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AMD XC6SLX150T-N3FG900C
- Part No.:
- XC6SLX150T-N3FG900C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA
- Datasheet:
-
XC6SLX150T-N3FG900C.pdf
- Description:
- IC FPGA 540 I/O 900FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,901
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Product details
Overview
XC6SLX150T-N3FG900C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 4,729 Kbits of block RAM, 576 DSP48E1 slices, and operates at -3 speed grade with industrial temperature range (–40°C to +85°C). It is used in high-throughput industrial imaging systems requiring real-time pixel processing and deterministic I/O timing.
For engineers reviewing the XC6SLX150T-N3FG900C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O bank voltage flexibility (1.2V/1.8V/2.5V/3.3V), LVDS support across 48 differential pairs, and integrated PCI Express® Endpoint v1.1 capability.
Technical Context
The XC6SLX150T-N3FG900C implements a hierarchical FPGA architecture with six I/O banks supporting independent VCCO and VREF per bank, enabling mixed-voltage system interfacing. It integrates dual 10-bit ADCs for on-chip monitoring and supports SelectIO™ standards including SSTL, HSTL, LVCMOS, and LVDS.
Configuration is performed via Master SPI or JTAG, with bitstream encryption supported through AES-256. The device includes dedicated clock management tiles with DCMs (Digital Clock Managers) and PLLs for jitter reduction and frequency synthesis up to 500 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - provides gate count equivalent to ~915,000 ASIC gates for complex control and datapath logic |
| Block RAM | 4,729 Kbits - supports dual-port memory configurations up to 36 Kb per block for FIFOs and frame buffers |
| DSP Slices | 576 × DSP48E1 - enables parallel multiply-accumulate operations at 250 MHz for filtering and FFT acceleration |
| I/O Pins | 544 user I/O - distributed across 6 banks with programmable drive strength and slew rate control |
| Speed Grade | -3 - guarantees timing closure at maximum operating frequencies defined in Spartan-6 data sheet tables |
| Operating Temp | –40°C to +85°C - qualified for industrial environments without derating |
| PCIe Support | Endpoint v1.1 - integrated hard IP for x1 lane configuration with integrated PHY and transaction layer |
Pinout & Package
The XC6SLX150T-N3FG900C is housed in a 900-pin Fine-Pitch Ball Grid Array (FBGA) package with 35×35 mm body size and 1.0 mm ball pitch. Pin assignment follows Xilinx UG382 v1.11 (Spartan-6 FPGA Packaging and Pinout Specifications).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock | Input clock for Master SPI configuration mode; must be stable before INIT_B assertion |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading and startup sequence completion |
| INIT_B | Configuration Initialization | Active-low input that resets configuration logic and forces reinitialization when asserted |
| M0–M2 | Mode Selection | Three-pin bus defining configuration mode (e.g., Master SPI, Slave SelectMAP, JTAG) |
| VRN/VRP | Diff I/O Reference | Differential pair for internal reference voltage generation in LVDS and differential signaling modes |
Key Features
| Feature | Design Value |
|---|---|
| Integrated ADC | Dual 10-bit, 1 MSPS on-chip ADCs for thermal/voltage monitoring without external sensors |
| SelectIO™ Technology | Supports 18 I/O standards including LVDS, SSTL-2, HSTL-I, and LVCMOS with programmable termination |
| Dedicated Clock Resources | Four DCMs and two PLLs per device for low-jitter clock synthesis and phase alignment |
| PCIe Hard IP | Integrated endpoint block compliant with PCI Express Base Specification v1.1 (2.5 GT/s) |
| AES Bitstream Encryption | 256-bit AES key storage in on-chip battery-backed RAM for secure configuration loading |
Applications
| Industrial Machine Vision | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time preprocessing of high-resolution CMOS sensor streams in automated optical inspection systems. IC Role / Device Role / Timing Role: FPGA fabric performs pixel-level filtering, histogram equalization, and ROI extraction with sub-microsecond latency. Use Value: 576 DSP48E1 slices enable concurrent 2D convolution kernels; 544 I/O pins route parallel camera interfaces and DDR2 memory buses. | Use Scenario: Interfacing ultrasound transducer arrays to digital beamforming processors in portable diagnostic equipment. IC Role / Device Role / Timing Role: XC6SLX150T-N3FG900C acts as a high-speed serializer/deserializer bridge between analog front-end and FPGA-based beamformer. Use Value: LVDS I/O support ensures noise-immune transmission of 16-bit echo data at 100 MSPS across 48 differential pairs. |
| Programmable Logic Controller | Avionics Data Acquisition |
Use Scenario: Deterministic I/O scanning and motion control loop execution in modular PLC backplanes. IC Role / Device Role / Timing Role: Configurable logic implements multi-axis interpolation, safety interlock monitoring, and EtherCAT slave protocol stack. Use Value: Six independent I/O banks allow simultaneous connection to 24V DC inputs, 24V relay outputs, and 3.3V communication peripherals. | Use Scenario: Sensor fusion hub collecting ARINC 429, discrete I/O, and analog transducer signals in UAV flight control units. IC Role / Device Role / Timing Role: XC6SLX150T-N3FG900C serves as time-synchronized acquisition engine with deterministic timestamping of all input channels. Use Value: Industrial temperature rating (–40°C to +85°C) and integrated ADCs enable operation in uncontrolled avionics bays without external thermal compensation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-3FG900C | No integrated ADC; same logic resources, I/O count, and PCIe hard IP; commercial temp range (0°C to +85°C) | Suitable for cost-sensitive non-monitoring applications where on-die thermal sensing is unnecessary | Select XC6SLX150-3FG900C only if industrial temperature qualification and ADC functionality are not required. |
| XCVU9P-2FLGA2104I | Virtex UltraScale+ device with 1,182,240 LUTs, 64.2 Mb BRAM, and PCIe Gen3 x16; larger footprint and higher power | Targeted at next-generation radar processing and AI inference where XC6SLX150T-N3FG900C lacks compute density | Choose XCVU9P-2FLGA2104I only when migrating beyond Spartan-6 scalability limits with full Gen3 PCIe and hardened AI engines. |
Compared with XC6SLX150-3FG900C, the XC6SLX150T-N3FG900C adds industrial temp rating and dual ADCs at identical logic/I/O capacity; versus XCVU9P-2FLGA2104I, it offers lower cost and power but lacks Gen3 PCIe and AI acceleration, making it optimal for deterministic industrial edge nodes.
Availability
XC6SLX150T-N3FG900C is available at Aetrix Electronics and suitable for industrial machine vision, medical imaging interface, and avionics data acquisition requiring stable component supply over extended production lifecycles.
Supply support for XC6SLX150T-N3FG900C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous acceleration.
The Spartan-6 family was designed for cost-sensitive, high-volume applications demanding low-power logic fabric, flexible I/O, and integrated connectivity-targeting industrial control, video processing, and embedded vision.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX150T-N3FG900C?
The XC6SLX150T-N3FG900C supports I/O bank voltages of 1.2V, 1.8V, 2.5V, and 3.3V simultaneously across its six independent I/O banks. Each bank has dedicated VCCO and VREF pins, allowing mixed-voltage operation without level shifters. This capability is confirmed in Xilinx DS162 (Spartan-6 FPGA Electrical Characteristics) Table 10.
Does XC6SLX150T-N3FG900C include hardware-accelerated PCIe functionality?
Yes, the XC6SLX150T-N3FG900C integrates a hard PCIe Endpoint v1.1 block supporting x1 lane configuration at 2.5 GT/s. It includes a physical layer (PHY), data link layer, and transaction layer, eliminating the need for soft-core PCIe implementations. This is documented in Xilinx UG380 (Spartan-6 FPGA Configuration User Guide) Chapter 7.
How many differential I/O pairs does XC6SLX150T-N3FG900C support?
The XC6SLX150T-N3FG900C supports 48 differential I/O pairs, each capable of LVDS, RSDS, or BLVDS signaling. These are distributed across I/O banks 0–3 and require proper termination and routing per Xilinx UG382 guidelines. All 48 pairs are usable concurrently under timing constraints defined in the speed grade –3 specification.
Is XC6SLX150T-N3FG900C compatible with JTAG boundary-scan testing?
Yes, XC6SLX150T-N3FG900C fully supports IEEE 1149.1 JTAG boundary-scan testing via TCK, TMS, TDI, TDO, and TRST pins. The device implements a 4-state JTAG controller and supports INTEST, EXTEST, SAMPLE/PRELOAD, and BYPASS instructions as specified in Xilinx UG380 Section 3.4.
What configuration modes are supported by XC6SLX150T-N3FG900C?
The XC6SLX150T-N3FG900C supports Master SPI, Slave Serial, Slave Parallel, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Master SPI is most common for single-device systems, while JTAG is used for debugging and programming during development.
XC6SLX150T-N3FG900C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 900-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 540
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FBGA (31x31)
XC6SLX150T-N3FG900C FAQ
1.How can I place an order for XC6SLX150T-N3FG900C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150T-N3FG900C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150T-N3FG900C reliable?
The price and inventory of XC6SLX150T-N3FG900C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150T-N3FG900C is usually 5 days.
3.What payment methods are accepted for XC6SLX150T-N3FG900C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150T-N3FG900C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150T-N3FG900C?
XC6SLX150T-N3FG900C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150T-N3FG900C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150T-N3FG900C?
For technical support, including XC6SLX150T-N3FG900C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150T-N3FG900C requirements.
6.How does Aetrix verify that XC6SLX150T-N3FG900C is sourced from the original manufacturer or authorized distributors?
All XC6SLX150T-N3FG900C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150T-N3FG900C meets industry standards.
7.What is the process for return or replacement of XC6SLX150T-N3FG900C?
All XC6SLX150T-N3FG900C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150T-N3FG900C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150T-N3FG900C part is unused and in its original packaging.
Return procedure for XC6SLX150T-N3FG900C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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