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AMD XC6SLX16-2CSG225I

Part No.:
XC6SLX16-2CSG225I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
225-LFBGA, CSPBGA
Datasheet:
AetrixXC6SLX16-2CSG225I.pdf
Description:
IC FPGA 160 I/O 225CSBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:276

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Product details

Overview

XC6SLX16-2CSG225I from AMD (formerly Xilinx) is a Spartan-6 FPGA with 14,579 logic cells, 576 Kbits of block RAM, and 186 user I/Os in a 225-pin CSGA package. It operates at -2 speed grade (1.2 V core, industrial temperature range -40°C to +100°C) and targets low-power embedded control and interface bridging applications.

For engineers reviewing the XC6SLX16-2CSG225I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, block RAM depth, LVDS support, DCI termination capability, and industrial-grade thermal performance.

Technical Context

The XC6SLX16-2CSG225I implements a configurable logic fabric based on 6-input LUTs and distributed RAM, with integrated DSP48A1 slices for arithmetic acceleration. It supports SelectIO standards including LVCMOS, LVDS, and SSTL, and includes Digital Clock Managers (DCMs) for clock synthesis and phase alignment.

Configuration is performed via SPI master/slave mode or JTAG, with bitstream encryption and fallback support. The device uses 1.2 V core voltage with separate 2.5 V/3.3 V I/O banks, enabling mixed-voltage interfacing without level shifters.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells14,579 - determines maximum combinational and sequential logic capacity for custom digital functions
Block RAM576 Kbits - provides on-chip memory for FIFOs, buffers, or small lookup tables without external SRAM
User I/O Pins186 - supports high-density peripheral interfacing with bank-wise voltage flexibility
Speed Grade-2 - guarantees timing closure up to 667 MHz DDR3 data rate and 250 MHz system clock in worst-case industrial conditions
Operating Temp-40°C to +100°C - enables deployment in industrial motor drives and outdoor communications equipment
Core Voltage1.2 V ±3% - defines power delivery requirements and impacts dynamic power consumption

Pinout & Package

XC6SLX16-2CSG225I is housed in a 225-ball fine-pitch chip-scale grid array (CSGA) package with 1.0 mm ball pitch, measuring 13 mm × 13 mm. The package supports lead-free assembly and meets JEDEC J-STD-020 moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
G1VCCO_0I/O bank 0 output voltage supply - sets logic levels for pins in Bank 0
D2VCCAUXAuxiliary 2.5 V supply for configuration, clocking, and analog circuitry
A1PROGRAM_BActive-low asynchronous reset that reloads configuration from external SPI flash
B3CCLKConfiguration clock output - drives external PROM during master SPI mode
E1INIT_BOpen-drain status signal indicating configuration completion or error

Key Features

FeatureDesign Value
Digital Clock Manager (DCM)Provides jitter-reduced clock synthesis, frequency multiplication/division, and 90° phase shift - eliminates need for external PLL ICs in timing-critical subsystems
SelectIO TechnologySupports LVDS, LVCMOS, and SSTL standards per bank - enables direct connection to ADCs, FPGAs, and memory without level-shifting components
DCI (Digital Controlled Impedance)On-die series termination matching 40–60 Ω - reduces PCB routing complexity and improves signal integrity for high-speed parallel buses
DSP48A1 Slices16 dedicated 18×18 multipliers with pipeline registers - accelerates FIR filters, FFT engines, and motor control algorithms

Applications

Industrial Motor ControlVideo Interface Bridging

Use Scenario: Real-time PWM generation and encoder feedback processing in servo drives.

IC Role / Device Role / Timing Role: Configurable logic fabric executes closed-loop control algorithms; DCM synchronizes encoder sampling and PWM update cycles.

Use Value: Enables deterministic sub-microsecond latency for current loop updates using on-chip block RAM and DSP slices.

Use Scenario: Converting MIPI CSI-2 camera streams to parallel RGB for display controllers.

IC Role / Device Role / Timing Role: Deserializes high-speed differential video data and re-times pixel clocks using DCM-based clock recovery.

Use Value: Eliminates external serializer/deserializer ICs and reduces BOM cost by integrating protocol translation and clock domain crossing.

Programmable Logic Controller (PLC)Communications Backplane Interface

Use Scenario: Modular I/O expansion with isolated digital inputs/outputs and fieldbus protocol stacks.

IC Role / Device Role / Timing Role: Implements soft-core microblaze processor and fieldbus state machines; SelectIO interfaces with opto-isolators and RS-485 transceivers.

Use Value: Supports hot-swap I/O module design with programmable debounce, edge detection, and CRC validation in logic fabric.

Use Scenario: Interfacing between legacy TDM backplanes and modern packet-switched Ethernet infrastructure.

IC Role / Device Role / Timing Role: Acts as time-slot mapper and jitter cleaner; DCM aligns T1/E1 frame clocks with IEEE 1588 timestamps.

Use Value: Maintains <100 ns phase error across 24-hour holdover using DCM's low-jitter clock synthesis.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based interface and control applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC6SLX9-2CSG225IFewer logic cells (9,152), reduced block RAM (576 Kbits unchanged), same package and speed gradeSuitable for simpler control tasks with lower gate count; insufficient for dual-channel video processingSelect when design fits within 9K LUTs and requires identical footprint and thermal profile
XC7S15-2CSGA225IArtix-7 architecture, higher logic density (12,800 LUTs), 900 Kbits block RAM, same 225-ball CSGA packageOffers PCIe Gen1 endpoint support and improved DSP efficiency; not pin-compatible due to different configuration pin mappingChoose for new designs requiring higher performance or future-proofing, but expect PCB redesign

Compared with XC6SLX16-2CSG225I, XC6SLX9-2CSG225I offers cost reduction at logic capacity trade-off, while XC7S15-2CSGA225I delivers architectural upgrades with no pin compatibility - both require functional validation before substitution.

Availability

XC6SLX16-2CSG225I is available at Aetrix Electronics and suitable for industrial motor control, video interface bridging, and programmable logic controller (PLC) applications requiring stable component supply over extended product lifecycles.

Supply support for XC6SLX16-2CSG225I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.

The Spartan-6 family was engineered for cost-sensitive, high-volume applications demanding low static power, flexible I/O, and proven reliability in industrial environments.

FAQ

What is the maximum supported I/O standard for XC6SLX16-2CSG225I?

XC6SLX16-2CSG225I supports LVDS, LVCMOS (1.2 V to 3.3 V), SSTL, and HSTL I/O standards per bank. Each of its 10 I/O banks can be independently configured for voltage and standard, enabling mixed-interface designs such as DDR2 memory alongside LVDS sensors. The device does not support PCI Express or high-speed serial transceivers.

Does XC6SLX16-2CSG225I include built-in configuration memory?

No, XC6SLX16-2CSG225I does not include on-chip nonvolatile configuration memory. It requires an external SPI serial PROM (e.g., XCF02S or compatible) for master-mode configuration. Configuration can also be loaded via JTAG boundary scan or slave-serial mode from a microcontroller.

What thermal management considerations apply to XC6SLX16-2CSG225I in industrial use?

XC6SLX16-2CSG225I is rated for -40°C to +100°C junction temperature. In enclosed industrial enclosures, a 2-layer PCB with 1 oz copper and thermal vias under the CSGA package is sufficient for typical 1.2 W power dissipation. No heatsink is required unless ambient exceeds 85°C or airflow is restricted.

Can XC6SLX16-2CSG225I implement a soft processor core?

Yes, XC6SLX16-2CSG225I supports MicroBlaze soft processor implementation with up to 128 KB local memory. The 14,579 logic cells and 576 Kbits of block RAM allow dual-core configurations with peripherals such as UART, GPIO, and timers - validated in Xilinx SDK v14.7 and later toolchains.

Is XC6SLX16-2CSG225I RoHS compliant and halogen-free?

Yes, XC6SLX16-2CSG225I is RoHS compliant and halogen-free per AMD specification DS162. The 225-ball CSGA package uses lead-free solder balls and meets JEDEC J-STD-020C moisture sensitivity level 3, requiring bake conditioning prior to reflow if exposed beyond floor life.

XC6SLX16-2CSG225I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-6 LX
Package/Case:
225-LFBGA, CSPBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
1139
Number of Logic Elements/Cells:
14579
Total RAM Bits:
589824
Number of I/O:
160
Number of Gates:
-
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
225-CSPBGA (13x13)

XC6SLX16-2CSG225I FAQ

1.How can I place an order for XC6SLX16-2CSG225I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC6SLX16-2CSG225I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC6SLX16-2CSG225I reliable?

The price and inventory of XC6SLX16-2CSG225I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX16-2CSG225I is usually 5 days.

3.What payment methods are accepted for XC6SLX16-2CSG225I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX16-2CSG225I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC6SLX16-2CSG225I?

XC6SLX16-2CSG225I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC6SLX16-2CSG225I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC6SLX16-2CSG225I?

For technical support, including XC6SLX16-2CSG225I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX16-2CSG225I requirements.

6.How does Aetrix verify that XC6SLX16-2CSG225I is sourced from the original manufacturer or authorized distributors?

All XC6SLX16-2CSG225I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX16-2CSG225I meets industry standards.

7.What is the process for return or replacement of XC6SLX16-2CSG225I?

All XC6SLX16-2CSG225I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX16-2CSG225I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC6SLX16-2CSG225I part is unused and in its original packaging.

Return procedure for XC6SLX16-2CSG225I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC6SLX16-2CSG225I Tags

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