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AMD XC6SLX16-2CSG324I
- Part No.:
- XC6SLX16-2CSG324I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XC6SLX16-2CSG324I.pdf
- Description:
- IC FPGA 232 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,450
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Product details
Overview
XC6SLX16-2CSG324I from AMD (formerly Xilinx) is a Spartan-6 FPGA with 14,579 logic cells, 576 Kbits of block RAM, and a -2 speed grade operating at up to 800 Mbps DDR3 interface rate. It features 232 user I/Os in a 324-pin CSGA package and targets cost-sensitive embedded control and industrial interface applications.
For engineers reviewing the XC6SLX16-2CSG324I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, block RAM depth, LVDS support, DCI termination capability, and industrial temperature range (-40°C to +100°C).
Technical Context
The XC6SLX16-2CSG324I implements a configurable logic fabric based on 6-input LUTs and integrated DSP48A1 slices for arithmetic acceleration. It supports SelectIO standards including LVCMOS, LVDS, and SSTL, with internal differential termination and digital clock managers (DCMs) for clock synthesis and phase alignment.
Configuration is performed via SPI serial mode or JTAG, and the device includes built-in system monitoring for on-chip temperature and supply voltage. Bitstream security is supported through AES encryption with external configuration memory.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 14,579 - total available LUT-based programmable resources for combinational and sequential logic implementation |
| Block RAM | 576 Kbits - distributed across 32 BRAM primitives, each configurable as 18K-bit dual-port memory |
| User I/O Pins | 232 - supports mixed-voltage I/O banks with independent VCCO per bank and programmable drive strength |
| Speed Grade | -2 - guarantees timing closure up to 595 MHz for internal logic and 800 Mbps for DDR3 source-synchronous interfaces |
| Operating Temperature | -40°C to +100°C - qualified for industrial environments without derating |
| Package | 324-pin CSGA - 15×15 mm body, 0.8 mm pitch, RoHS-compliant, thermally enhanced for sustained operation |
Pinout & Package
XC6SLX16-2CSG324I is housed in a 324-pin Chip Scale Grid Array (CSGA) package with 232 user-configurable I/Os, 10 dedicated configuration pins (e.g., INIT_B, PROGRAM_B, DONE), 4 global clock inputs (GCLK), and power/ground distribution optimized for low-noise operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| IO_L0N_0 | Differential I/O Pair (N) | Supports LVDS, TMDS, or RSDS signaling when paired with IO_L0P_0; requires external 100 Ω termination |
| IO_L10P_0 | Single-ended I/O (P) | Configurable as LVCMOS18/LVCMOS25/LVCMOS33; supports slew rate and drive strength control |
| GCLK1 | Global Clock Input | Dedicated low-skew path to all clock regions; accepts single-ended or differential (with IBUFDS) signals |
| PROGRAM_B | Configuration Initiate | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration from master SPI flash |
| VCCAUX | Analog Auxiliary Supply | 1.8 V supply for internal PLLs, DCMs, and configuration logic; must be filtered independently |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Digital Clock Manager (DCM) | Provides jitter-reduced clock synthesis, phase shifting, frequency multiplication/division, and duty cycle correction |
| Source-Synchronous DDR3 Interface Support | Enables direct connection to DDR3 SDRAM at 800 Mbps with calibrated delay elements and write-leveling logic |
| Internal Differential Termination (DCI) | Eliminates need for external 100 Ω resistors on differential I/Os; supports dynamic impedance calibration |
| AES-256 Bitstream Encryption | Protects design IP during configuration from SPI flash; requires external authenticated configuration memory |
| Multi-Voltage I/O Banks | Eight independent I/O banks allow concurrent operation at 1.2 V, 1.35 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V signaling levels |
Applications
| Industrial PLC I/O Module | Automated Test Equipment (ATE) Control |
|---|---|
Use Scenario: Real-time digital I/O expansion with deterministic response under cyclic scan execution. IC Role / Device Role / Timing Role: FPGA fabric implements custom state machines and parallel I/O controllers synchronized to 10–50 kHz scan clocks. Use Value: 232 user I/Os enable high-density discrete signal handling; -2 speed grade ensures sub-microsecond logic propagation for cycle-critical tasks. | Use Scenario: Pattern generation and response capture for semiconductor device functional testing. IC Role / Device Role / Timing Role: Configurable logic executes vector sequencing, while DSP48A1 slices perform real-time pass/fail analysis. Use Value: Block RAM depth supports multi-megabit pattern storage; LVDS I/O enables precise 800 Mbps stimulus delivery. |
| Motor Drive Feedback Interface | Medical Imaging Data Aggregation |
Use Scenario: Acquisition and preprocessing of encoder, resolver, and current sensor data in servo drives. IC Role / Device Role / Timing Role: FPGA processes quadrature decoding, analog front-end synchronization, and PWM timing coordination. Use Value: DCMs generate jitter-free PWM carriers up to 200 kHz; industrial temp rating ensures reliability near power stages. | Use Scenario: Consolidation of parallel ADC streams from ultrasound transducer arrays into a unified LVDS video bus. IC Role / Device Role / Timing Role: Timing-critical deserialization and frame buffering before PCIe or Ethernet transport. Use Value: 576 Kbits block RAM buffers full-frame data; CSGA package supports compact PCB layout in space-constrained enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX25-2CSG324I | Higher logic capacity (24,051 LUTs), same package and I/O count; requires higher static power and larger bitstream | Better suited for designs needing additional pipeline stages or larger state machines without board redesign | Select when future scalability or increased algorithm complexity is anticipated within identical footprint constraints |
| XC7S15-2FTGB196I | Artix-7 architecture; 12,800 logic cells, 640 Kbits block RAM, 100 user I/Os in 196-pin FTGB package | Lacks DDR3 PHY hard IP and has fewer I/Os; targets lower gate count but higher DSP efficiency per watt | Prefer for new designs prioritizing power efficiency and integrated transceivers over legacy Spartan-6 ecosystem compatibility |
Compared with XC6SLX16-2CSG324I, XC6SLX25-2CSG324I offers headroom for logic growth without layout change, while XC7S15-2FTGB196I trades I/O density and DDR3 support for lower static power and modern toolchain integration-making it suitable for next-generation low-power embedded systems.
Availability
XC6SLX16-2CSG324I is available at Aetrix Electronics and suitable for industrial automation, test equipment, and medical imaging systems requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX16-2CSG324I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Spartan-6 family was designed for cost-optimized, high-volume applications demanding reliable I/O flexibility, moderate logic density, and industrial temperature operation-especially where long-term availability and mature toolchain support are critical.
FAQ
What is the maximum DDR3 data rate supported by XC6SLX16-2CSG324I?
The XC6SLX16-2CSG324I supports DDR3 SDRAM interfaces up to 800 Mbps per pin using source-synchronous techniques. This rate is guaranteed under -2 speed grade conditions with proper board layout, termination, and calibration. The device does not include hardened DDR3 PHY logic, so implementation relies on user-designed I/O timing calibration and write-leveling circuits within the XC6SLX16-2CSG324I fabric.
Does XC6SLX16-2CSG324I support JTAG boundary-scan testing?
Yes, XC6SLX16-2CSG324I fully supports IEEE 1149.1 JTAG boundary-scan for device programming, debugging, and interconnect testing. The TAP controller is accessible via TCK, TMS, TDI, and TDO pins, and supports INTEST, SAMPLE/PRELOAD, and BYPASS instructions. Boundary-scan capability is active during configuration and runtime, enabling in-system verification of PCB interconnects around the XC6SLX16-2CSG324I.
Can XC6SLX16-2CSG324I operate without external configuration memory?
No, XC6SLX16-2CSG324I requires external non-volatile memory (e.g., SPI flash) for configuration loading. It lacks on-chip configuration storage and cannot retain its programmed state after power loss. Configuration modes include Master SPI, Slave Serial, and JTAG; Master SPI is most common and uses dedicated CONFIG_IO pins to automatically load bitstream from external flash upon power-up or PROGRAM_B assertion.
What I/O standards are natively supported by XC6SLX16-2CSG324I?
XC6SLX16-2CSG324I natively supports LVCMOS (1.2 V to 3.3 V), LVDS, Mini-LVDS, RSDS, BLVDS, SSTL, HSTL, and TMDS I/O standards. Each I/O bank can be independently set to a specific VCCO voltage, enabling mixed-signaling on a single device. Differential standards require pairing complementary pins and use internal or external termination depending on DCI enablement status.
Is XC6SLX16-2CSG324I qualified for automotive applications?
No, XC6SLX16-2CSG324I is specified for industrial temperature range (-40°C to +100°C) and is not AEC-Q100 qualified. It lacks automotive-specific screening, failure-in-time (FIT) reporting, and qualification test documentation required for automotive ECUs. For automotive use, AMD recommends the XA Spartan-6 family variants, which share the same architecture but undergo additional stress testing and traceability controls.
XC6SLX16-2CSG324I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1139
- Number of Logic Elements/Cells:
- 14579
- Total RAM Bits:
- 589824
- Number of I/O:
- 232
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-CSPBGA (15x15)
XC6SLX16-2CSG324I FAQ
1.How can I place an order for XC6SLX16-2CSG324I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX16-2CSG324I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX16-2CSG324I reliable?
The price and inventory of XC6SLX16-2CSG324I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX16-2CSG324I is usually 5 days.
3.What payment methods are accepted for XC6SLX16-2CSG324I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX16-2CSG324I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX16-2CSG324I?
XC6SLX16-2CSG324I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX16-2CSG324I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX16-2CSG324I?
For technical support, including XC6SLX16-2CSG324I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX16-2CSG324I requirements.
6.How does Aetrix verify that XC6SLX16-2CSG324I is sourced from the original manufacturer or authorized distributors?
All XC6SLX16-2CSG324I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX16-2CSG324I meets industry standards.
7.What is the process for return or replacement of XC6SLX16-2CSG324I?
All XC6SLX16-2CSG324I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX16-2CSG324I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX16-2CSG324I part is unused and in its original packaging.
Return procedure for XC6SLX16-2CSG324I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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