My Inquiry
My Account
AMD XC6SLX150T-N3FGG900C
- Part No.:
- XC6SLX150T-N3FGG900C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA
- Datasheet:
-
XC6SLX150T-N3FGG900C.pdf
- Description:
- IC FPGA 540 I/O 900FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,234
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC6SLX150T-N3FGG900C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 480 DSP48E1 slices, 4.2 MB of total block RAM, and operates at -3 speed grade with industrial temperature range (–40°C to +85°C). It is used in high-throughput industrial imaging systems requiring real-time pixel processing and deterministic I/O timing.
For engineers reviewing the XC6SLX150T-N3FGG900C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (544 user I/Os), LVDS/PCIe-compatible transceivers, and support for DDR2/DDR3 memory interfaces in space-constrained embedded control designs.
Technical Context
The XC6SLX150T-N3FGG900C implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic and shift registers. It integrates six clock management tiles (CMTs), each containing a DCM and PLL for precise clock synthesis and phase alignment across multiple domains.
It supports SelectIO™ technology with programmable I/O standards including LVCMOS, LVDS, SSTL, and HSTL, and includes integrated PCI Express® Endpoint Block (v1.1) supporting x1 and x4 configurations. Configuration is performed via Master SPI, Slave Serial, or JTAG modes using external PROM or processor-controlled loading.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 147,443 - determines maximum combinational/sequential logic capacity for custom datapaths and state machines |
| DSP Slices | 480 × DSP48E1 - enables parallel multiply-accumulate operations for filtering, FFT, and motor control algorithms |
| Block RAM | 4.2 MB - supports dual-port buffering, FIFOs, and lookup tables without external memory |
| User I/O Pins | 544 - provides high-density interface routing for multi-sensor aggregation or display driving |
| Speed Grade | -3 - guarantees timing closure up to 667 MHz I/O toggle rate and 500 MHz internal logic performance |
| Operating Temp | –40°C to +85°C - qualified for deployment in uncontrolled industrial enclosures and outdoor edge nodes |
| PCIe Support | v1.1 x1/x4 - enables direct host CPU communication without bridge ICs in vision capture cards |
Pinout & Package
XC6SLX150T-N3FGG900C is housed in a 900-pin Fine-Pitch Flip-Chip Ball Grid Array (FCBGA) package with 35×35 mm body size, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. The package supports thermal dissipation up to 5.5 W under typical industrial operating conditions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| IO_Lx_y | Configurable I/O bank pin | Supports voltage-selectable I/O standards per bank (1.2V–3.3V), enabling mixed-voltage board interfacing |
| CLK_IN_xx | Dedicated clock input | Direct connection to CMT for low-jitter clock distribution; bypasses general routing for timing-critical paths |
| M0–M2 | Configuration mode select | Determines boot source (SPI, BPI, JTAG); must be hardwired at power-up for reliable initialization |
| CCLK | Configuration clock | Drives internal configuration logic during startup; externally generated or internally derived from CMT |
| INIT_B | Configuration status indicator | Active-low open-drain signal indicating successful bitstream load or configuration error |
| PROGRAM_B | Configuration reset | Active-low signal that clears current configuration and initiates reconfiguration sequence |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PCIe Endpoint | Eliminates need for external PCIe switch or bridge IC in host-connected vision and data acquisition modules |
| Dual-Register I/O Logic | Enables single-cycle I/O register-to-register paths for time-critical sensor sampling and output synchronization |
| Low-Power 45 nm Process | Reduces static power to ≤150 mW at 25°C ambient, critical for fanless industrial controllers |
| ISE Design Suite Support | Full toolchain compatibility with Xilinx ISE 14.7 for legacy design maintenance and certification traceability |
| Multi-Boot Capability | Allows field-upgradable dual-bitstream storage in external SPI flash for fail-safe firmware recovery |
Applications
| Industrial Machine Vision | Programmable Logic Controller (PLC) |
|---|---|
Use Scenario: Real-time inspection of PCB solder joints using line-scan cameras and sub-pixel edge detection. IC Role / Device Role / Timing Role: FPGA fabric performs pixel-level convolution and binarization; CMTs synchronize camera trigger, frame capture, and Ethernet transmit clocks. Use Value: Achieves <10 µs latency from image capture to defect flag assertion, meeting ISO 13849-1 response time requirements. | Use Scenario: Modular I/O expansion unit handling 64-channel analog input, 32-channel digital output, and EtherCAT master interface. IC Role / Device Role / Timing Role: Configurable logic implements cyclic process data mapping; PCIe endpoint connects to ARM-based controller over x1 link. Use Value: Enables deterministic 100 µs cycle times with hardware-timed I/O sampling, eliminating software jitter in safety-critical motion control. |
| Avionics Data Concentrator | Medical Imaging Interface |
Use Scenario: ARINC 429 and MIL-STD-1553B bus bridging in flight control subsystems with DO-254 compliance. IC Role / Device Role / Timing Role: Dedicated protocol engines decode/encode serial avionics streams; block RAM stores message buffers and CRC tables. Use Value: Meets RTCA DO-254 Level A design assurance with fully synthesizable RTL and traceable verification coverage. | Use Scenario: Ultrasound beamformer interface aggregating 128-channel echo data before GPU transfer via PCIe. IC Role / Device Role / Timing Role: High-speed I/O banks capture ADC samples at 80 MSPS; DSP slices perform real-time beam steering delay calculation. Use Value: Delivers 16-bit dynamic range preservation and <5 ns channel-to-channel skew for coherent image reconstruction. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based embedded control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-3FGG900I | Same logic resources and I/O count, but -3I speed grade rated for extended industrial temp (–40°C to +100°C) | Required for operation in high-ambient environments such as engine bay monitoring or solar inverter control cabinets | Select when ambient exceeds +85°C; otherwise XC6SLX150T-N3FGG900C offers identical functionality at lower cost |
| XC7A200T-2FBG676I | Artix-7 architecture: 215K logic cells, 740 DSP slices, higher I/O drive strength, and native PCIe Gen2 x4 support | Suitable for next-generation designs needing higher throughput or Gen2 compatibility, but requires full RTL and pinout redesign | Choose for new designs targeting longer lifecycle and enhanced performance; not drop-in compatible with XC6SLX150T-N3FGG900C |
Compared with XC6SLX150-3FGG900I, the XC6SLX150T-N3FGG900C trades extended temperature margin for cost efficiency in standard industrial settings; compared with XC7A200T-2FBG676I, it offers proven qualification and toolchain stability at the expense of PCIe generation and logic density.
Availability
XC6SLX150T-N3FGG900C is available at Aetrix Electronics and suitable for industrial machine vision, avionics data concentrators, and medical imaging interface designs requiring stable component supply and long-term manufacturing continuity.
Supply support for XC6SLX150T-N3FGG900C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan-6 product family for legacy industrial and aerospace applications requiring long-lifecycle support and DO-254/IEC 61508 qualification.
The Spartan-6 family was designed for cost-sensitive, power-efficient embedded control and interface bridging where predictable timing, mature toolchains, and field-proven reliability outweigh cutting-edge density or bandwidth.
FAQ
What is the maximum supported memory interface speed for XC6SLX150T-N3FGG900C?
The XC6SLX150T-N3FGG900C supports DDR2-800 (400 MHz clock) and DDR3-800 (400 MHz clock) interfaces using its dedicated memory controller logic and I/O banks. Timing closure is guaranteed at -3 speed grade up to 400 MHz data rate with proper PCB layout and termination. External memory bandwidth is limited by the number of available DQ/DQS groups and clock routing constraints within the FCBGA package.
Does XC6SLX150T-N3FGG900C include built-in configuration memory?
No, the XC6SLX150T-N3FGG900C does not include on-chip nonvolatile configuration memory. It requires an external SPI or BPI flash device to store the bitstream. Configuration is loaded at power-up via Master SPI mode by default, though Slave Serial and JTAG modes are also supported for programming and debugging. The INIT_B and PROGRAM_B pins manage configuration state transitions.
Can XC6SLX150T-N3FGG900C operate in a radiation-tolerant environment?
The XC6SLX150T-N3FGG900C is not radiation-hardened or tested for TID, SEE, or ELDRS performance. It is qualified for industrial temperature operation only. For avionics applications requiring radiation tolerance, designers must implement external mitigation techniques (e.g., EDAC, triple modular redundancy, watchdog timers) and perform system-level testing per RTCA DO-160 Section 22. No radiation-specific characterization data is published for XC6SLX150T-N3FGG900C.
What development tools are officially supported for XC6SLX150T-N3FGG900C?
Xilinx ISE Design Suite 14.7 is the final and fully supported toolchain for XC6SLX150T-N3FGG900C. Vivado does not support Spartan-6 devices. ISE provides synthesis, implementation, simulation, and bitstream generation with verified device models and timing libraries. AMD continues to host ISE 14.7 downloads and legacy documentation for ongoing maintenance of deployed XC6SLX150T-N3FGG900C systems.
Is XC6SLX150T-N3FGG900C compliant with RoHS and REACH regulations?
Yes, XC6SLX150T-N3FGG900C is RoHS-compliant (2011/65/EU) and REACH-conformant (EC 1907/2006), with lead-free (Pb-free) solder balls and halogen-free substrate materials. The FCBGA package carries the "RoHS 6/6" marking and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements. Full compliance documentation is available through AMD's Product Change Notification (PCN) archives.
XC6SLX150T-N3FGG900C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 900-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 11519
- Number of Logic Elements/Cells:
- 147443
- Total RAM Bits:
- 4939776
- Number of I/O:
- 540
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FBGA (31x31)
XC6SLX150T-N3FGG900C FAQ
1.How can I place an order for XC6SLX150T-N3FGG900C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX150T-N3FGG900C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX150T-N3FGG900C reliable?
The price and inventory of XC6SLX150T-N3FGG900C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX150T-N3FGG900C is usually 5 days.
3.What payment methods are accepted for XC6SLX150T-N3FGG900C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX150T-N3FGG900C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX150T-N3FGG900C?
XC6SLX150T-N3FGG900C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX150T-N3FGG900C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX150T-N3FGG900C?
For technical support, including XC6SLX150T-N3FGG900C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX150T-N3FGG900C requirements.
6.How does Aetrix verify that XC6SLX150T-N3FGG900C is sourced from the original manufacturer or authorized distributors?
All XC6SLX150T-N3FGG900C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX150T-N3FGG900C meets industry standards.
7.What is the process for return or replacement of XC6SLX150T-N3FGG900C?
All XC6SLX150T-N3FGG900C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX150T-N3FGG900C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX150T-N3FGG900C part is unused and in its original packaging.
Return procedure for XC6SLX150T-N3FGG900C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC6SLX150T-N3FGG900C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
