AMD XC6SLX16-2CS324I4204
- Part No.:
- XC6SLX16-2CS324I4204
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XC6SLX16-2CS324I4204.pdf
- Description:
- IC FPGA 232 I/O 324CSBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,075
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC6SLX16-2CS324I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 14,579 logic cells, 576 Kbits of block RAM, and a -2 speed grade operating at industrial temperature range (–40°C to +100°C). It uses a 324-pin CSPBGA package and supports LVCMOS/LVTTL I/O standards for embedded control and interface bridging in space-constrained industrial controllers.
For engineers reviewing the XC6SLX16-2CS324I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count (232 user I/Os), differential signaling support (LVDS, TMDS), embedded DSP48A1 slices (32), and configuration via SPI/BPI/master serial modes.
Technical Context
The XC6SLX16-2CS324I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated carry logic. It integrates six digital clock managers (DCMs) supporting phase shifting, frequency synthesis, and duty cycle correction across multiple clock domains.
Configuration is performed via slave serial, master serial, or boundary-scan (JTAG) modes using external PROM or processor-controlled interfaces. The device supports partial reconfiguration and includes built-in system monitoring for on-chip temperature and supply voltage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 14,579 - determines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 576 Kbits - provides on-chip memory for FIFOs, buffers, or small lookup tables without external SRAM |
| User I/O Pins | 232 - supports high-density peripheral interfacing including parallel buses and multi-lane data paths |
| DSP Slices | 32 DSP48A1 - enables fixed-point arithmetic, filtering, and math-intensive operations at up to 250 MHz |
| Speed Grade | -2 - guarantees timing closure for designs running at up to 667 Mbps DDR3 I/O and 400 MHz system clocks |
| Operating Temp | –40°C to +100°C - qualified for industrial environments without derating or thermal throttling |
| Package | 324-pin CSPBGA (15×15 mm, 0.8 mm pitch) - enables compact PCB layout with fine-pitch routing and thermal dissipation |
Pinout & Package
XC6SLX16-2CS324I is housed in a 324-pin Chip Scale Package Ball Grid Array (CSPBGA) with 15×15 array, 0.8 mm pitch, and standard JEDEC MO-271AC footprint. Thermal pad is exposed on underside for enhanced heat transfer.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be decoupled locally for signal integrity in LVCMOS33 operation |
| K1 | CLKIN_0 | Dedicated global clock input - connects directly to DCM0 for low-jitter clock distribution |
| M2 | PROGRAM_B | Active-low configuration reset - initiates reconfiguration when asserted, synchronous to INIT_B |
| P4 | INIT_B | Open-drain initialization status - indicates configuration memory readiness before DONE goes high |
| T14 | DONE | Open-drain configuration completion - pulled high externally to confirm successful bitstream load |
| Y10 | VCCAUX | Analog auxiliary supply - powers internal PLLs, DCMs, and configuration logic at 2.5 V ±5% |
Key Features
| Feature | Design Value |
|---|---|
| Dual-register flip-flops per LUT | Enables high-speed pipelining and register-retiming without consuming extra CLBs |
| Integrated DCMs | Provides jitter-tolerant clock multiplication, division, and phase alignment for multi-clock domain systems |
| SelectIO technology | Supports 18 I/O standards including LVDS, RSDS, and SSTL with programmable drive strength and slew rate |
| Embedded Block RAM | Configurable as true dual-port RAM, ROM, or shift register - eliminates need for external memory in many control applications |
| System Monitor | Measures on-die temperature and supply voltages (VCCINT, VCCAUX) via JTAG or dedicated ADC interface |
Applications
| Industrial PLC I/O Module | Automated Test Equipment (ATE) |
|---|---|
Use Scenario: Real-time digital I/O conditioning and protocol translation between fieldbus (PROFIBUS, CANopen) and backplane interfaces. IC Role / Device Role / Timing Role: FPGA fabric implements custom state machines and timing-critical bus arbitration logic; DCMs generate synchronized clocks for ADC/DAC sampling and serial link timing. Use Value: 232 user I/Os allow direct connection to 32-channel digital I/O banks; -2 speed grade ensures deterministic response under 10 µs cycle time requirements. | Use Scenario: High-speed pattern generation and response capture for semiconductor wafer-level testing. IC Role / Device Role / Timing Role: Configurable logic generates precise stimulus waveforms; DSP48A1 slices perform real-time pass/fail analysis on captured data streams. Use Value: 32 DSP slices enable parallel signature analysis at 200+ MHz; LVDS I/O supports 800 Mbps test vector transmission. |
| Medical Imaging Interface | Avionics Data Concentrator |
Use Scenario: Bridging high-bandwidth image sensor outputs (CMOS/CCD) to PCIe or DDR3 memory subsystems in portable ultrasound devices. IC Role / Device Role / Timing Role: Acts as pixel data formatter and memory controller; block RAM buffers frame data while DDR3 controller manages burst transfers. Use Value: 576 Kbits block RAM provides sufficient line buffering for 1080p@30fps video; CSPBGA package meets strict EMI and size constraints. | Use Scenario: Aggregating ARINC 429, MIL-STD-1553, and discrete I/O signals into a unified Ethernet/IP backbone in flight control computers. IC Role / Device Role / Timing Role: Implements protocol-specific transceivers and time-stamped message queuing; DCMs align all bus clocks to a common 10 MHz reference. Use Value: SelectIO supports mixed-voltage I/O banks required for legacy avionics interfaces; industrial temp rating ensures reliability at altitude. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX25-2CS324I | Higher logic density (24,051 LUTs), same package and speed grade | Better suited for designs requiring larger state machines or additional IP cores (e.g., Ethernet MAC, PCIe endpoint) | Select when future scalability or added functionality justifies higher cost and power |
| XC7S15-1CSG324C | Artix-7 architecture, lower static power, 100% pin-compatible but requires bitstream migration | Preferred for new designs targeting lower power consumption and longer product lifecycle | Choose for greenfield projects where Artix-7 toolchain and IP compatibility are acceptable |
Compared with XC6SLX16-2CS324I, XC6SLX25-2CS324I offers headroom for feature expansion without PCB change, while XC7S15-1CSG324C delivers improved power efficiency and newer silicon process benefits-but requires full design revalidation.
Availability
XC6SLX16-2CS324I is available at Aetrix Electronics and suitable for industrial automation, medical diagnostics equipment, and avionics subsystems requiring stable component supply over extended production lifecycles.
Supply support for XC6SLX16-2CS324I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for high-performance embedded and datacenter applications.
The Spartan-6 family was designed for cost-sensitive, power-efficient applications requiring reliable logic density and I/O flexibility in industrial and automotive environments.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX16-2CS324I?
XC6SLX16-2CS324I supports I/O standards ranging from 1.2 V to 3.3 V across its 12 I/O banks. Each bank is independently configurable for LVCMOS, LVTTL, or differential standards like LVDS and RSDS. VCCO per bank must match the selected I/O standard's voltage requirement, and XC6SLX16-2CS324I does not support mixed-voltage operation within a single bank.
Does XC6SLX16-2CS324I support partial reconfiguration?
Yes, XC6SLX16-2CS324I supports partial reconfiguration through Xilinx ISE Design Suite tools. This allows dynamic swapping of logic modules during operation without resetting the entire device. XC6SLX16-2CS324I requires specific floorplanning and configuration memory partitioning, and partial bitstreams must be validated for timing and resource conflicts before deployment.
What configuration modes are supported by XC6SLX16-2CS324I?
XC6SLX16-2CS324I supports four primary configuration modes: Master Serial (via SPI flash), Slave Serial (processor-driven), Boundary Scan (JTAG), and Slave SelectMAP (8-/16-bit parallel). Configuration mode is selected using MODE pins (M0–M2); XC6SLX16-2CS324I does not support BPI parallel NOR flash in this package variant.
Is XC6SLX16-2CS324I RoHS compliant and lead-free?
Yes, XC6SLX16-2CS324I is RoHS-compliant and manufactured with lead-free (Pb-free) packaging. The CSPBGA package uses matte tin finish on solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements. Full compliance documentation is available in AMD's official product change notices for this part number.
Can XC6SLX16-2CS324I operate with a single 2.5 V supply?
No, XC6SLX16-2CS324I requires three distinct supply rails: VCCINT (1.2 V), VCCAUX (2.5 V), and VCCO (1.2–3.3 V, bank-dependent). Using only 2.5 V would violate VCCINT specification and prevent proper CLB and routing operation. XC6SLX16-2CS324I will not configure or function reliably without correct sequencing and regulation of all three supplies.
XC6SLX16-2CS324I4204 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1139
- Number of Logic Elements/Cells:
- 14579
- Total RAM Bits:
- 589824
- Number of I/O:
- 232
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-CSPBGA (15x15)
XC6SLX16-2CS324I4204 FAQ
1.How can I place an order for XC6SLX16-2CS324I4204 through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX16-2CS324I4204 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX16-2CS324I4204 reliable?
The price and inventory of XC6SLX16-2CS324I4204 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX16-2CS324I4204 is usually 5 days.
3.What payment methods are accepted for XC6SLX16-2CS324I4204?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX16-2CS324I4204 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX16-2CS324I4204?
XC6SLX16-2CS324I4204 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX16-2CS324I4204 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX16-2CS324I4204?
For technical support, including XC6SLX16-2CS324I4204 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX16-2CS324I4204 requirements.
6.How does Aetrix verify that XC6SLX16-2CS324I4204 is sourced from the original manufacturer or authorized distributors?
All XC6SLX16-2CS324I4204 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX16-2CS324I4204 meets industry standards.
7.What is the process for return or replacement of XC6SLX16-2CS324I4204?
All XC6SLX16-2CS324I4204 units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX16-2CS324I4204, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX16-2CS324I4204 part is unused and in its original packaging.
Return procedure for XC6SLX16-2CS324I4204:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC6SLX16-2CS324I4204 Tags

-
ICE40LP384-SG32
Lattice Semiconductor Corporation

-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation

-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation

-
10M02DCV36C8G
Intel

-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation

-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation

-
ICE40LP1K-CM36
Lattice Semiconductor Corporation

-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation

-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
