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AMD XC6SLX150T-N3FGG484I
- Part No.:
- XC6SLX150T-N3FGG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX150T-N3FGG484I.pdf
- Description:
- IC FPGA 296 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,084
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Product details
Overview
XC6SLX150T-N3FGG484I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 18-bit × 36Kb block RAM, and embedded 18 × 18 multipliers. It operates at -3 speed grade with industrial temperature range (–40°C to +100°C) and uses a 484-pin Fine-Pitch Ball Grid Array (FBGA) package. It is used in industrial motor control and real-time video processing systems.
For engineers reviewing the XC6SLX150T-N3FGG484I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (348 user I/Os), differential signaling support (LVDS, TMDS), configuration interface options (SPI, SelectMAP), and DCI termination capability for signal integrity in high-speed PCB layouts.
Technical Context
The XC6SLX150T-N3FGG484I implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated routing for clock networks including global and regional buffers. It integrates 18 × 18 signed/unsigned multipliers and supports DDR2/DDR3 memory interfaces up to 800 Mbps data rate.
Configuration is performed via Master SPI or Slave SelectMAP mode using external flash or processor. Internal configuration memory is SRAM-based and requires reprogramming on power-up; bitstream security includes optional AES encryption and HMAC authentication.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - total available LUT+FF pairs for combinational and sequential logic implementation |
| User I/O Pins | 348 - configurable single-ended or differential I/Os supporting multiple voltage standards |
| Block RAM | 3,168 Kbits - distributed as 18-kbit blocks usable as dual-port RAM or FIFO buffers |
| Multipliers | 186 × 18 × 18 - hard IP for arithmetic-intensive tasks like filtering or FFT computation |
| Speed Grade | -3 - guarantees timing closure up to specified maximum frequencies under industrial temperature conditions |
| Operating Temp | –40°C to +100°C - qualified for extended industrial environments without derating |
| Configuration Mode | Master SPI / Slave SelectMAP - enables flexible boot sources including serial flash or host processor |
Pinout & Package
XC6SLX150T-N3FGG484I is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 23 × 23 array, 1.0 mm ball pitch, and standard JEDEC MO-252AC footprint. Thermal pad is exposed on underside for enhanced heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 output voltage supply - sets logic level for associated pins (1.2V/1.35V/1.5V/1.8V/2.5V/3.3V) |
| P2 | CCLK | Configuration clock input - drives internal configuration shift register during SPI or SelectMAP loading |
| R1 | DONE | Open-drain status output - goes high when configuration completes successfully and device enters user mode |
| T1 | INIT_B | Active-low open-drain initialization indicator - pulled low during configuration error or reset |
| Y2 | M0/M1/M2 | Mode select inputs - determine configuration source (SPI, BPI, SelectMAP, JTAG) at power-on reset |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated DSP Slices | 186 hard 18 × 18 multipliers with pre-adder and accumulator - reduce latency and resource usage in math-heavy designs |
| DCI (Digital Controlled Impedance) | On-die series/parallel termination matching 40–60 Ω - eliminates external resistors and improves signal integrity on high-speed traces |
| Memory Interface Support | Hardened PHY for DDR2/DDR3 up to 800 Mbps - simplifies timing-critical memory controller implementation |
| AES Bitstream Encryption | 128-bit AES key storage in eFUSE - prevents unauthorized readback and cloning of programmed logic |
| Low-Power Architecture | Multiple power domains (VCCINT, VCCAUX, VCCO) with independent regulation - enables selective power gating per I/O bank or logic region |
Applications
| Industrial Motor Control | Real-Time Video Processing |
|---|---|
Use Scenario: Closed-loop servo drive with field-oriented control (FOC) and encoder feedback. IC Role / Device Role / Timing Role: Real-time logic engine executing PWM generation, current loop control, and safety monitoring within <1 µs latency budget. Use Value: 348 user I/Os enable direct connection to gate drivers, ADCs, and encoders; DCI ensures clean PWM edge integrity across PCB traces. | Use Scenario: HD video frame capture, de-interlacing, and HDMI output in broadcast equipment. IC Role / Device Role / Timing Role: Video pipeline accelerator handling pixel-level operations, color space conversion, and timing synchronization. Use Value: Embedded 18 × 18 multipliers accelerate motion estimation; LVDS I/O supports 720p/1080p parallel sensor interfaces at 75 MHz. |
| Programmable Logic Controller (PLC) | Medical Imaging Interface |
Use Scenario: Modular PLC backplane with hot-swap I/O modules and deterministic cyclic execution. IC Role / Device Role / Timing Role: Central logic coordinator managing EtherCAT slave communication, digital I/O expansion, and watchdog supervision. Use Value: Industrial temp rating (–40°C to +100°C) ensures reliability in cabinet-mounted controllers; SPI configuration enables secure firmware updates. | Use Scenario: Ultrasound beamforming interface between analog front-end and digital processing unit. IC Role / Device Role / Timing Role: High-precision time-aligned data aggregator synchronizing 64-channel ADC samples with sub-nanosecond skew. Use Value: Dedicated clock networks and phase-matched I/O delay chains maintain channel coherence; block RAM buffers absorb burst ADC data. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150T-3FGG484C | Commercial temperature grade (0°C to +85°C); identical logic resources and I/O count | Limited to controlled indoor environments; not rated for thermal cycling or extended ambient exposure | Select only if operating environment remains within commercial spec and cost sensitivity outweighs industrial reliability needs |
| XCKU035-2FFVA676I | Kintex UltraScale architecture; higher logic density (215K LUTs), 16.3 Gbps transceivers, and DDR4 support | Targets next-gen systems requiring PCIe Gen3, 10G Ethernet, or high-bandwidth memory; significantly higher power and cost | Choose when migrating beyond Spartan-6 performance ceiling - requires new PCB layout, toolchain upgrade, and power delivery redesign |
Compared with XC6SLX150T-N3FGG484I, the XC6SLX150T-3FGG484C offers identical functionality at lower cost but lacks industrial temperature qualification, while the XCKU035-2FFVA676I delivers scalable bandwidth and integration at the expense of design complexity and bill-of-materials cost.
Availability
XC6SLX150T-N3FGG484I is available at Aetrix Electronics and suitable for industrial motor control, real-time video processing, and programmable logic controller (PLC) applications requiring stable component supply across long production lifecycles.
Supply support for XC6SLX150T-N3FGG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.
The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring reliable logic density, low static power, and mature process technology - targeting industrial automation, vision systems, and communications infrastructure.
FAQ
What is the configuration method supported by XC6SLX150T-N3FGG484I?
The XC6SLX150T-N3FGG484I supports Master SPI, Slave SelectMAP, JTAG, and boundary-scan configuration modes. Master SPI uses an internal oscillator to clock external serial flash, while Slave SelectMAP allows a host processor to load the bitstream via parallel bus. The XC6SLX150T-N3FGG484I requires external non-volatile memory for persistent configuration unless reprogrammed externally at each power cycle.
Does XC6SLX150T-N3FGG484I support DDR3 memory interfaces?
Yes, XC6SLX150T-N3FGG484I supports DDR3 SDRAM interfaces up to 800 Mbps data rate using its hardened memory controller logic and I/O banks configured for SSTL15. It requires external termination resistors and careful PCB layout for impedance control, but does not integrate a full DDR3 PHY with built-in training algorithms like newer families.
What is the purpose of the INIT_B pin on XC6SLX150T-N3FGG484I?
The INIT_B pin on XC6SLX150T-N3FGG484I is an active-low open-drain output that signals configuration status. It is driven low during power-on reset, configuration errors, or CRC failures, and transitions high upon successful bitstream loading and startup sequence completion. External circuitry can monitor INIT_B to trigger system-level fault recovery or diagnostic logging for the XC6SLX150T-N3FGG484I.
Can XC6SLX150T-N3FGG484I operate in environments above +85°C?
Yes, XC6SLX150T-N3FGG484I is rated for industrial temperature operation from –40°C to +100°C. Its -N3 speed grade is fully characterized across this range, and timing analysis must use the industrial-grade timing models. Derating is not required, and thermal management should ensure junction temperature stays within limits using the specified thermal resistance and board copper area for the FGG484 package.
Is XC6SLX150T-N3FGG484I pin-compatible with other Spartan-6 devices?
No, XC6SLX150T-N3FGG484I is not universally pin-compatible across all Spartan-6 variants. While it shares the FGG484 package with some smaller members (e.g., XC6SLX9, XC6SLX16), I/O bank assignments, voltage requirements, and dedicated function pin locations differ. Pin compatibility must be verified per specific variant using the official Xilinx Spartan-6 Pinout Files - the XC6SLX150T-N3FGG484I has unique ball assignments for its 348 user I/Os and dedicated configuration pins.
XC6SLX150T-N3FGG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 296
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX150T-N3FGG484I FAQ
1.How can I place an order for XC6SLX150T-N3FGG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150T-N3FGG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150T-N3FGG484I reliable?
The price and inventory of XC6SLX150T-N3FGG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150T-N3FGG484I is usually 5 days.
3.What payment methods are accepted for XC6SLX150T-N3FGG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150T-N3FGG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150T-N3FGG484I?
XC6SLX150T-N3FGG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150T-N3FGG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150T-N3FGG484I?
For technical support, including XC6SLX150T-N3FGG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150T-N3FGG484I requirements.
6.How does Aetrix verify that XC6SLX150T-N3FGG484I is sourced from the original manufacturer or authorized distributors?
All XC6SLX150T-N3FGG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150T-N3FGG484I meets industry standards.
7.What is the process for return or replacement of XC6SLX150T-N3FGG484I?
All XC6SLX150T-N3FGG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150T-N3FGG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150T-N3FGG484I part is unused and in its original packaging.
Return procedure for XC6SLX150T-N3FGG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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