AMD XC6SLX150T-N3FGG484C

Overview

XC6SLX150T-N3FGG484C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 484-pin Fine-Pitch Ball Grid Array (FBGA) package, -3 speed grade, and industrial temperature range (–40°C to +85°C). It integrates block RAM, DSP48E1 slices, and SelectIO™ technology for high-speed I/O interfacing in embedded vision and industrial control systems.

For engineers reviewing the XC6SLX150T-N3FGG484C datasheet, pinout, applications, or equivalent options, key selection criteria include logic capacity, I/O count (348 user I/Os), LVDS/PCIe-compatible signaling support, and compatibility with Xilinx ISE Design Suite v14.7 for synthesis and implementation.

Technical Context

The XC6SLX150T-N3FGG484C implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated routing for clock networks and global reset. It supports multi-standard I/O banks operating at 1.2V to 3.3V, including LVCMOS, LVDS, and SSTL interfaces.

It includes 1,824 Kbits of total block RAM, 216 DSP48E1 slices for arithmetic-intensive tasks, and integrated configuration logic supporting Master SPI, Slave Serial, and JTAG modes. Configuration bitstream security is supported via AES encryption.

Key Specifications

Pinout & Package

XC6SLX150T-N3FGG484C is housed in a 484-ball Fine-Pitch BGA (FGG) package with 23×23 mm body size, 1.0 mm ball pitch, and standard thermal pad layout. Pin assignment follows Xilinx UG382 v1.11 (Spartan-6 FPGA Packaging and Pinout).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC6SLX150-3FGG484C, the XC6SLX150T-N3FGG484C adds industrial temperature qualification and enhanced screening, while compared with XC7A100T-2CSG324C it retains ISE compatibility and proven field reliability in long-lifecycle deployments.

Availability

XC6SLX150T-N3FGG484C is available at Aetrix Electronics and suitable for industrial automation, avionics data concentrators, machine vision preprocessing, and test equipment pattern generation requiring stable component supply across extended product lifecycles.

Supply support for XC6SLX150T-N3FGG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for high-performance embedded and datacenter applications.

The Spartan-6 family was originally designed by Xilinx for cost-sensitive, high-volume applications demanding low power, small footprint, and seamless integration with legacy microcontrollers and analog peripherals.

FAQ

What is the maximum I/O standard supported by XC6SLX150T-N3FGG484C?

The XC6SLX150T-N3FGG484C supports LVDS, RSDS, BLVDS, TMDS, and SSTL-18/25 across its 12 I/O banks. Each bank operates independently at VCCO voltages from 1.2V to 3.3V, enabling mixed-signaling interfaces without external translators. Differential standards achieve up to 1,050 Mbps per lane under -3 speed grade conditions.

Does XC6SLX150T-N3FGG484C require external configuration memory?

Yes, the XC6SLX150T-N3FGG484C requires external non-volatile memory (typically SPI flash) to store its configuration bitstream. It supports Master SPI mode for autonomous boot and can load the bitstream directly from a 4-Mbit or larger SPI PROM upon power-up or PROGRAM_B assertion.

Is XC6SLX150T-N3FGG484C compatible with Xilinx Vivado Design Suite?

No, XC6SLX150T-N3FGG484C is not supported in Vivado. It is fully supported only in Xilinx ISE Design Suite v14.7, which provides synthesis, implementation, and bitstream generation tools specifically validated for Spartan-6 architecture. Migration to Vivado requires architectural redesign using Artix-7 or newer families.

What thermal management is recommended for XC6SLX150T-N3FGG484C in continuous operation?

For continuous operation at full utilization, XC6SLX150T-N3FGG484C should be mounted on a 4-layer PCB with internal ground/power planes and ≥2 oz copper. A 25 mm² exposed thermal pad beneath the package must be soldered to a solid copper pour connected to ≥4 thermal vias. Ambient temperature must remain ≤+85°C with ≤1.5 W typical power dissipation.

Can XC6SLX150T-N3FGG484C implement PCIe endpoint functionality?

No, XC6SLX150T-N3FGG484C does not include hard PCIe blocks. While soft-core PCIe endpoints can be implemented using logic resources and SelectIO, they lack official Xilinx certification, do not guarantee Gen1 compliance, and consume significant LUTs and I/O. For certified PCIe, Spartan-6 LX150T requires external PHY or migration to Virtex-6 or later families.