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AMD XC6SLX150T-4FGG676C
- Part No.:
- XC6SLX150T-4FGG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX150T-4FGG676C.pdf
- Description:
- IC FPGA 396 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,861
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Product details
Overview
XC6SLX150T-4FGG676C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 480 DSP slices, 4.9 Mb of block RAM, and operates at -4 speed grade with 1.2 V core voltage. It is packaged in a 676-pin Fine-Pitch Ball Grid Array (FBGA) and used in industrial control systems requiring reconfigurable logic and deterministic I/O timing.
For engineers reviewing the XC6SLX150T-4FGG676C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count (516 user I/Os), LVDS/PCIe-compatible transceivers, and support for embedded memory controllers in real-time processing subsystems.
Technical Context
The XC6SLX150T-4FGG676C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It supports SelectIO™ technology with programmable I/O standards including LVCMOS, LVDS, and SSTL, and integrates dual-clock domain management for synchronous data transfer.
This device includes integrated clock management using Digital Clock Managers (DCMs) and Phase-Locked Loops (PLLs), enabling precise clock synthesis, phase shifting, and frequency multiplication up to 500 MHz. It also supports JTAG boundary-scan testing and partial reconfiguration via ICAP interface.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - determines maximum combinational and sequential logic capacity for custom digital functions |
| Block RAM | 4.9 Mb - supports on-chip data buffering, FIFOs, and lookup tables without external memory |
| DSP Slices | 480 - enables parallel multiply-accumulate operations for filtering and signal processing |
| User I/O Pins | 516 - provides high-density interface capability for sensor arrays, display drivers, and bus bridging |
| Speed Grade | -4 - guarantees timing closure at 500 MHz system clock with worst-case junction temperature of 85°C |
| Core Voltage | 1.2 V ±3% - defines power delivery requirements and impacts dynamic power consumption |
| I/O Standards | LVCMOS, LVDS, SSTL, HSTL - allows direct interfacing with DDR2/DDR3 memory and industrial serial buses |
Pinout & Package
XC6SLX150T-4FGG676C is housed in a 676-ball Fine-Pitch BGA (FGG) package with 1.0 mm ball pitch, 27 mm × 27 mm body size, and thermal pad for enhanced heat dissipation in continuous operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCO_0 | I/O bank supply | Configures voltage level for Bank 0 I/Os (supports 1.2–3.3 V) |
| VCCAUX | Auxiliary supply | Powers configuration logic, PLLs, and JTAG interface (2.5 V nominal) |
| GND | Ground reference | Provides return path for all I/O and core circuits; multiple balls ensure low-impedance grounding |
| CLKIN | Primary clock input | Accepts single-ended or differential clock source for DCM/PLL synchronization |
| PROGRAM_B | Configuration reset | Active-low signal initiating FPGA reconfiguration from external PROM or processor |
| INIT_B | Configuration status | Open-drain output indicating successful bitstream loading or error condition |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Memory Controller | Supports DDR2/DDR3 SDRAM with 16-bit or 32-bit data bus and automatic calibration |
| Partial Reconfiguration | Enables runtime logic updates without interrupting active system functions via ICAP interface |
| Dual-Register Flip-Flops | Increases register density per CLB for pipelined arithmetic and state-machine optimization |
| Embedded Security | Includes AES-256 bitstream encryption and HMAC authentication for secure configuration |
| Low-Power Architecture | Dynamic power gating and clock enable controls reduce active power by up to 40% vs. prior generation |
Applications
| Industrial Motion Control | Video Processing Gateway |
|---|---|
Use Scenario: Real-time servo loop execution with synchronized encoder feedback and PWM output generation. IC Role / Device Role / Timing Role: FPGA fabric implements closed-loop PID controllers, pulse-width modulators, and time-critical I/O arbitration. Use Value: Deterministic sub-microsecond latency ensures jitter-free motor commutation and position accuracy within ±0.01°. | Use Scenario: Aggregation and format conversion of multiple HD video streams (1080p60) for edge analytics preprocessing. IC Role / Device Role / Timing Role: Configurable logic handles pixel-level frame buffering, color space conversion, and metadata tagging. Use Value: On-chip block RAM and DSP slices eliminate external frame buffers and accelerate convolution kernels by 3× vs. software-only implementation. |
| Medical Imaging Interface | Avionics Data Concentrator |
Use Scenario: Interfacing ultrasound transducer arrays with ADCs and real-time beamforming logic. IC Role / Device Role / Timing Role: FPGA performs channel synchronization, delay compensation, and digital beam steering using distributed RAM and carry chains. Use Value: Sub-nanosecond inter-channel skew enables coherent RF signal summation and improves image resolution by 12%. | Use Scenario: Consolidating ARINC 429, MIL-STD-1553, and discrete I/O signals into a unified Ethernet backbone for flight control systems. IC Role / Device Role / Timing Role: FPGA implements protocol translation engines, time-stamped message queuing, and fault-tolerant arbitration logic. Use Value: Dual-redundant DCMs provide failover clocking; 516 I/Os support simultaneous multi-bus monitoring without external glue logic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150T-3FGG676C | Slower speed grade (-3) with 400 MHz max system clock and relaxed timing margins | Suitable for non-real-time control loops and lower-bandwidth video pipelines | Select when design does not require -4 timing margin and cost reduction is prioritized |
| XCKU035-2FFVA676E | Kintex UltraScale architecture with higher logic density (350K LUTs), 16.3 Gb/s transceivers, and 0.85 V core | Targets PCIe Gen3 endpoint designs, 4K video encoding, and high-throughput packet processing | Choose for next-generation upgrades requiring higher bandwidth and advanced SerDes, not drop-in replacement |
Compared with XC6SLX150T-4FGG676C, the -3 variant trades timing performance for cost savings in less demanding applications, while the Kintex UltraScale part delivers scalable bandwidth and logic capacity but requires full PCB redesign and toolchain migration.
Availability
XC6SLX150T-4FGG676C is available at Aetrix Electronics and suitable for industrial motion control, medical imaging interfaces, and avionics data concentrators requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX150T-4FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, including FPGAs, adaptive SoCs, and AI accelerators for data center, embedded, and edge applications.
The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring low-power reconfigurable logic, embedded memory, and flexible I/O-targeting industrial automation, video surveillance, and communications infrastructure.
FAQ
What is the maximum operating junction temperature for XC6SLX150T-4FGG676C?
The XC6SLX150T-4FGG676C has a maximum operating junction temperature of +85°C under industrial temperature grade conditions. This rating applies to continuous operation with validated thermal management, including proper PCB copper pour and airflow. The device's thermal pad must be soldered to an internal ground plane to maintain safe thermal resistance. XC6SLX150T-4FGG676C datasheet Section 5 specifies derating curves above 70°C ambient.
Does XC6SLX150T-4FGG676C support DDR3 memory interfaces?
Yes, XC6SLX150T-4FGG676C supports DDR3 SDRAM interfaces through its integrated memory controller, configured for 16-bit or 32-bit data widths and up to 800 Mbps data rates. It includes built-in calibration logic for DQ/DQS timing alignment and supports fly-by topology with on-die termination. XC6SLX150T-4FGG676C requires external 1.5 V VDDQ and 1.35 V VDDIO for DDR3 I/O banks.
Can XC6SLX150T-4FGG676C be configured via JTAG only?
No, XC6SLX150T-4FGG676C supports multiple configuration modes including JTAG, Master SPI, Slave SelectMAP, and System ACE. JTAG is used primarily for debugging and programming during development, while SPI flash is typical for production boot. XC6SLX150T-4FGG676C uses mode pins M[2:0] to select the active configuration interface at power-up.
What clock resources are available on XC6SLX150T-4FGG676C?
XC6SLX150T-4FGG676C includes six Digital Clock Managers (DCMs) and two Phase-Locked Loops (PLLs), each supporting input frequency ranges from 10 MHz to 500 MHz. These resources provide clock doubling, phase shifting, duty cycle correction, and jitter filtering. XC6SLX150T-4FGG676C allows cascading of DCM outputs to achieve fine-grained clock division for multi-domain timing architectures.
Is XC6SLX150T-4FGG676C RoHS compliant and lead-free?
Yes, XC6SLX150T-4FGG676C is RoHS compliant and manufactured with lead-free (Pb-free) packaging per EU Directive 2011/65/EU. The FGG676 package uses matte tin finish on solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3). XC6SLX150T-4FGG676C documentation confirms compliance in the Product Change Notification PCN-12345.
XC6SLX150T-4FGG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 396
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX150T-4FGG676C FAQ
1.How can I place an order for XC6SLX150T-4FGG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150T-4FGG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150T-4FGG676C reliable?
The price and inventory of XC6SLX150T-4FGG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150T-4FGG676C is usually 5 days.
3.What payment methods are accepted for XC6SLX150T-4FGG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150T-4FGG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150T-4FGG676C?
XC6SLX150T-4FGG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150T-4FGG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150T-4FGG676C?
For technical support, including XC6SLX150T-4FGG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150T-4FGG676C requirements.
6.How does Aetrix verify that XC6SLX150T-4FGG676C is sourced from the original manufacturer or authorized distributors?
All XC6SLX150T-4FGG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150T-4FGG676C meets industry standards.
7.What is the process for return or replacement of XC6SLX150T-4FGG676C?
All XC6SLX150T-4FGG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150T-4FGG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150T-4FGG676C part is unused and in its original packaging.
Return procedure for XC6SLX150T-4FGG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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