AMD XC6SLX150T-N3FG484I
- Part No.:
- XC6SLX150T-N3FG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX150T-N3FG484I.pdf
- Description:
- IC FPGA 296 I/O 484FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,794
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC6SLX150T-N3FG484I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 180 DSP48A1 slices, 4.9 Mb of total block RAM, and operates at -3 speed grade with industrial temperature range (–40°C to +100°C). It is packaged in a 484-pin Fine-Pitch BGA (FG484) and used in industrial motor control systems requiring deterministic I/O timing and multi-protocol interface support.
For engineers reviewing the XC6SLX150T-N3FG484I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (348 user I/Os), LVDS-capable banks, embedded memory depth, and compatibility with Xilinx ISE Design Suite v14.7 for synthesis and place-and-route.
Technical Context
The XC6SLX150T-N3FG484I implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It integrates six clock management tiles (CMTs), each containing a DCM and PLL for internal clock synthesis and jitter reduction.
I/O banks support multiple standards including LVCMOS, LVTTL, PCI, and LVDS (1.8 V and 2.5 V), with programmable slew rate and drive strength per bank. Configuration is performed via Master SelectMAP, Slave SelectMAP, or JTAG interfaces using external SPI flash or PROM.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - determines maximum combinational/sequential logic capacity for HDL implementation |
| DSP Slices | 180 × DSP48A1 - supports fixed-point multiply-accumulate operations up to 25×18-bit per slice |
| Block RAM | 4.9 Mb - configurable as 18 Kb or 36 Kb blocks for FIFO, buffer, or lookup table storage |
| User I/O Pins | 348 - supports parallel bus interfaces, multi-channel ADC/DAC, and high-speed serial protocols |
| Speed Grade | -3 - guarantees timing closure at 500 MHz system clock with worst-case industrial temperature derating |
| Operating Temp | –40°C to +100°C - qualified for extended industrial environments without forced cooling |
| Package | FG484 - 23×23 mm fine-pitch BGA with 0.8 mm pitch, compatible with standard reflow profiles |
Pinout & Package
XC6SLX150T-N3FG484I is housed in a 484-pin Fine-Pitch Ball Grid Array (FG484) package with 348 user-configurable I/Os distributed across 12 I/O banks. Each bank supports independent voltage referencing and I/O standard assignment.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | CONFIG_IO_0 / INIT_B | Active-low configuration initialization signal; must be pulled high during power-up to enable normal startup |
| H2 | PROGRAM_B | Asynchronous reset for configuration logic; toggling reloads bitstream from external PROM |
| K1 | CCLK | Configuration clock input; driven by FPGA during Master SelectMAP mode or external source in Slave mode |
| M1 | DONE | Open-drain status output indicating successful configuration completion and I/O release |
| P1 | IO_L0N_0 | Bank 0 differential I/O pair; supports LVDS, TMDS, or RSDS signaling with internal termination |
Key Features
| Feature | Design Value |
|---|---|
| Embedded Memory | 4.9 Mb block RAM enables dual-port FIFOs and large coefficient buffers without external memory |
| DSP48A1 Slices | 180 slices deliver 2.7 GMAC/s peak throughput for real-time filtering and motor vector control |
| Multi-Standard I/O | Per-bank voltage and standard selection allows mixed-voltage interfaces (e.g., 3.3 V CPU + 1.8 V sensor bus) |
| Clock Management | Six CMTs provide independent clock domain generation, phase shifting, and frequency synthesis for multi-clock systems |
| Configuration Security | Bitstream encryption via AES-256 prevents unauthorized cloning or reverse engineering of design IP |
Applications
| Industrial Motor Control | Programmable Logic Controller (PLC) |
|---|---|
Use Scenario: Real-time field-oriented control (FOC) of three-phase AC induction motors with encoder feedback and PWM generation. IC Role / Device Role / Timing Role: FPGA acts as deterministic servo controller with sub-microsecond I/O response and synchronized PWM edge placement. Use Value: Enables closed-loop torque control at 20 kHz switching frequency while hosting communication stacks (Modbus RTU, EtherCAT slave) in same device. | Use Scenario: Modular I/O expansion and logic execution in DIN-rail mounted PLC chassis with hot-swap capability. IC Role / Device Role / Timing Role: Configurable logic fabric replaces fixed-function ASICs, supporting custom ladder logic scan cycles and analog channel calibration firmware. Use Value: Reduces bill-of-materials by integrating 32-channel digital I/O, 8-channel 16-bit ADC interface, and CAN 2.0B controller into single XC6SLX150T-N3FG484I. |
| Video Surveillance Encoder | Test & Measurement Equipment |
Use Scenario: H.264 video encoding pipeline with MIPI CSI-2 input, motion estimation, and SDI output interface. IC Role / Device Role / Timing Role: Parallel pixel processing engine with DDR2 memory controller and embedded video timing generators. Use Value: Achieves 1080p30 encode latency under 8 ms using 128 KB of on-chip BRAM for line buffers and coefficient tables. | Use Scenario: High-precision waveform generation and acquisition in automated test equipment (ATE) with multi-channel synchronization. IC Role / Device Role / Timing Role: Time-critical pattern generator with jitter < 50 ps RMS and deterministic trigger routing across 16 digital channels. Use Value: Eliminates external timing ICs by implementing 100 MHz sample clock distribution, delay calibration, and TDC logic within XC6SLX150T-N3FG484I fabric. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-3FG484I | No thermal enhancement; rated for commercial temp (0°C to +85°C) only | Not suitable for uncooled industrial enclosures or outdoor deployments | Select when operating environment remains within commercial temperature range and cost sensitivity outweighs thermal margin |
| XC6SLX150T-3FGG484I | Same specs but RoHS-compliant lead-free finish (FGG484 vs FG484) | Required for EU/China export compliance; identical electrical and thermal behavior | Choose FGG484 variant if lead-free assembly process or regulatory certification is mandatory |
Compared with XC6SLX150-3FG484I, the XC6SLX150T-N3FG484I provides guaranteed operation at –40°C to +100°C and enhanced thermal resistance; versus XC6SLX150T-3FGG484I, it differs only in surface finish and is not RoHS-compliant, making it suitable for legacy Pb-based soldering processes.
Availability
XC6SLX150T-N3FG484I is available at Aetrix Electronics and suitable for industrial motor control, programmable logic controllers (PLCs), and video surveillance encoder designs requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for XC6SLX150T-N3FG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines.
The Spartan-6 family was originally designed by Xilinx for cost-sensitive, high-volume applications demanding low power, small footprint, and multi-standard I/O - especially in industrial automation and embedded vision.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX150T-N3FG484I?
The XC6SLX150T-N3FG484I supports I/O standards up to 3.3 V in dedicated banks, with individual bank VCCO ranging from 1.2 V to 3.3 V. Bank 0 and Bank 1 support differential standards including LVDS at 1.8 V and 2.5 V, while Bank 12 supports 3.3 V LVTTL and PCI. Voltage selection is per-bank and configured in the UCF or XDC constraints file.
Does XC6SLX150T-N3FG484I support JTAG boundary-scan testing?
Yes, XC6SLX150T-N3FG484I includes IEEE 1149.1-compliant JTAG TAP controller for boundary-scan testing, programming, and debug. The TDO, TDI, TCK, and TMS pins are dedicated and mapped to package balls E3, D2, D1, and E2 respectively. JTAG mode requires no external configuration pins and operates independently of the configuration mode setting.
Can XC6SLX150T-N3FG484I interface directly with DDR2 SDRAM?
Yes, XC6SLX150T-N3FG484I includes a dedicated DDR2 memory controller hard macro supporting data rates up to 400 Mbps (200 MHz clock). It manages command scheduling, read/write leveling, and on-die termination control. Interface requires external 1.8 V DDR2 components and proper PCB layout with matched trace lengths per byte lane.
What configuration modes are supported by XC6SLX150T-N3FG484I?
XC6SLX150T-N3FG484I supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial (SPI flash) configuration modes. Master SelectMAP uses internal oscillator to drive CCLK and load bitstream from external parallel PROM; Serial mode relies on internal SPI controller to read from single- or dual-byte wide SPI flash devices. Mode selection is controlled by MODE pins M0–M2.
Is bitstream encryption available on XC6SLX150T-N3FG484I?
Yes, XC6SLX150T-N3FG484I supports AES-256 bitstream encryption using a 256-bit key stored in on-chip eFUSE. Encryption is enabled during bitstream generation in Xilinx ISE and verified during configuration. Decryption occurs transparently in hardware; no external crypto processor or software stack is required to deploy secure designs using XC6SLX150T-N3FG484I.
XC6SLX150T-N3FG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 296
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX150T-N3FG484I FAQ
1.How can I place an order for XC6SLX150T-N3FG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150T-N3FG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150T-N3FG484I reliable?
The price and inventory of XC6SLX150T-N3FG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150T-N3FG484I is usually 5 days.
3.What payment methods are accepted for XC6SLX150T-N3FG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150T-N3FG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150T-N3FG484I?
XC6SLX150T-N3FG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150T-N3FG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150T-N3FG484I?
For technical support, including XC6SLX150T-N3FG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150T-N3FG484I requirements.
6.How does Aetrix verify that XC6SLX150T-N3FG484I is sourced from the original manufacturer or authorized distributors?
All XC6SLX150T-N3FG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150T-N3FG484I meets industry standards.
7.What is the process for return or replacement of XC6SLX150T-N3FG484I?
All XC6SLX150T-N3FG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150T-N3FG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150T-N3FG484I part is unused and in its original packaging.
Return procedure for XC6SLX150T-N3FG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC6SLX150T-N3FG484I Tags

-
ICE40LP384-SG32
Lattice Semiconductor Corporation

-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation

-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation

-
10M02DCV36C8G
Intel

-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation

-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation

-
ICE40LP1K-CM36
Lattice Semiconductor Corporation

-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation

-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

