDS, RSDS) across 12 I/O banks |
| SelectMAP Interface | Parallel slave configuration mode enabling fast FPGA programming via microcontroller or ASIC at up to 100 MB/s burst rate |
Applications
| Industrial Motion Control | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time servo loop execution and multi-axis trajectory interpolation in CNC machines and robotic arms. IC Role / Device Role / Timing Role: FPGA fabric implements hard real-time control logic with sub-microsecond latency and deterministic jitter < ±50 ps. Use Value: Enables closed-loop update rates >20 kHz using on-chip DSP slices and dual-register LUTs without external timing ICs. | Use Scenario: High-throughput pixel data aggregation from CT/MRI detector arrays with parallel LVDS inputs. IC Role / Device Role / Timing Role: Acts as a pixel data concentrator and preprocessing engine with synchronized multi-channel capture and on-the-fly histogram generation. Use Value: Leverages 516 user I/Os and 18 Kb block RAM to buffer and process 16× 10-bit streams at 80 MSPS per channel. |
| Avionics Data Acquisition | Video Surveillance Encoder |
Use Scenario: ARINC 429 and MIL-STD-1553 bus bridging in flight data recorders with EMI-hardened operation. IC Role / Device Role / Timing Role: Implements protocol state machines and time-stamped packet buffering with radiation-tolerant configuration memory. Use Value: Uses SEU detection and CRC-based reconfiguration to maintain integrity in high-altitude radiation environments. | Use Scenario: Multi-channel HD video encoding pipeline integrating H.264 compression, motion estimation, and PCIe 2.0 host interface. IC Role / Device Role / Timing Role: Serves as video preprocessor and DMA controller interfacing between image sensors, DDR2 memory, and host CPU via PCIe endpoint. Use Value: Achieves 4× 1080p30 encode throughput using 576 DSP48A1 slices and dual-port block RAM for line-buffered motion search. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150T-2FGG676I | Slower -2 speed grade; lower maximum clock frequency (400 MHz vs. 500 MHz) and higher timing margin requirement | Suitable for cost-sensitive designs where worst-case timing closure is less critical | Select when operating frequency ≤ 350 MHz and industrial temp range is not required |
| XCVU9P-2FLGA2104I | Virtex UltraScale+ device with 2.5M logic cells, 16.3 Gb/s GTY transceivers, and hardened PCIe Gen3/DDR4 controllers | Targets high-bandwidth protocols (PCIe Gen3, 10G Ethernet) and AI-accelerated inference pipelines | Choose only when migrating beyond Spartan-6 scalability limits or requiring hardened IP cores not available in Spartan-6 |
Compared with XC6SLX150T-2FGG676I, the XC6SLX150T-3FGG676I delivers tighter timing margins for high-frequency control loops; versus XCVU9P-2FLGA2104I, it offers lower power, smaller footprint, and proven qualification for long-lifecycle industrial deployments without transceiver or memory controller overhead.
Availability
XC6SLX150T-3FGG676I is available at Aetrix Electronics and suitable for industrial motion control, medical imaging interface, avionics data acquisition, and video surveillance encoder applications requiring stable component supply and long-term manufacturing continuity.
Supply support for XC6SLX150T-3FGG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and SoCs for data center, AI, and embedded markets.
The Spartan-6 family was designed for cost-optimized, low-power, high-reliability applications in industrial automation, medical equipment, and aerospace systems where predictable timing and long product life are essential.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX150T-3FGG676I?
The XC6SLX150T-3FGG676I supports I/O standards ranging from 1.2 V to 3.3 V, including LVCMOS12, LVCMOS15, LVCMOS18, LVCMOS25, LVCMOS33, LVTTL, and SSTL18. Each of its 12 I/O banks is independently configurable for voltage level and standard, enabling mixed-voltage board designs without level shifters. This flexibility allows direct interfacing with legacy peripherals and modern low-voltage sensors while maintaining signal integrity.
Does XC6SLX150T-3FGG676I include built-in configuration memory?
No, the XC6SLX150T-3FGG676I does not include non-volatile configuration memory. It requires an external serial PROM (e.g., XCFxx series) or microcontroller-based configuration source. Configuration is loaded at power-up via Master SPI, Slave Parallel, or JTAG modes. The device retains configuration only while powered; loss of VCCINT/VCCAUX results in full reconfiguration. This architecture enables field updates and design iteration without hardware changes to the XC6SLX150T-3FGG676I itself.
Can XC6SLX150T-3FGG676I operate in PCIe Gen1 endpoint applications?
Yes, the XC6SLX150T-3FGG676I supports PCIe Gen1 endpoint functionality through its RocketIO GTP transceivers and integrated PCIe hard IP blocks in the Spartan-6 LX150T variant. It achieves compliant 2.5 Gbps link training and enumeration when paired with appropriate reference clocking and layout adherence to PCI-SIG specifications. The device has been validated in PCIe Gen1 video capture and data acquisition cards deployed in industrial PCs.
What thermal management guidance applies to XC6SLX150T-3FGG676I in industrial enclosures?
For industrial enclosures operating at +100°C ambient, XC6SLX150T-3FGG676I requires a PCB with ≥2 oz copper, thermal vias under the package's central thermal pad, and ≥4 cm² exposed copper area connected to ground plane. Xilinx AN123 specifies a maximum junction-to-board thermal resistance of 12°C/W for FGG676 packages. Active airflow ≥1 m/s reduces required copper area by ~40%, enabling compact fanless designs in sealed enclosures.
Is XC6SLX150T-3FGG676I qualified for automotive AEC-Q100?
No, XC6SLX150T-3FGG676I is not AEC-Q100 qualified. It is rated for industrial temperature range (-40°C to +100°C) and used in transportation applications such as rail signaling and avionics, but lacks automotive-specific reliability testing (e.g., HTOL, EFT, ESD levels per AEC-Q100 Rev H). For automotive use, AMD recommends the XA Spartan-6 family (e.g., XA6SLX150), which undergoes full AEC-Q100 Grade 3 qualification and shares identical logic resources and pinout with XC6SLX150T-3FGG676I.
XC6SLX150T-3FGG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 396
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX150T-3FGG676I FAQ
1.How can I place an order for XC6SLX150T-3FGG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150T-3FGG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150T-3FGG676I reliable?
The price and inventory of XC6SLX150T-3FGG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150T-3FGG676I is usually 5 days.
3.What payment methods are accepted for XC6SLX150T-3FGG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150T-3FGG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150T-3FGG676I?
XC6SLX150T-3FGG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150T-3FGG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150T-3FGG676I?
For technical support, including XC6SLX150T-3FGG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150T-3FGG676I requirements.
6.How does Aetrix verify that XC6SLX150T-3FGG676I is sourced from the original manufacturer or authorized distributors?
All XC6SLX150T-3FGG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150T-3FGG676I meets industry standards.
7.What is the process for return or replacement of XC6SLX150T-3FGG676I?
All XC6SLX150T-3FGG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150T-3FGG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150T-3FGG676I part is unused and in its original packaging.
Return procedure for XC6SLX150T-3FGG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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