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AMD XC6SLX150T-4FGG484C
- Part No.:
- XC6SLX150T-4FGG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX150T-4FGG484C.pdf
- Description:
- IC FPGA 296 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,813
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Product details
Overview
XC6SLX150T-4FGG484C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 18 Kbit block RAM, 320 DSP48E1 slices, and operates at -4 speed grade with 1.2 V core voltage. It is packaged in a 484-pin Fine-Pitch Ball Grid Array (FBGA) and used in industrial control systems requiring deterministic I/O timing and partial reconfiguration support.
For engineers reviewing the XC6SLX150T-4FGG484C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (348 user I/Os), LVDS-compatible banks, DCI termination support, and JTAG boundary-scan compliance for production testability.
Technical Context
The XC6SLX150T-4FGG484C implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It integrates SelectIO technology supporting SSTL, HSTL, LVCMOS, and LVDS standards across 16 I/O banks.
Configuration is performed via Master Serial mode using external SPI flash or JTAG, with bitstream encryption and CRC error detection enabled. The device includes internal clock management using DCMs (Digital Clock Managers) with phase shifting, frequency synthesis, and duty cycle correction capabilities.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 – determines maximum combinational/sequential logic capacity for RTL implementation |
| User I/O Pins | 348 – supports high-density interface routing with bank-wise voltage assignment |
| Block RAM | 4,794 Kbits – enables on-chip data buffering, FIFOs, and lookup table storage |
| DSP Slices | 320 × DSP48E1 – provides fixed-point multiply-accumulate operations at up to 250 MHz |
| Speed Grade | -4 – guarantees timing closure at worst-case junction temperature (85°C) and 1.2 V ±3% supply |
| I/O Standards | SSTL-2, SSTL-18, HSTL-I, LVCMOS, LVDS – allows direct interfacing with DDR2, memory controllers, and SERDES peripherals |
| Configuration Mode | Master Serial (SPI), JTAG – enables field-upgradable bitstreams and debug access during development |
Pinout & Package
XC6SLX150T-4FGG484C is housed in a 484-ball Fine-Pitch BGA (FGG) package with 23 × 23 mm body size, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. Thermal pad is not present; thermal dissipation relies on PCB copper area and airflow.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 output voltage reference (configurable 1.2–3.3 V) |
| P2 | IO_L1P_T0_0 | Differential input pair (positive) for bank 0, supports LVDS/SSTL |
| R1 | IO_L1N_T0_0 | Differential input pair (negative) for bank 0, matched length required |
| T14 | M0 | Configuration mode select (Master Serial boot) |
| V15 | TCK | JTAG test clock input for boundary-scan and programming |
| V16 | TMS | JTAG test mode select controlling TAP controller state transitions |
| U15 | TDO | JTAG test data output, driven only when TMS/TCK sequence enables output |
| U16 | TDI | JTAG test data input, sampled on rising edge of TCK |
Key Features
| Feature | Design Value |
|---|---|
| DCI (Digitally Controlled Impedance) | On-die series termination (35–60 Ω) eliminates external resistors for source-synchronous interfaces |
| ISERDES/OSERDES | Source-synchronous deserialization up to 1 Gbps per lane, enabling high-speed parallel-to-serial conversion |
| Partial Reconfiguration | Dynamic module swapping without full device reset, reducing system downtime in real-time applications |
| Embedded Block RAM | Configurable as true dual-port RAM, ROM, or shift register, supporting independent read/write clocks |
| Digital Clock Manager (DCM) | Two DCMs per device provide jitter reduction, frequency multiplication/division, and phase alignment for synchronous design |
Applications
| Industrial Motion Control | Automated Test Equipment (ATE) |
|---|---|
Use Scenario: Real-time servo loop execution with sub-microsecond latency and synchronized PWM generation across multiple axes. IC Role / Device Role / Timing Role: FPGA fabric implements closed-loop PID controllers, encoder interface logic, and deterministic I/O timing engine. Use Value: 348 user I/Os enable simultaneous connection to encoders, analog inputs, and isolated digital outputs; DCMs ensure precise clock domain alignment. | Use Scenario: High-speed digital pattern generation and response capture for semiconductor wafer testing. IC Role / Device Role / Timing Role: Configurable logic executes vector-based stimulus generation and pass/fail comparison with nanosecond-level timing resolution. Use Value: ISERDES/OSERDES supports 800 Mbps DDR I/O; 320 DSP48E1 slices accelerate real-time signature analysis algorithms. |
| Medical Imaging Interface | Avionics Data Concentrator |
Use Scenario: Aggregation and preprocessing of multi-channel ultrasound echo data before transmission to host processor. IC Role / Device Role / Timing Role: FPGA acts as a high-bandwidth data concentrator with DMA-controlled memory mapping and burst-mode AXI interface. Use Value: 4,794 Kbits block RAM buffers raw echo frames; LVDS I/O supports low-noise, EMI-resistant sensor interface. | Use Scenario: ARINC 429 and MIL-STD-1553 bus bridging with time-stamped message logging in flight control subsystems. IC Role / Device Role / Timing Role: Protocol engine implementing dual-redundant bus controllers with hardware timestamping and error injection testing. Use Value: Partial reconfiguration allows in-field protocol updates without aircraft ground time; JTAG boundary-scan ensures DO-254 compliance verification. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic acceleration and interface bridging applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150T-3FGG484C | Slower speed grade (-3 vs. -4); lower maximum clock frequency (e.g., 500 MHz vs. 575 MHz for carry chain paths) | Suitable for cost-sensitive designs where timing margin exceeds requirements | Select when static timing analysis confirms slack ≥1.2× target frequency; reduces power by ~8% at same voltage |
| XCVU9P-L2FLGA2104E | Versal ACAP architecture; includes ARM Cortex-A72 cores, AI Engines, and hardened PCIe 4.0; 2104-pin FLGA package | Targeted at heterogeneous compute, AI inference, and high-throughput streaming workloads | Choose only when migrating from Spartan-6 to scalable SoC platform with software-defined logic + processing |
Compared with XC6SLX150T-4FGG484C, the -3 variant trades performance margin for cost and power efficiency, while the XCVU9P represents a generational architecture shift-requiring full RTL and toolchain migration-not a drop-in replacement.
Availability
XC6SLX150T-4FGG484C is available at Aetrix Electronics and suitable for industrial motion control, automated test equipment, and medical imaging systems requiring stable component supply over extended product lifecycles.
Supply support for XC6SLX150T-4FGG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for data center, aerospace, and industrial applications.
The Spartan-6 family-including XC6SLX150T-4FGG484C-was designed for cost-optimized, high-volume embedded systems requiring reliable I/O flexibility, low-power operation, and long-term manufacturability.
FAQ
What is the maximum operating junction temperature for XC6SLX150T-4FGG484C?
The XC6SLX150T-4FGG484C has a maximum operating junction temperature of +85°C, validated under worst-case voltage (1.2 V ±3%) and speed grade (-4) conditions. Thermal design must maintain this limit using PCB copper pour, airflow, and ambient temperature control. The device includes on-die temperature sensors accessible via JTAG for runtime monitoring in the XC6SLX150T-4FGG484C.
Does XC6SLX150T-4FGG484C support configuration via JTAG only?
No, XC6SLX150T-4FGG484C supports multiple configuration modes including Master Serial (via SPI flash), Slave Serial, SelectMAP, and JTAG. JTAG is used for programming, debugging, and boundary-scan testing but does not replace persistent configuration storage. The XC6SLX150T-4FGG484C requires external non-volatile memory for automatic boot unless configured exclusively through JTAG in-system.
Can XC6SLX150T-4FGG484C interface directly with DDR2 SDRAM?
Yes, XC6SLX150T-4FGG484C supports DDR2 SDRAM interfaces using its SelectIO banks configured for SSTL-18 I/O standard and calibrated delay elements. The device includes dedicated DQS capture logic and phase-aligned clocking via DCMs. Proper board layout and timing constraints must be applied in the XC6SLX150T-4FGG484C design to meet JEDEC DDR2 specifications.
Is partial reconfiguration supported on XC6SLX150T-4FGG484C without external tools?
Partial reconfiguration is supported on XC6SLX150T-4FGG484C but requires Xilinx ISE Design Suite 14.7 or later with PlanAhead implementation tools. Bitstream partitioning, module boundary definition, and dynamic loading logic must be explicitly designed. The XC6SLX150T-4FGG484C does not auto-enable this feature-it depends on correct HDL coding, constraint setup, and runtime controller firmware.
What I/O standards are supported in Bank 16 of XC6SLX150T-4FGG484C?
Bank 16 of XC6SLX150T-4FGG484C supports LVCMOS, LVTTL, SSTL-2, SSTL-18, and HSTL-I standards, with VCCO configurable between 1.2 V and 3.3 V. It does not support differential standards like LVDS or RSDS in this bank. Configuration is controlled by the VCCO_16 supply and IOSTANDARD attribute in the XC6SLX150T-4FGG484C UCF or XDC file.
XC6SLX150T-4FGG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 296
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX150T-4FGG484C FAQ
1.How can I place an order for XC6SLX150T-4FGG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150T-4FGG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150T-4FGG484C reliable?
The price and inventory of XC6SLX150T-4FGG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150T-4FGG484C is usually 5 days.
3.What payment methods are accepted for XC6SLX150T-4FGG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150T-4FGG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150T-4FGG484C?
XC6SLX150T-4FGG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150T-4FGG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150T-4FGG484C?
For technical support, including XC6SLX150T-4FGG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150T-4FGG484C requirements.
6.How does Aetrix verify that XC6SLX150T-4FGG484C is sourced from the original manufacturer or authorized distributors?
All XC6SLX150T-4FGG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150T-4FGG484C meets industry standards.
7.What is the process for return or replacement of XC6SLX150T-4FGG484C?
All XC6SLX150T-4FGG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150T-4FGG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150T-4FGG484C part is unused and in its original packaging.
Return procedure for XC6SLX150T-4FGG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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