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AMD XC6SLX150T-N3FG484I

Part No.:
XC6SLX150T-N3FG484I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
484-BBGA
Datasheet:
AetrixXC6SLX150T-N3FG484I.pdf
Description:
IC FPGA 296 I/O 484FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,794

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Product details

Overview

XC6SLX150T-N3FG484I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 180 DSP48A1 slices, 4.9 Mb of total block RAM, and operates at -3 speed grade with industrial temperature range (–40°C to +100°C). It is packaged in a 484-pin Fine-Pitch BGA (FG484) and used in industrial motor control systems requiring deterministic I/O timing and multi-protocol interface support.

For engineers reviewing the XC6SLX150T-N3FG484I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (348 user I/Os), LVDS-capable banks, embedded memory depth, and compatibility with Xilinx ISE Design Suite v14.7 for synthesis and place-and-route.

Technical Context

The XC6SLX150T-N3FG484I implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It integrates six clock management tiles (CMTs), each containing a DCM and PLL for internal clock synthesis and jitter reduction.

I/O banks support multiple standards including LVCMOS, LVTTL, PCI, and LVDS (1.8 V and 2.5 V), with programmable slew rate and drive strength per bank. Configuration is performed via Master SelectMAP, Slave SelectMAP, or JTAG interfaces using external SPI flash or PROM.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells147,443 - determines maximum combinational/sequential logic capacity for HDL implementation
DSP Slices180 × DSP48A1 - supports fixed-point multiply-accumulate operations up to 25×18-bit per slice
Block RAM4.9 Mb - configurable as 18 Kb or 36 Kb blocks for FIFO, buffer, or lookup table storage
User I/O Pins348 - supports parallel bus interfaces, multi-channel ADC/DAC, and high-speed serial protocols
Speed Grade-3 - guarantees timing closure at 500 MHz system clock with worst-case industrial temperature derating
Operating Temp–40°C to +100°C - qualified for extended industrial environments without forced cooling
PackageFG484 - 23×23 mm fine-pitch BGA with 0.8 mm pitch, compatible with standard reflow profiles

Pinout & Package

XC6SLX150T-N3FG484I is housed in a 484-pin Fine-Pitch Ball Grid Array (FG484) package with 348 user-configurable I/Os distributed across 12 I/O banks. Each bank supports independent voltage referencing and I/O standard assignment.

Pin/TerminalCircuit RoleDesign Meaning
G1CONFIG_IO_0 / INIT_BActive-low configuration initialization signal; must be pulled high during power-up to enable normal startup
H2PROGRAM_BAsynchronous reset for configuration logic; toggling reloads bitstream from external PROM
K1CCLKConfiguration clock input; driven by FPGA during Master SelectMAP mode or external source in Slave mode
M1DONEOpen-drain status output indicating successful configuration completion and I/O release
P1IO_L0N_0Bank 0 differential I/O pair; supports LVDS, TMDS, or RSDS signaling with internal termination

Key Features

FeatureDesign Value
Embedded Memory4.9 Mb block RAM enables dual-port FIFOs and large coefficient buffers without external memory
DSP48A1 Slices180 slices deliver 2.7 GMAC/s peak throughput for real-time filtering and motor vector control
Multi-Standard I/OPer-bank voltage and standard selection allows mixed-voltage interfaces (e.g., 3.3 V CPU + 1.8 V sensor bus)
Clock ManagementSix CMTs provide independent clock domain generation, phase shifting, and frequency synthesis for multi-clock systems
Configuration SecurityBitstream encryption via AES-256 prevents unauthorized cloning or reverse engineering of design IP

Applications

Industrial Motor ControlProgrammable Logic Controller (PLC)

Use Scenario: Real-time field-oriented control (FOC) of three-phase AC induction motors with encoder feedback and PWM generation.

IC Role / Device Role / Timing Role: FPGA acts as deterministic servo controller with sub-microsecond I/O response and synchronized PWM edge placement.

Use Value: Enables closed-loop torque control at 20 kHz switching frequency while hosting communication stacks (Modbus RTU, EtherCAT slave) in same device.

Use Scenario: Modular I/O expansion and logic execution in DIN-rail mounted PLC chassis with hot-swap capability.

IC Role / Device Role / Timing Role: Configurable logic fabric replaces fixed-function ASICs, supporting custom ladder logic scan cycles and analog channel calibration firmware.

Use Value: Reduces bill-of-materials by integrating 32-channel digital I/O, 8-channel 16-bit ADC interface, and CAN 2.0B controller into single XC6SLX150T-N3FG484I.

Video Surveillance EncoderTest & Measurement Equipment

Use Scenario: H.264 video encoding pipeline with MIPI CSI-2 input, motion estimation, and SDI output interface.

IC Role / Device Role / Timing Role: Parallel pixel processing engine with DDR2 memory controller and embedded video timing generators.

Use Value: Achieves 1080p30 encode latency under 8 ms using 128 KB of on-chip BRAM for line buffers and coefficient tables.

Use Scenario: High-precision waveform generation and acquisition in automated test equipment (ATE) with multi-channel synchronization.

IC Role / Device Role / Timing Role: Time-critical pattern generator with jitter < 50 ps RMS and deterministic trigger routing across 16 digital channels.

Use Value: Eliminates external timing ICs by implementing 100 MHz sample clock distribution, delay calibration, and TDC logic within XC6SLX150T-N3FG484I fabric.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based control and interface applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC6SLX150-3FG484INo thermal enhancement; rated for commercial temp (0°C to +85°C) onlyNot suitable for uncooled industrial enclosures or outdoor deploymentsSelect when operating environment remains within commercial temperature range and cost sensitivity outweighs thermal margin
XC6SLX150T-3FGG484ISame specs but RoHS-compliant lead-free finish (FGG484 vs FG484)Required for EU/China export compliance; identical electrical and thermal behaviorChoose FGG484 variant if lead-free assembly process or regulatory certification is mandatory

Compared with XC6SLX150-3FG484I, the XC6SLX150T-N3FG484I provides guaranteed operation at –40°C to +100°C and enhanced thermal resistance; versus XC6SLX150T-3FGG484I, it differs only in surface finish and is not RoHS-compliant, making it suitable for legacy Pb-based soldering processes.

Availability

XC6SLX150T-N3FG484I is available at Aetrix Electronics and suitable for industrial motor control, programmable logic controllers (PLCs), and video surveillance encoder designs requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for XC6SLX150T-N3FG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines.

The Spartan-6 family was originally designed by Xilinx for cost-sensitive, high-volume applications demanding low power, small footprint, and multi-standard I/O - especially in industrial automation and embedded vision.

FAQ

What is the maximum supported I/O standard voltage for XC6SLX150T-N3FG484I?

The XC6SLX150T-N3FG484I supports I/O standards up to 3.3 V in dedicated banks, with individual bank VCCO ranging from 1.2 V to 3.3 V. Bank 0 and Bank 1 support differential standards including LVDS at 1.8 V and 2.5 V, while Bank 12 supports 3.3 V LVTTL and PCI. Voltage selection is per-bank and configured in the UCF or XDC constraints file.

Does XC6SLX150T-N3FG484I support JTAG boundary-scan testing?

Yes, XC6SLX150T-N3FG484I includes IEEE 1149.1-compliant JTAG TAP controller for boundary-scan testing, programming, and debug. The TDO, TDI, TCK, and TMS pins are dedicated and mapped to package balls E3, D2, D1, and E2 respectively. JTAG mode requires no external configuration pins and operates independently of the configuration mode setting.

Can XC6SLX150T-N3FG484I interface directly with DDR2 SDRAM?

Yes, XC6SLX150T-N3FG484I includes a dedicated DDR2 memory controller hard macro supporting data rates up to 400 Mbps (200 MHz clock). It manages command scheduling, read/write leveling, and on-die termination control. Interface requires external 1.8 V DDR2 components and proper PCB layout with matched trace lengths per byte lane.

What configuration modes are supported by XC6SLX150T-N3FG484I?

XC6SLX150T-N3FG484I supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial (SPI flash) configuration modes. Master SelectMAP uses internal oscillator to drive CCLK and load bitstream from external parallel PROM; Serial mode relies on internal SPI controller to read from single- or dual-byte wide SPI flash devices. Mode selection is controlled by MODE pins M0–M2.

Is bitstream encryption available on XC6SLX150T-N3FG484I?

Yes, XC6SLX150T-N3FG484I supports AES-256 bitstream encryption using a 256-bit key stored in on-chip eFUSE. Encryption is enabled during bitstream generation in Xilinx ISE and verified during configuration. Decryption occurs transparently in hardware; no external crypto processor or software stack is required to deploy secure designs using XC6SLX150T-N3FG484I.

XC6SLX150T-N3FG484I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-6 LXT
Package/Case:
484-BBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
11519
Number of Logic Elements/Cells:
147443
Total RAM Bits:
4939776
Number of I/O:
296
Number of Gates:
-
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
484-FBGA (23x23)

XC6SLX150T-N3FG484I FAQ

1.How can I place an order for XC6SLX150T-N3FG484I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC6SLX150T-N3FG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC6SLX150T-N3FG484I reliable?

The price and inventory of XC6SLX150T-N3FG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150T-N3FG484I is usually 5 days.

3.What payment methods are accepted for XC6SLX150T-N3FG484I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150T-N3FG484I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC6SLX150T-N3FG484I?

XC6SLX150T-N3FG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC6SLX150T-N3FG484I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC6SLX150T-N3FG484I?

For technical support, including XC6SLX150T-N3FG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150T-N3FG484I requirements.

6.How does Aetrix verify that XC6SLX150T-N3FG484I is sourced from the original manufacturer or authorized distributors?

All XC6SLX150T-N3FG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150T-N3FG484I meets industry standards.

7.What is the process for return or replacement of XC6SLX150T-N3FG484I?

All XC6SLX150T-N3FG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150T-N3FG484I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC6SLX150T-N3FG484I part is unused and in its original packaging.

Return procedure for XC6SLX150T-N3FG484I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC6SLX150T-N3FG484I Tags

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