My Inquiry
My Account
AMD XC6SLX150T-3FGG900C
- Part No.:
- XC6SLX150T-3FGG900C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA
- Datasheet:
-
XC6SLX150T-3FGG900C.pdf
- Description:
- IC FPGA 540 I/O 900FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,593
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC6SLX150T-3FGG900C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 4,729 Kbits of block RAM, 532 user I/Os, and operates at -3 speed grade with 1.2 V core voltage. It is used in industrial control systems requiring deterministic real-time processing and reconfigurable I/O interfacing.
For engineers reviewing the XC6SLX150T-3FGG900C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, embedded memory depth, DSP slice availability, and thermal performance in compact PCB layouts.
Technical Context
The XC6SLX150T-3FGG900C implements a fully programmable logic fabric based on 6-input LUTs and flip-flops, with integrated clock management using DCM and PLL blocks supporting frequency synthesis and phase alignment. It supports SelectIO standards including LVCMOS, LVDS, and SSTL up to 1.0 Gbps per differential pair.
Configuration is performed via Master SPI or JTAG, with support for fallback configuration and multi-boot images. The device includes 180 dedicated DSP48A1 slices for arithmetic-intensive tasks such as filtering and FFT computation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - determines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 4,729 Kbits - provides on-chip memory for FIFOs, buffers, or lookup tables without external SRAM |
| User I/O Pins | 532 - enables high-density interface consolidation across multiple protocols and voltage domains |
| DSP Slices | 180 × DSP48A1 - delivers fixed-point multiply-accumulate throughput for signal processing pipelines |
| Speed Grade | -3 - guarantees timing closure at highest operating frequencies within specified voltage/temperature range |
| Core Voltage | 1.2 V ±3% - defines power delivery requirements and impacts dynamic power consumption |
Pinout & Package
The XC6SLX150T-3FGG900C is housed in a 900-pin Fine-Pitch Ball Grid Array (FBGA) package with 31 × 31 array, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. Thermal pad is exposed on underside for enhanced heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 1.2 V to FPGA logic fabric and internal routing resources |
| VCCAUX | Auxiliary power supply | Provides 3.3 V or 2.5 V to configuration circuitry, JTAG, and certain I/O banks |
| VCCO | I/O bank power | Set per bank (1.2–3.3 V) to match connected peripheral voltage levels |
| PROGRAM_B | Active-low configuration initiator | Triggers reconfiguration from external source or fallback image |
| INIT_B | Configuration status indicator | Open-drain output signaling successful bitstream loading or error condition |
| CCLK | Configuration clock input | Drives internal configuration shift register during Master SPI mode |
Key Features
| Feature | Design Value |
|---|---|
| Integrated DCM and PLL | Enables precise clock synthesis, multiplication, division, and phase shifting without external components |
| SelectIO Technology | Supports mixed-voltage I/O banks with programmable drive strength and slew rate for EMI reduction |
| Multi-Boot Configuration | Allows field-upgradable firmware via dual-bitstream storage and runtime selection |
| ISE Design Suite Support | Full toolchain compatibility including synthesis, place-and-route, and timing analysis for deterministic development |
| Embedded Memory Blocks | Configurable as true dual-port RAM, ROM, or shift register for flexible data-path implementation |
Applications
| Industrial Motion Control | Automated Test Equipment |
|---|---|
Use Scenario: Real-time servo loop execution with synchronized analog capture and PWM generation. IC Role / Device Role / Timing Role: FPGA fabric implements closed-loop PID controller, encoder interface, and high-resolution PWM modulator. Use Value: 532 I/Os enable direct connection to multiple axes and sensors; -3 speed grade ensures sub-microsecond loop latency. | Use Scenario: High-speed digital pattern generation and response analysis for semiconductor device validation. IC Role / Device Role / Timing Role: Configurable logic generates precise stimulus waveforms while capturing responses with timestamped parallel bus interface. Use Value: 180 DSP48A1 slices accelerate real-time pass/fail decision logic; block RAM buffers test vectors on-chip. |
| Medical Imaging Interface | Avionics Data Concentrator |
Use Scenario: Aggregation and preprocessing of multi-channel ultrasound echo data before transmission to host processor. IC Role / Device Role / Timing Role: FPGA performs channel synchronization, beamforming weighting, and data packing into standardized packet format. Use Value: 4,729 Kbits block RAM stores full-frame echo buffers; SelectIO supports LVDS interfaces to ADCs at 100+ MSPS. | Use Scenario: Consolidation of ARINC 429, discrete I/O, and MIL-STD-1553 traffic onto a single Ethernet backbone. IC Role / Device Role / Timing Role: Protocol translation engine with deterministic latency control and hardware-based message scheduling. Use Value: Dedicated I/O banks isolate mixed-voltage protocols; DCM/PLL maintains strict timing alignment across asynchronous buses. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150T-2FGG900C | Slower -2 speed grade; lower maximum clock frequency and reduced timing margin | Suitable for cost-sensitive designs where worst-case timing closure is less critical | Select when thermal budget or power envelope restricts use of -3 grade |
| XC7K160T-2FFG676C | Kintex-7 architecture; higher logic density (162,240 LUTs), 2.5× more block RAM, and PCIe Gen2 hard IP | Required for designs needing transceivers, DDR3 controller hard IP, or >200 MHz system clocks | Choose for migration path when Spartan-6 resources are insufficient or serial connectivity is mandatory |
Compared with XC6SLX150T-3FGG900C, the -2 variant trades timing margin for lower power and cost, while the Kintex-7 alternative adds transceivers and hardened memory controllers at significantly higher gate count and board-level complexity.
Availability
XC6SLX150T-3FGG900C is available at Aetrix Electronics and suitable for industrial motion control, automated test equipment, and medical imaging systems requiring stable component supply and long-term manufacturing continuity.
Supply support for XC6SLX150T-3FGG900C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now leads in adaptive computing solutions, delivering FPGAs, ACAPs, and software-defined platforms for data center, AI, and embedded markets.
The Spartan-6 family was designed for cost-optimized, low-power, high-I/O density applications in industrial, automotive, and medical systems where reconfigurability and deterministic timing are essential.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX150T-3FGG900C?
The XC6SLX150T-3FGG900C supports I/O standards ranging from 1.2 V to 3.3 V per bank, including LVCMOS, LVDS, and SSTL. Each I/O bank has independent VCCO supply, allowing simultaneous operation of mixed-voltage interfaces. This flexibility enables direct connection to legacy and modern peripherals without level-shifting circuitry. The XC6SLX150T-3FGG900C datasheet specifies absolute maximum ratings and recommended operating conditions for each standard.
Does XC6SLX150T-3FGG900C include built-in configuration memory?
No, the XC6SLX150T-3FGG900C does not include on-chip nonvolatile configuration memory. It requires an external serial PROM or flash memory for bitstream storage. Configuration is loaded at power-up via Master SPI, Slave Serial, or JTAG modes. The XC6SLX150T-3FGG900C supports fallback and multi-boot configurations using external memory partitions.
Can XC6SLX150T-3FGG900C operate in industrial temperature range?
Yes, the 'C' suffix in XC6SLX150T-3FGG900C denotes commercial temperature range (0 °C to +85 °C). For extended industrial operation (-40 °C to +100 °C), the 'I' grade part (XC6SLX150T-3FGG900I) must be selected. Thermal design must account for power dissipation under worst-case logic utilization and ambient conditions for reliable XC6SLX150T-3FGG900C operation.
How many clock management tiles does XC6SLX150T-3FGG900C contain?
The XC6SLX150T-3FGG900C integrates four Digital Clock Managers (DCMs) and two Phase-Locked Loops (PLLs). These clock management units support input frequency multiplication, division, phase shifting, and duty-cycle correction. They enable synchronous design across multiple clock domains and reduce external clock component count. All clock resources are accessible through the XC6SLX150T-3FGG900C ISE toolchain.
Is XC6SLX150T-3FGG900C compatible with Vivado Design Suite?
No, XC6SLX150T-3FGG900C is supported exclusively by the Xilinx ISE Design Suite (v14.7 or earlier). Vivado does not support Spartan-6 devices. Migration to newer architectures like Artix-7 or Kintex-7 is required for Vivado compatibility. Users must retain ISE licenses and legacy toolchains to develop and maintain XC6SLX150T-3FGG900C designs.
XC6SLX150T-3FGG900C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 900-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 540
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FBGA (31x31)
XC6SLX150T-3FGG900C FAQ
1.How can I place an order for XC6SLX150T-3FGG900C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150T-3FGG900C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150T-3FGG900C reliable?
The price and inventory of XC6SLX150T-3FGG900C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150T-3FGG900C is usually 5 days.
3.What payment methods are accepted for XC6SLX150T-3FGG900C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150T-3FGG900C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150T-3FGG900C?
XC6SLX150T-3FGG900C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150T-3FGG900C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150T-3FGG900C?
For technical support, including XC6SLX150T-3FGG900C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150T-3FGG900C requirements.
6.How does Aetrix verify that XC6SLX150T-3FGG900C is sourced from the original manufacturer or authorized distributors?
All XC6SLX150T-3FGG900C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150T-3FGG900C meets industry standards.
7.What is the process for return or replacement of XC6SLX150T-3FGG900C?
All XC6SLX150T-3FGG900C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150T-3FGG900C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150T-3FGG900C part is unused and in its original packaging.
Return procedure for XC6SLX150T-3FGG900C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC6SLX150T-3FGG900C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
