AMD XC6SLX150T-N3FGG676I

Overview

XC6SLX150T-N3FGG676I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 5,760 Kbits of block RAM, and support for DDR2/DDR3 memory interfaces. It operates at -3 speed grade with industrial temperature range (-40°C to +100°C) and uses a 676-pin Fine-Pitch BGA (FGG) package. This device serves as a reconfigurable logic fabric in embedded vision and industrial control systems.

For engineers reviewing the XC6SLX150T-N3FGG676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (480 user I/Os), LVDS-capable banks, integrated DSP48A1 slices (180 units), and compliance with JESD78 Class II latch-up immunity.

Technical Context

The XC6SLX150T-N3FGG676I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It integrates 180 DSP48A1 slices for arithmetic-intensive tasks and supports multi-standard I/O including LVCMOS, LVTTL, HSTL, SSTL, and differential standards like LVDS and RSDS.

Configuration is performed via Master SPI, Slave Serial, or JTAG modes using external PROM or processor-controlled interfaces. The device includes internal clock management with DCMs (Digital Clock Managers) supporting frequency synthesis, phase shifting, and duty cycle correction across six independent clock regions.

Key Specifications

Pinout & Package

XC6SLX150T-N3FGG676I is housed in a 676-ball Fine-Pitch BGA (FGG) package with 480 user-configurable I/Os distributed across 12 I/O banks. Power and configuration pins are arranged per Xilinx UG386 v1.11 guidelines.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.

Compared with XC6SLX150-3FGG676I, the XC6SLX150T-N3FGG676I adds guaranteed operation at -40°C to +100°C and enhanced latch-up immunity, making it suitable for harsh environments without design changes. Against XCVU9P-2FLGA2104I, it offers lower power, smaller footprint, and mature toolchain support-but lacks transceivers and advanced memory bandwidth.

Availability

XC6SLX150T-N3FGG676I is available at Aetrix Electronics and suitable for industrial motion control, medical imaging interface, avionics data concentrators, and test & measurement equipment requiring stable component supply over extended product lifecycles.

Supply support for XC6SLX150T-N3FGG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of the Spartan, Artix, Kintex, and Virtex FPGA families.

The Spartan-6 family, including XC6SLX150T-N3FGG676I, was designed for cost-sensitive, high-volume applications demanding low static power, flexible I/O, and proven reliability in industrial and automotive systems.

FAQ

What is the maximum supported DDR3 data rate for XC6SLX150T-N3FGG676I?

The XC6SLX150T-N3FGG676I supports DDR3 interfaces up to 800 Mbps data rate (400 MHz clock) in the -3 speed grade under industrial temperature conditions. This is validated per Xilinx UG388 v1.12 and requires proper board-level termination, layout matching, and VCCO = 1.5V for DDR3 I/O banks. The XC6SLX150T-N3FGG676I achieves this using dedicated source-synchronous capture circuitry and DQS gating logic embedded in its I/O tiles.

Does XC6SLX150T-N3FGG676I include built-in configuration memory?

No, the XC6SLX150T-N3FGG676I does not contain on-chip non-volatile configuration memory. It relies on external configuration sources such as SPI flash (Master SPI mode), microprocessor-controlled parallel loading (Slave Parallel mode), or JTAG programming. Configuration bitstream is loaded into volatile SRAM on power-up, and the XC6SLX150T-N3FGG676I must be reconfigured after each power cycle unless paired with a persistent storage device.

Can XC6SLX150T-N3FGG676I operate with mixed I/O voltage standards on the same bank?

No, XC6SLX150T-N3FGG676I requires all I/Os within a given bank to share the same VCCO voltage, which defines the supported signaling standard. For example, Bank 1 set to VCCO = 1.8V supports SSTL18 but excludes LVCMOS33. Mixing standards like LVDS and HSTL in one bank is prohibited. The XC6SLX150T-N3FGG676I enforces this at configuration time-bitstream generation fails if incompatible standards are assigned to the same bank.

Is XC6SLX150T-N3FGG676I compatible with Vivado Design Suite?

The XC6SLX150T-N3FGG676I is not supported in Xilinx Vivado Design Suite. It requires Xilinx ISE Design Suite 14.7 as the final and fully qualified toolchain. Vivado targets 7-series and newer architectures; ISE remains the only officially supported environment for synthesis, place-and-route, and bitstream generation for the XC6SLX150T-N3FGG676I. Using Vivado with this device will result in unrecognized part errors and failed implementation.

What thermal management guidance applies to XC6SLX150T-N3FGG676I in industrial enclosures?

For continuous operation at +100°C ambient, XC6SLX150T-N3FGG676I requires a PCB with ≥2 oz copper planes, thermal vias under the package, and an exposed pad soldered to inner ground/power layers. Xilinx XPE estimates 2.1 W typical dynamic power at full utilization. The XC6SLX150T-N3FGG676I thermal resistance (θJA) is 12.5°C/W in standard 4-layer board reference design-derating curves in DS162 specify junction temperature limits up to +125°C.