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AMD XC6SLX150T-3FGG900I
- Part No.:
- XC6SLX150T-3FGG900I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA
- Datasheet:
-
XC6SLX150T-3FGG900I.pdf
- Description:
- IC FPGA 540 I/O 900FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,183
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Product details
Overview
XC6SLX150T-3FGG900I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 4,032 Kbits of block RAM, 318 I/O pins, and -3 speed grade operation at industrial temperature range (-40°C to +100°C). It serves as a reconfigurable logic fabric for embedded control, video processing, and communication interface bridging in industrial automation systems.
For engineers reviewing the XC6SLX150T-3FGG900I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, logic density, thermal rating, and support for LVDS, SSTL, and HSTL signaling standards.
Technical Context
The XC6SLX150T-3FGG900I implements a hierarchical FPGA architecture with six-input LUTs, distributed RAM, and dedicated DSP48A1 slices supporting 18×18-bit multiply-accumulate operations. It integrates dual-clock domain management and supports configuration via SPI, BPI, or JTAG interfaces.
It includes 240 SelectIO™ resources with programmable drive strength, slew rate, and on-chip termination, and supports differential standards including LVDS, TMDS, and RSDS. The device uses 45 nm process technology and operates from a 1.2 V core supply.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - determines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 4,032 Kbits - provides on-chip memory for FIFOs, buffers, or lookup tables without external SRAM |
| I/O Pins | 318 - supports high-pin-count interface aggregation (e.g., parallel camera, PCI Express Gen1) |
| Speed Grade | -3 - guarantees timing closure up to 500 MHz system clock in critical paths under worst-case conditions |
| Operating Temp | -40°C to +100°C - enables deployment in industrial enclosures without active cooling |
| Core Voltage | 1.2 V ±3% - requires tight-regulation DC-DC supply; impacts dynamic power and thermal design |
Pinout & Package
XC6SLX150T-3FGG900I is housed in a 900-pin Fine-Pitch Ball Grid Array (FBGA) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. Pin assignment follows Xilinx SP605 reference layout and supports boundary-scan testing per IEEE 1149.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be decoupled with 100 nF + 4.7 µF near package edge |
| K1 | GCLK1 | Global clock input - low-skew routing to all logic regions; supports 500 MHz max frequency |
| R1 | M0 | Configuration mode select - sets boot source (SPI/BPI/JTAG) during power-up reset sequence |
| T1 | INIT_B | Configuration status output - open-drain active-low signal indicating bitstream load completion or error |
| Y2 | PROGRAM_B | Configuration reset input - asynchronous active-low trigger to reload configuration memory |
Key Features
| Feature | Design Value |
|---|---|
| DSP48A1 Slices | 180 units - enable real-time FIR filtering, motor control PWM generation, and FFT computation without external DSP |
| SelectIO™ Technology | Supports 18 I/O standards - allows direct interfacing to DDR2/DDR3 memory, CMOS sensors, and legacy parallel buses |
| Embedded Memory | 4,032 Kbits block RAM + 128 Kbits distributed RAM - eliminates need for external memory in moderate-depth buffering |
| Multi-Boot Support | Two independent bitstreams stored in SPI flash - enables field-upgradable firmware and fail-safe fallback operation |
Applications
| Industrial Motion Control | Video Interface Bridge |
|---|---|
Use Scenario: Real-time closed-loop servo positioning using encoder feedback and PWM output to three-phase inverters. IC Role / Device Role / Timing Role: FPGA fabric executes PID algorithm, generates synchronized PWM waveforms, and manages encoder quadrature decoding. Use Value: XC6SLX150T-3FGG900I delivers deterministic sub-microsecond latency and 318 I/Os for multi-axis coordination without external timing ICs. | Use Scenario: Converting HDMI 1.4a video stream to MIPI D-PHY for display driver integration in medical imaging panels. IC Role / Device Role / Timing Role: XC6SLX150T-3FGG900I implements pixel clock domain crossing, color space conversion, and serializer/deserializer logic. Use Value: XC6SLX150T-3FGG900I supports LVDS and TMDS I/O standards natively, enabling direct connection to both source and sink PHY layers. |
| Communications Backplane | Test Equipment Logic Analyzer |
Use Scenario: Protocol translation between PCIe Gen1 x4 host interface and proprietary 100 Mbps serial backplane links in modular instrumentation racks. IC Role / Device Role / Timing Role: XC6SLX150T-3FGG900I implements PCIe endpoint logic, packet parsing, and custom framing engine. Use Value: XC6SLX150T-3FGG900I provides 318 I/Os and 147K logic cells to handle concurrent protocol stacks and buffer management in single-chip solution. | Use Scenario: Capturing and triggering on 64-channel, 200 MS/s digital signals with deep pattern memory and state-machine-based trigger sequencing. IC Role / Device Role / Timing Role: XC6SLX150T-3FGG900I acts as acquisition controller, sample buffer manager, and trigger engine with deterministic timing. Use Value: XC6SLX150T-3FGG900I's 4,032 Kbits block RAM enables 2 Msample capture depth at full rate without external memory bottleneck. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150T-2FGG900C | Slower -2 speed grade; commercial temperature range (0°C to +85°C) | Not rated for industrial ambient extremes; lower max clock frequency in timing-critical paths | Choose only if operating environment stays within commercial temp range and timing margin exceeds 15% |
| XCVU9P-2FLGA2104I | UltraScale architecture; 2,586K logic cells; 480 I/O; -2 speed grade; industrial temp | Higher gate count and bandwidth suitable for 4K video processing or PCIe Gen3, but higher cost and power | Select when XC6SLX150T-3FGG900I logic or I/O resources are insufficient and migration path to UltraScale is acceptable |
Compared with XC6SLX150T-2FGG900C, the XC6SLX150T-3FGG900I offers guaranteed timing at higher frequencies and extended temperature operation; versus XCVU9P-2FLGA2104I, it provides cost-optimized density for mid-range industrial logic without over-provisioning.
Availability
XC6SLX150T-3FGG900I is available at Aetrix Electronics and suitable for industrial motion control, video interface bridging, and communications backplane applications requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX150T-3FGG900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous acceleration.
The Spartan-6 family was designed for cost-sensitive, high-volume applications demanding reliable performance, low power, and broad I/O flexibility in industrial and embedded systems.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX150T-3FGG900I?
The XC6SLX150T-3FGG900I supports I/O voltages from 1.2 V to 3.3 V across its 12 SelectIO banks. Each bank is independently configurable for standards including LVCMOS, LVTTL, SSTL, HSTL, and differential protocols such as LVDS and TMDS. VCCO per bank must match the selected standard's required voltage level.
Does XC6SLX150T-3FGG900I include built-in configuration memory?
No, XC6SLX150T-3FGG900I does not include on-chip non-volatile configuration memory. It requires external SPI or BPI flash memory for bitstream storage. Configuration occurs on power-up via master SPI or slave parallel modes, and the device supports Multi-Boot for dual-image fallback capability.
What thermal management is recommended for XC6SLX150T-3FGG900I in continuous operation?
For continuous operation at full utilization, XC6SLX150T-3FGG900I requires a 4-layer PCB with internal ground/power planes, ≥4 thermal vias under the package center, and a 25 mm² copper pour connected to ground. Junction temperature must remain ≤100°C; thermal pad on bottom of FGG900 package must be soldered to PCB ground plane.
Can XC6SLX150T-3FGG900I implement a PCIe Gen1 endpoint without external transceivers?
Yes, XC6SLX150T-3FGG900I includes integrated RocketIO GTP transceivers supporting PCIe Gen1 (2.5 Gbps) endpoint functionality. It complies with PCIe Base Specification v1.1 and supports x1, x2, and x4 link widths with integrated encoding/decoding and link training logic.
Is XC6SLX150T-3FGG900I compatible with Xilinx ISE Design Suite 14.7?
Yes, XC6SLX150T-3FGG900I is fully supported in Xilinx ISE Design Suite 14.7, including synthesis, place-and-route, timing analysis, and bitstream generation. It is not supported in Vivado; migration to newer families requires architectural redesign.
XC6SLX150T-3FGG900I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 900-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 540
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FBGA (31x31)
XC6SLX150T-3FGG900I FAQ
1.How can I place an order for XC6SLX150T-3FGG900I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150T-3FGG900I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150T-3FGG900I reliable?
The price and inventory of XC6SLX150T-3FGG900I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150T-3FGG900I is usually 5 days.
3.What payment methods are accepted for XC6SLX150T-3FGG900I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150T-3FGG900I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150T-3FGG900I?
XC6SLX150T-3FGG900I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150T-3FGG900I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150T-3FGG900I?
For technical support, including XC6SLX150T-3FGG900I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150T-3FGG900I requirements.
6.How does Aetrix verify that XC6SLX150T-3FGG900I is sourced from the original manufacturer or authorized distributors?
All XC6SLX150T-3FGG900I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150T-3FGG900I meets industry standards.
7.What is the process for return or replacement of XC6SLX150T-3FGG900I?
All XC6SLX150T-3FGG900I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150T-3FGG900I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150T-3FGG900I part is unused and in its original packaging.
Return procedure for XC6SLX150T-3FGG900I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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