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AMD XC6SLX150T-N3FG676C
- Part No.:
- XC6SLX150T-N3FG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX150T-N3FG676C.pdf
- Description:
- IC FPGA 396 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,926
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Product details
Overview
XC6SLX150T-N3FG676C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 576 DSP48E1 slices, 4.9 Mb of total block RAM, and operates at -3 speed grade with commercial temperature range (0°C to 85°C). It is used in industrial video processing, programmable logic control, and embedded vision systems requiring deterministic timing and I/O flexibility.
For engineers reviewing the XC6SLX150T-N3FG676C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (480 user I/Os), LVDS-capable banks, single-ended signaling support, and compatibility with Spartan-6 system-level design flows including ISE Design Suite integration.
Technical Context
The XC6SLX150T-N3FG676C implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It integrates six CMT clock management tiles-each containing two DCMs and one PLL-for multi-domain clock synthesis and phase alignment.
I/O banks are organized into eight groups supporting selectable standards including LVCMOS, LVTTL, SSTL, HSTL, and differential standards such as LVDS and TMDS. Each bank has independent VCCO and VREF settings, enabling mixed-voltage interface operation across 480 user-accessible pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - provides gate count equivalent to ~915K ASIC gates for complex sequential and combinatorial logic implementation |
| DSP Slices | 576 × DSP48E1 - enables parallel multiply-accumulate operations at up to 250 MHz for filtering and math-intensive algorithms |
| Block RAM | 4.9 Mb - supports dual-port memory configurations up to 36 Kb per block for FIFOs, buffers, and lookup tables |
| User I/O Pins | 480 - allows high-density peripheral interfacing with bank-wise voltage and standard flexibility |
| Speed Grade | -3 - guarantees timing closure at maximum specified frequencies for critical paths in commercial-temperature operation |
| Package | FG676 - 676-pin Fine-Pitch Ball Grid Array with 1.0 mm pitch, 27×27 array, and 35 mm × 35 mm body size |
| Temperature Range | 0°C to +85°C - qualified for industrial ambient environments without extended thermal derating |
Pinout & Package
XC6SLX150T-N3FG676C is housed in a 676-ball FBGA (Fine-Pitch BGA) package with 1.0 mm ball pitch, 27×27 ball array, and 35 mm × 35 mm footprint. The package supports thermal dissipation via exposed thermal pad (EP) and is RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | VCCO_0 | Output bank 0 power supply - sets I/O voltage level (1.2–3.3 V) for pins in Bank 0 |
| H19 | VREF_0 | Reference voltage for input receivers in Bank 0 - required for SSTL/HSTL termination calibration |
| K20 | CLKIN_1 | Dedicated global clock input - feeds Clock Management Tile 1 for low-jitter clock distribution |
| M21 | PROGRAM_B | Active-low configuration initiation - triggers reconfiguration from external source or fallback mode |
| R22 | INIT_B | Open-drain status indicator - signals configuration memory readiness during startup |
| T23 | CCLK | Configuration clock output - drives external PROM or master SPI interface during slave serial mode |
Key Features
| Feature | Design Value |
|---|---|
| Multi-standard I/O banks | Eight independently powered banks support LVCMOS, LVTTL, SSTL-2/3, HSTL-I/II, and differential LVDS/TMDS simultaneously |
| Dedicated clock resources | Six CMTs (each with two DCMs + one PLL) enable jitter reduction, frequency synthesis, and phase shifting across multiple domains |
| Configurable logic blocks | 6-input LUTs with optional distributed RAM and shift register modes increase functional density and routing efficiency |
| Embedded memory | 18 Kb block RAMs with true dual-port, byte-write enable, and ECC option support reliable data buffering and storage |
| PCI Express® endpoint support | Integrated hard IP for PCIe Gen1 x1/x2/x4 links - reduces soft-core overhead and ensures protocol compliance |
Applications
| Industrial Motion Control | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time servo loop coordination across multiple axes using encoder feedback and PWM outputs. IC Role / Device Role / Timing Role: FPGA fabric executes closed-loop PID control logic with sub-microsecond latency and synchronized I/O timing. Use Value: Deterministic timing from dedicated clock networks and 480 I/Os enable simultaneous acquisition and actuation without CPU bottlenecks. | Use Scenario: Aggregation and preprocessing of multi-channel ultrasound or endoscope sensor data before transmission to host processor. IC Role / Device Role / Timing Role: XC6SLX150T-N3FG676C acts as a high-bandwidth data concentrator with parallel LVDS input capture and on-chip frame buffering. Use Value: 576 DSP48E1 slices accelerate real-time beamforming; 4.9 Mb block RAM supports line-based image buffering with zero external memory dependency. |
| Video Surveillance Encoder | Programmable Logic Controller (PLC) |
Use Scenario: HD video encoding pipeline integrating sensor interface, motion detection, and H.264 compression acceleration. IC Role / Device Role / Timing Role: Configurable logic implements pixel-level preprocessing; DSP slices handle discrete cosine transform and quantization stages. Use Value: LVDS-capable I/O banks interface directly with CMOS image sensors; -3 speed grade ensures timing margin for 720p60 real-time encoding. | Use Scenario: Replacement of fixed-function relay logic in factory automation with field-upgradable control sequences. IC Role / Device Role / Timing Role: XC6SLX150T-N3FG676C serves as deterministic state-machine engine with cycle-accurate I/O response and watchdog supervision. Use Value: 147,443 logic cells accommodate large ladder logic translations; commercial-grade thermal rating supports panel-mount enclosure operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150T-3FG676I | Same logic capacity and I/O count, but -3I speed grade rated for industrial temperature (-40°C to +100°C) | Required for extended-temperature deployments such as outdoor infrastructure or under-hood automotive subsystems | Select when operating outside 0°C–85°C range; otherwise identical functionality and pinout |
| XC7A200T-2FBG676C | Artix-7 architecture with higher logic density (215,360 LUTs), 2.5x more DSP slices, and native PCIe Gen2 support | Used where higher throughput, lower power per function, or Gen2 protocol compliance is mandatory | Choose for new designs needing scalability; not drop-in due to different configuration, power, and toolchain requirements |
Compared with XC6SLX150T-N3FG676C, the -3I variant extends thermal reliability without logic or I/O change, while the Artix-7 XC7A200T offers architectural upgrades at the cost of migration effort and revised board layout.
Availability
XC6SLX150T-N3FG676C is available at Aetrix Electronics and suitable for industrial motion control, medical imaging interface, and video surveillance encoder applications requiring stable component supply and long-term manufacturing continuity.
Supply support for XC6SLX150T-N3FG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software-defined hardware solutions.
The Spartan-6 family was designed for cost-sensitive, high-volume applications demanding low-power logic implementation, flexible I/O, and seamless integration with legacy microprocessor and analog subsystems.
FAQ
What is the configuration method supported by XC6SLX150T-N3FG676C?
XC6SLX150T-N3FG676C supports Master Serial, Slave Serial, Slave Parallel, and JTAG configuration modes. It uses external SPI flash or PROM for bitstream storage and can be reconfigured in-system via JTAG or processor-controlled GPIO. The XC6SLX150T-N3FG676C requires a valid bitstream to initialize its logic fabric, I/O states, and clock resources before functional operation.
Does XC6SLX150T-N3FG676C support DDR3 memory interfaces?
Yes, XC6SLX150T-N3FG676C supports DDR3 SDRAM interfaces through its I/O banks configured for SSTL15 standards and calibrated using internal VREF. It requires external PHY logic implemented in fabric or third-party IP, as no hardened DDR3 controller is integrated. The XC6SLX150T-N3FG676C achieves reliable 800 Mbps data rates with proper PCB layout and timing constraints.
What development tools are compatible with XC6SLX150T-N3FG676C?
XC6SLX150T-N3FG676C is fully supported by Xilinx ISE Design Suite 14.7, including synthesis, implementation, and bitstream generation. It is not supported by Vivado. The XC6SLX150T-N3FG676C requires ISE-specific device files and license keys; newer tools lack native flow compatibility or timing models for Spartan-6 architecture.
Is XC6SLX150T-N3FG676C RoHS compliant and lead-free?
Yes, XC6SLX150T-N3FG676C is RoHS-compliant and manufactured with lead-free (Pb-free) packaging. The FG676 package uses matte tin finish on solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements. The XC6SLX150T-N3FG676C is suitable for lead-free reflow processes with peak temperatures up to 260°C.
Can XC6SLX150T-N3FG676C operate with a single 1.2 V supply?
No, XC6SLX150T-N3FG676C requires three distinct supply rails: VCCINT (1.2 V core), VCCAUX (2.5 V auxiliary), and VCCO (1.2–3.3 V I/O). Each rail powers separate internal domains and must be sequenced during power-up. The XC6SLX150T-N3FG676C will not configure or function correctly if any required supply is missing or out-of-spec.
XC6SLX150T-N3FG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 396
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX150T-N3FG676C FAQ
1.How can I place an order for XC6SLX150T-N3FG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150T-N3FG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150T-N3FG676C reliable?
The price and inventory of XC6SLX150T-N3FG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150T-N3FG676C is usually 5 days.
3.What payment methods are accepted for XC6SLX150T-N3FG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150T-N3FG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150T-N3FG676C?
XC6SLX150T-N3FG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150T-N3FG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150T-N3FG676C?
For technical support, including XC6SLX150T-N3FG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150T-N3FG676C requirements.
6.How does Aetrix verify that XC6SLX150T-N3FG676C is sourced from the original manufacturer or authorized distributors?
All XC6SLX150T-N3FG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150T-N3FG676C meets industry standards.
7.What is the process for return or replacement of XC6SLX150T-N3FG676C?
All XC6SLX150T-N3FG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150T-N3FG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150T-N3FG676C part is unused and in its original packaging.
Return procedure for XC6SLX150T-N3FG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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