AMD XC6SLX150T-N3FGG900I

Overview

XC6SLX150T-N3FGG900I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 147,443 logic cells, 180 DSP48E1 slices, and 4.9 Mb of total block RAM. It operates at -3 speed grade with industrial temperature range (-40°C to +100°C) and uses a 900-pin Fine-Pitch Flip-Chip BGA (FFG900) package. It targets high-throughput industrial control and video processing systems requiring deterministic timing and low-power reconfigurable logic.

For engineers reviewing the XC6SLX150T-N3FGG900I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count (544 user I/Os), differential signaling support (LVDS, TMDS), embedded memory depth, and industrial-grade thermal performance.

Technical Context

The XC6SLX150T-N3FGG900I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It integrates six clock management tiles (CMTs), each containing a DCM and PLL for precise clock synthesis and phase alignment across multiple domains.

It supports SelectIO™ technology with programmable I/O standards including LVCMOS, LVTTL, SSTL, HSTL, and differential interfaces such as LVDS, RSDS, and BLVDS. Configuration is performed via Master SPI, Slave Serial, or JTAG modes using external PROM or processor-controlled initialization.

Key Specifications

Pinout & Package

The XC6SLX150T-N3FGG900I is housed in a 900-ball Fine-Pitch Flip-Chip BGA (FFG900) package with 35 × 35 array, 1.0 mm ball pitch, and thermal lid for enhanced heat transfer. Pin functions are organized into banks with independent VCCO and VREF per bank.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XC6SLX150T-N3FGG900I, the XC6SLX150-3FGG900I offers identical functionality at lower cost but excludes industrial thermal qualification, while the XCKU035-2FFVA676I delivers significantly higher performance and bandwidth at increased power and design complexity.

Availability

XC6SLX150T-N3FGG900I is available at Aetrix Electronics and suitable for industrial motion control, medical imaging interface, avionics data concentrators, and video surveillance encoder applications requiring stable component supply and long-term lifecycle assurance.

Supply support for XC6SLX150T-N3FGG900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops and markets adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines.

The Spartan-6 family was originally designed by Xilinx for cost-sensitive, high-volume applications demanding low power, small form factor, and reliable performance in industrial and embedded systems.

FAQ

What is the maximum supported I/O standard voltage for XC6SLX150T-N3FGG900I?

The XC6SLX150T-N3FGG900I supports I/O standards from 1.2 V to 3.3 V across its 12 I/O banks, with bank-specific VCCO and shared VREF. Each bank can be independently configured for LVCMOS, LVTTL, SSTL, or differential standards like LVDS, subject to voltage compatibility rules defined in DS162.

Does XC6SLX150T-N3FGG900I include hard IP for Ethernet MAC?

No, the XC6SLX150T-N3FGG900I does not contain hard Ethernet MAC blocks. Ethernet connectivity must be implemented using soft IP cores (e.g., Xilinx LogiCORE IP Ethernet MAC) or external PHY devices interfaced through its SelectIO pins and embedded PowerPC or MicroBlaze processors.

Can XC6SLX150T-N3FGG900I be configured via JTAG only?

Yes, XC6SLX150T-N3FGG900I supports JTAG configuration as a primary method using IEEE 1149.1 boundary-scan, enabling programming, debugging, and verification without external configuration memory. It also supports Master SPI, Slave Serial, and Boundary Scan modes simultaneously.

What is the total number of clock management tiles (CMTs) in XC6SLX150T-N3FGG900I?

The XC6SLX150T-N3FGG900I contains six clock management tiles (CMTs), each integrating one Digital Clock Manager (DCM) and one Phase-Locked Loop (PLL). These provide independent clock synthesis, frequency multiplication/division, phase shifting, and duty-cycle correction for up to six distinct clock domains.

Is XC6SLX150T-N3FGG900I compatible with Vivado Design Suite?

No, XC6SLX150T-N3FGG900I is not supported in Vivado. It requires Xilinx ISE Design Suite 14.7 for synthesis, implementation, and bitstream generation. Vivado supports only 7-series and newer FPGA families; Spartan-6 remains ISE-only per official AMD/Xilinx tool roadmap.