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AMD XC6SLX150T-N3CSG484C
- Part No.:
- XC6SLX150T-N3CSG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-FBGA, CSPBGA
- Datasheet:
-
XC6SLX150T-N3CSG484C.pdf
- Description:
- IC FPGA 296 I/O 484CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,133
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Product details
Overview
XC6SLX150T-N3CSG484C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 576 DSP48A1 slices, 4.9 Mb of total block RAM, 240 user I/Os, and operates at -3 speed grade with commercial temperature range (0°C to 85°C). It serves as a reconfigurable logic fabric for high-throughput digital signal processing in industrial vision systems.
For engineers reviewing the XC6SLX150T-N3CSG484C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, logic density, embedded memory capacity, DSP resource availability, and commercial-grade thermal performance.
Technical Context
The XC6SLX150T-N3CSG484C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It supports multi-standard I/O interfaces including LVCMOS, LVTTL, SSTL, HSTL, and differential standards such as LVDS and TMDS.
It integrates dual-register flip-flops per slice, six-input LUTs, and supports JTAG boundary-scan (IEEE 1149.1) and SelectMAP configuration. Configuration is performed via SPI serial flash or master/slave parallel modes using the internal configuration controller.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - determines maximum combinational/sequential logic capacity for custom digital functions |
| DSP Slices | 576 × DSP48A1 - enables parallel multiply-accumulate operations for FIR filters and FFT engines |
| Block RAM | 4.9 Mb - supports large on-chip data buffering, FIFOs, and lookup tables without external memory |
| User I/Os | 240 - provides interface flexibility across multiple peripheral buses and sensor links |
| Speed Grade | -3 - guarantees timing closure up to 667 MHz I/O toggle rate and 500 MHz system clock in worst-case commercial conditions |
| Operating Temp | 0°C to +85°C - validated for use in non-automotive industrial enclosures without forced cooling |
| Package | CSG484 - 484-pin CspBGA with 1.0 mm pitch, optimized for thermal dissipation and board-level reliability |
Pinout & Package
XC6SLX150T-N3CSG484C is housed in a 484-pin Chip Scale Ball Grid Array (CSG484) package with 1.0 mm ball pitch, 23 × 23 array, and exposed thermal pad. The package supports JEDEC-standard reflow profiles and meets IPC/JEDEC J-STD-020 moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND / VCCO | Power supply reference and I/O bank voltage | Each of 12 I/O banks has independent VCCO pins enabling mixed-voltage interface support (1.2V–3.3V) |
| VCCAUX | Auxiliary supply for configuration and analog circuitry | Must be regulated to 2.5V ±5%; powers internal configuration logic and PLLs |
| CONFIG_IO | Configuration mode selection | Pull-up/pull-down defines boot source (SPI, BPI, or SelectMAP) during power-on reset |
| CCLK | Configuration clock input | Drives internal configuration state machine; max frequency 50 MHz for slave parallel mode |
| DONE | Configuration status indicator | Open-drain output asserted high when bitstream loading completes and device enters user mode |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PLLs | Two digital clock managers (DCMs) and two phase-locked loops (PLLs) enable precise clock synthesis, jitter reduction, and dynamic phase shifting |
| SelectIO Technology | Supports 18 I/O standards with programmable drive strength, slew rate, and on-die termination for signal integrity optimization |
| Embedded Memory | 4.9 Mb of block RAM plus distributed RAM allows implementation of dual-port memories and true dual-clock FIFOs |
| Configurable Logic | 147,443 logic cells with six-input LUTs and dual flip-flops per slice deliver high logic utilization efficiency |
| Security Features | Bitstream encryption using AES-256 and HMAC-SHA-256 prevents unauthorized configuration and cloning |
Applications
| Industrial Machine Vision | Programmable Logic Controller (PLC) |
|---|---|
Use Scenario: Real-time image preprocessing and feature extraction on high-speed camera feeds in factory automation lines. IC Role / Device Role / Timing Role: Reconfigurable logic fabric executing pixel-level filtering, edge detection, and ROI masking pipelines. Use Value: 576 DSP48A1 slices accelerate convolution kernels; 240 I/Os interface directly to CMOS image sensors and GigE Vision PHYs. | Use Scenario: Deterministic control logic execution with sub-millisecond scan cycle times in modular PLC backplanes. IC Role / Device Role / Timing Role: Core logic engine implementing ladder logic, motion control algorithms, and fieldbus protocol stacks (e.g., EtherCAT slave). Use Value: 147,443 logic cells accommodate complex sequential control states; -3 speed grade ensures timing closure under worst-case temperature drift. |
| Medical Imaging Interface | Test & Measurement Equipment |
Use Scenario: High-fidelity data acquisition and real-time waveform conditioning in ultrasound front-end modules. IC Role / Device Role / Timing Role: Digital backend processor synchronizing ADC sampling, applying digital beamforming coefficients, and packing data for PCIe transfer. Use Value: 4.9 Mb block RAM buffers full-frame echo data; LVDS I/O supports low-noise, high-speed connections to 12-bit, 80 MSPS ADCs. | Use Scenario: Flexible pattern generation and response analysis in automated test equipment for semiconductor wafer probing. IC Role / Device Role / Timing Role: Programmable stimulus generator and comparator core supporting multi-channel parallel test vectors. Use Value: 240 user I/Os enable simultaneous control of 48 DUT channels; SelectIO supports mixed-voltage signaling for legacy and modern DUT interfaces. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-3FGG484C | Same logic resources and I/O count, but uses FGG484 (Fine-Pitch BGA) package with 0.8 mm pitch and no thermal pad | Limited thermal headroom in sustained high-activity operation; unsuitable for sealed enclosures without airflow | Prefer XC6SLX150T-N3CSG484C where thermal management is constrained and long-term reliability under ambient temperature cycling is required |
| XC7A100T-2CSG324C | Artix-7 successor with 101,440 logic cells, higher DSP count (240 DSP48E1), and lower static power, but requires different toolchain (Vivado vs ISE) | Not pin-compatible; migration requires PCB redesign and HDL re-synthesis due to architectural differences and I/O banking changes | Consider XC7A100T-2CSG324C only for new designs targeting lower power and future-proof tool support; XC6SLX150T-N3CSG484C remains optimal for ISE-based maintenance and legacy system upgrades |
Compared with XC6SLX150-3FGG484C, XC6SLX150T-N3CSG484C delivers superior thermal performance and mechanical robustness via its CSG484 package; compared with XC7A100T-2CSG324C, it offers proven ISE design continuity and drop-in replacement capability within existing Spartan-6 hardware platforms.
Availability
XC6SLX150T-N3CSG484C is available at Aetrix Electronics and suitable for industrial machine vision, programmable logic controllers, and medical imaging interface designs requiring stable component supply and long-term production support.
Supply support for XC6SLX150T-N3CSG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and related software tools.
The Spartan-6 family was originally designed by Xilinx for cost-sensitive, high-volume applications demanding balanced logic density, I/O flexibility, and low-power operation in industrial and embedded systems.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX150T-N3CSG484C?
XC6SLX150T-N3CSG484C supports I/O standards from 1.2 V to 3.3 V across its 12 independently powered I/O banks. Each bank's VCCO must be set to match the target interface voltage, and configurations like LVDS require dedicated differential pairs with proper termination. The device does not support 5 V-tolerant I/Os, and all inputs must remain within the absolute maximum ratings specified in the Spartan-6 DC and Switching Characteristics datasheet.
Does XC6SLX150T-N3CSG484C include built-in configuration memory?
No, XC6SLX150T-N3CSG484C does not include on-chip non-volatile configuration memory. It relies on external serial flash (e.g., SPI PROM) or parallel PROM for bitstream storage. Configuration is loaded at power-up via Master SPI, Slave SelectMAP, or JTAG. The internal configuration logic is volatile and requires re-initialization after each power cycle.
Can XC6SLX150T-N3CSG484C operate in extended temperature ranges?
No, XC6SLX150T-N3CSG484C is rated only for commercial temperature range (0°C to +85°C). It is not qualified for industrial (−40°C to +100°C) or automotive grades. Operation outside this range may result in timing violations, configuration loss, or permanent damage. For extended temperature applications, consider the XC6SLX150T-3FGG484I or XC6SLX150-3FGG484I variants, which are explicitly characterized and screened for industrial conditions.
What configuration modes are supported by XC6SLX150T-N3CSG484C?
XC6SLX150T-N3CSG484C supports four primary configuration modes: Master SPI, Slave SPI, Slave SelectMAP (parallel), and JTAG. Mode selection is controlled by the CONFIG_IO pins at power-on. Master SPI is most common for compact designs using serial flash; Slave SelectMAP enables fast parallel loading from microcontrollers or FPGAs acting as masters. JTAG is used for debugging and programming during development.
Is bitstream encryption available on XC6SLX150T-N3CSG484C?
Yes, XC6SLX150T-N3CSG484C supports AES-256 bitstream encryption and HMAC-SHA-256 authentication. Encryption keys are stored in on-chip battery-backed RAM or external eFUSE, and decryption occurs transparently during configuration. This feature protects intellectual property against reverse engineering and unauthorized duplication of the programmed logic design.
XC6SLX150T-N3CSG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 484-FBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 296
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-CSPBGA (19x19)
XC6SLX150T-N3CSG484C FAQ
1.How can I place an order for XC6SLX150T-N3CSG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150T-N3CSG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150T-N3CSG484C reliable?
The price and inventory of XC6SLX150T-N3CSG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150T-N3CSG484C is usually 5 days.
3.What payment methods are accepted for XC6SLX150T-N3CSG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150T-N3CSG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150T-N3CSG484C?
XC6SLX150T-N3CSG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150T-N3CSG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150T-N3CSG484C?
For technical support, including XC6SLX150T-N3CSG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150T-N3CSG484C requirements.
6.How does Aetrix verify that XC6SLX150T-N3CSG484C is sourced from the original manufacturer or authorized distributors?
All XC6SLX150T-N3CSG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150T-N3CSG484C meets industry standards.
7.What is the process for return or replacement of XC6SLX150T-N3CSG484C?
All XC6SLX150T-N3CSG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150T-N3CSG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150T-N3CSG484C part is unused and in its original packaging.
Return procedure for XC6SLX150T-N3CSG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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