My Inquiry
My Account
AMD XC6SLX150T-N3FGG676C
- Part No.:
- XC6SLX150T-N3FGG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX150T-N3FGG676C.pdf
- Description:
- IC FPGA 396 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,867
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC6SLX150T-N3FGG676C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 18 Kbit block RAM, and 220 I/O pins in a 676-pin Fine-Pitch Flip-Chip BGA (FFG) package. It operates at -3 speed grade with 1.2 V core voltage and supports LVCMOS, LVDS, and SSTL I/O standards for industrial control and embedded vision applications.
For engineers reviewing the XC6SLX150T-N3FGG676C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O voltage flexibility, embedded memory capacity, and thermal performance in compact PCB layouts.
Technical Context
The XC6SLX150T-N3FGG676C implements a configurable logic fabric based on 6-input LUTs and distributed RAM, with dedicated DSP48A1 slices supporting 18×18-bit signed multiplication. It integrates dual 10-bit ADCs for system monitoring and supports SelectIO technology with programmable slew rate and drive strength per bank.
Configuration is performed via Master SPI or JTAG, with support for fallback configuration and bitstream encryption using AES-256. The device includes Clock Management Tiles (CMT) with DCM and PLL blocks for clock synthesis, phase shifting, and frequency multiplication up to 500 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 – determines maximum combinational/sequential logic capacity for HDL implementation |
| Block RAM | 2,192 Kbits (18 Kbit × 122 blocks) – enables on-chip data buffering and FIFO construction |
| I/O Pins | 220 user-configurable – supports multi-bank voltage operation (1.2–3.3 V) with independent bank control |
| Speed Grade | -3 – guarantees timing closure up to 500 MHz system clock with worst-case industrial temperature |
| Core Voltage | 1.2 V ±3% – defines power delivery requirements and impacts dynamic power consumption |
| Package | 676-pin FFG (Fine-Pitch Flip-Chip BGA) – 27×27 mm body, 1.0 mm pitch, RoHS-compliant |
Pinout & Package
XC6SLX150T-N3FGG676C is housed in a 676-pin Fine-Pitch Flip-Chip BGA (FFG) package with 27×27 array, 1.0 mm ball pitch, and thermal pad exposed on underside for enhanced heat dissipation in high-density designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCO_0 | I/O Bank Power | Supplies 1.2–3.3 V to Bank 0 I/Os; must be decoupled locally per Xilinx UG381 |
| VCCAUX | Auxiliary Power | Provides 2.5 V to configuration logic, clock management, and JTAG interface |
| GND | Ground Reference | Multiple dedicated ground balls per quadrant; requires low-inductance connection to PCB ground plane |
| PROGRAM_B | Configuration Control | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration |
| CCLK | Configuration Clock | Drives master SPI configuration clock; frequency ≤ 50 MHz for reliable bitstream loading |
Key Features
| Feature | Design Value |
|---|---|
| Dual 10-bit ADCs | Monitor on-chip temperature and supply voltages without external sensors or routing overhead |
| SelectIO Technology | Per-bank I/O standard selection (LVCMOS/LVDS/SSTL) enables mixed-voltage board interfacing |
| DSP48A1 Slices | 18×18-bit multiplier + 48-bit accumulator per slice supports real-time filtering and math-intensive algorithms |
| DCM + PLL Clock Management | Enables jitter reduction, clock multiplication, and phase alignment across multiple clock domains |
| AES-256 Bitstream Encryption | Prevents reverse engineering and unauthorized cloning of configured logic functionality |
Applications
| Industrial PLC Controllers | Embedded Vision Systems |
|---|---|
Use Scenario: Real-time motion control and I/O expansion in factory automation cabinets with space-constrained enclosures. IC Role / Device Role / Timing Role: Configurable logic fabric executes deterministic ladder logic and handles 220-channel digital I/O with cycle times under 1 ms. Use Value: Eliminates need for multiple ASICs or microcontrollers while maintaining industrial temperature range (-40°C to +100°C). | Use Scenario: High-speed image preprocessing in smart cameras for defect detection on production lines. IC Role / Device Role / Timing Role: Parallel pixel processing pipeline using DSP48A1 slices and block RAM-based line buffers at 60 fps. Use Value: Reduces latency versus software-only solutions and avoids external frame buffer memory. |
| Medical Imaging Interfaces | Test & Measurement Equipment |
Use Scenario: Digital signal conditioning and protocol bridging between ultrasound transducer arrays and host processors. IC Role / Device Role / Timing Role: LVDS receiver frontend synchronizes multi-channel analog-to-digital data streams before packetization. Use Value: Supports 10-bit ADC integration and precise timing alignment across 32+ channels. | Use Scenario: Flexible waveform generation and acquisition control in modular PXI chassis systems. IC Role / Device Role / Timing Role: Generates synchronized trigger signals and captures timestamped analog samples using internal CMT resources. Use Value: Enables sub-nanosecond jitter performance required for high-resolution oscilloscope frontends. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-3FGG676C | No thermal grade suffix; rated for commercial (0°C to +85°C) instead of industrial (-40°C to +100°C) | Suitable for lab-grade or non-harsh-environment test equipment only | Select when ambient operating temperature remains within commercial range and cost sensitivity outweighs extended thermal margin |
| XC7K160T-2FFG676C | Kintex-7 architecture with higher logic density (162,200 LUTs), 2.5× more block RAM, and PCIe Gen2 hard IP | Required for protocols requiring integrated transceivers or >500 MHz system clocks | Choose when migrating legacy Spartan-6 designs to higher bandwidth or adding serial connectivity without external PHYs |
Compared with XC6SLX150-3FGG676C, the XC6SLX150T-N3FGG676C delivers guaranteed operation at extended temperature extremes; versus XC7K160T-2FFG676C, it offers lower power and simpler configuration at the cost of transceiver and advanced clocking capability.
Availability
XC6SLX150T-N3FGG676C is available at Aetrix Electronics and suitable for industrial automation, medical imaging interfaces, and test & measurement equipment requiring stable component supply across extended lifecycle programs.
Supply support for XC6SLX150T-N3FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now leads development of adaptive computing platforms including FPGAs, ACAPs, and SoCs for data center, AI, and embedded markets.
The Spartan-6 family was originally designed by Xilinx for cost-sensitive, high-volume applications demanding low power, small footprint, and flexible I/O - especially in industrial and automotive subsystems.
FAQ
What is the maximum operating junction temperature for XC6SLX150T-N3FGG676C?
The XC6SLX150T-N3FGG676C has a maximum junction temperature of +125°C, validated under industrial temperature conditions (-40°C to +100°C ambient). This rating is specified in Xilinx DS162 and applies to continuous operation with proper PCB thermal design, including use of the exposed thermal pad and recommended copper pour per UG381.
Does XC6SLX150T-N3FGG676C support JTAG boundary-scan testing?
Yes, XC6SLX150T-N3FGG676C fully supports IEEE 1149.1 JTAG boundary-scan testing via TCK, TMS, TDI, and TDO pins. The device implements mandatory boundary-scan instructions (SAMPLE/PRELOAD, EXTEST, IDCODE) and optional ones (BYPASS, HIGHZ), enabling PCB interconnect verification during manufacturing.
Can XC6SLX150T-N3FGG676C be configured using a microcontroller over SPI?
Yes, XC6SLX150T-N3FGG676C supports Master SPI configuration mode, allowing direct bitstream loading from an external microcontroller's SPI interface. Configuration requires correct initialization sequence, CCLK timing compliance (≤50 MHz), and proper PROGRAM_B assertion per UG380 Section 5.3.
What I/O standards are supported on Bank 16 of XC6SLX150T-N3FGG676C?
Bank 16 of XC6SLX150T-N3FGG676C supports LVCMOS18, LVCMOS25, LVCMOS33, and SSTL18_I. These standards are confirmed in the XC6SLX150T pinout file (UG381 Table 1-12) and require corresponding VCCO_16 voltage setting (1.8 V, 2.5 V, or 3.3 V) and termination configuration.
Is XC6SLX150T-N3FGG676C compatible with Xilinx ISE Design Suite 14.7?
Yes, XC6SLX150T-N3FGG676C is fully supported in Xilinx ISE Design Suite 14.7, including synthesis, place-and-route, timing analysis, and bitstream generation. Device files, libraries, and constraint templates for this part are included in ISE 14.7 Service Pack 5 and later.
XC6SLX150T-N3FGG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 396
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX150T-N3FGG676C FAQ
1.How can I place an order for XC6SLX150T-N3FGG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150T-N3FGG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150T-N3FGG676C reliable?
The price and inventory of XC6SLX150T-N3FGG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150T-N3FGG676C is usually 5 days.
3.What payment methods are accepted for XC6SLX150T-N3FGG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150T-N3FGG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150T-N3FGG676C?
XC6SLX150T-N3FGG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150T-N3FGG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150T-N3FGG676C?
For technical support, including XC6SLX150T-N3FGG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150T-N3FGG676C requirements.
6.How does Aetrix verify that XC6SLX150T-N3FGG676C is sourced from the original manufacturer or authorized distributors?
All XC6SLX150T-N3FGG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150T-N3FGG676C meets industry standards.
7.What is the process for return or replacement of XC6SLX150T-N3FGG676C?
All XC6SLX150T-N3FGG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150T-N3FGG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150T-N3FGG676C part is unused and in its original packaging.
Return procedure for XC6SLX150T-N3FGG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC6SLX150T-N3FGG676C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
