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AMD XC6SLX16-2FT256I
- Part No.:
- XC6SLX16-2FT256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC6SLX16-2FT256I.pdf
- Description:
- IC FPGA 186 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:247
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Product details
Overview
XC6SLX16-2FT256I from AMD (formerly Xilinx) is a Spartan-6 FPGA with 14,579 logic cells, 576 Kbits of block RAM, and a -2 speed grade operating at up to 800 Mbps DDR3 interface rate. It features 195 user I/Os in a 256-pin FTBGA package and is used in industrial control logic, embedded vision preprocessing, and protocol bridging applications.
For engineers reviewing the XC6SLX16-2FT256I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, block RAM depth, LVDS support, single-ended signaling compatibility, and industrial temperature range operation.
Technical Context
The XC6SLX16-2FT256I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated DSP48A1 slices for arithmetic acceleration. It supports SelectIO™ technology with programmable drive strength, slew rate, and on-chip termination for SSTL, HSTL, LVCMOS, and LVDS standards.
Configuration is performed via Master SPI or JTAG, with support for fallback configuration and multi-boot capability. The device integrates a PLL for clock synthesis and phase alignment, enabling precise timing control across multiple I/O banks operating at independent voltage levels.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 14,579 - provides gate count equivalent to ~16K system gates for combinational and sequential logic implementation |
| Block RAM | 576 Kbits - supports dual-port memory configurations up to 36-bit width for FIFOs or frame buffers |
| User I/Os | 195 - enables high-density peripheral interfacing with bank-specific voltage support (1.2V–3.3V) |
| Speed Grade | -2 - guarantees timing closure at 800 Mbps DDR3 data rates and 333 MHz system clocks |
| Operating Temp | -40°C to +100°C - qualified for extended industrial environments without derating |
| Package | 256-pin FTBGA (17×17 mm, 1.0 mm pitch) - compatible with standard PCB assembly processes |
| DSP Slices | 32 - delivers 18×18-bit signed multiplication and accumulation per slice for filtering or math-intensive tasks |
Pinout & Package
XC6SLX16-2FT256I is housed in a 256-ball Fine-Pitch Thin BGA (FTBGA) package with 17×17 array, 1.0 mm ball pitch, and 1.2 mm body height. Ball assignment follows Xilinx SP600-256 package drawing DS162.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply (1.2V/1.35V/1.5V/1.8V/2.5V/3.3V selectable) |
| K1 | CLKIN_0 | Dedicated global clock input for PLL0, supports single-ended or differential (LVDS/LVPECL) |
| M2 | PROGRAM_B | Active-low asynchronous configuration reset; pulls device into initialization state |
| R14 | INIT_B | Open-drain status output indicating configuration memory readiness |
| T15 | DONE | Open-drain output confirming successful configuration completion |
| V16 | VCCAUX | 1.8V auxiliary supply for configuration logic, PLLs, and transceivers |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO™ Technology | Supports 18 I/O standards including LVDS DCI, SSTL-2, and HSTL-18 with programmable termination |
| Dual-Register Flip-Flops | Enables time-multiplexed I/O for doubling effective pin count in time-critical interfaces |
| Integrated PLLs | Two digital PLLs provide jitter reduction, frequency synthesis, and phase shifting for clock domain crossing |
| Multi-Boot Configuration | Allows field-upgradable bitstreams stored in external SPI flash with fail-safe fallback to primary image |
| ISE Design Suite Support | Fully supported in Xilinx ISE 14.7 with place-and-route, timing analysis, and bitstream generation |
Applications
| Industrial PLC Logic | Embedded Vision Preprocessing |
|---|---|
Use Scenario: Real-time ladder logic execution and fieldbus protocol handling in modular automation controllers. IC Role / Device Role / Timing Role: Configurable logic fabric implementing deterministic scan-cycle timing with sub-microsecond I/O response. Use Value: 195 user I/Os enable direct connection to discrete I/O modules and encoder interfaces without glue logic. | Use Scenario: Pixel-level filtering, color space conversion, and ROI extraction prior to CPU or GPU processing in smart cameras. IC Role / Device Role / Timing Role: Parallel pixel pipeline accelerator using distributed RAM and DSP48A1 slices for real-time computation. Use Value: Block RAM depth supports line buffers for 1080p@30fps RGB-to-YUV conversion with zero external memory latency. |
| Protocol Bridging | Test Equipment Control |
Use Scenario: Translating between legacy parallel bus protocols (e.g., GPIB, ISA) and modern serial interfaces (USB, PCIe). IC Role / Device Role / Timing Role: Glue logic and state machine controller synchronizing asynchronous domains with precise setup/hold margin control. Use Value: SelectIO™ programmable slew rate and termination minimize signal integrity issues across mixed-voltage interconnects. | Use Scenario: High-precision waveform generation and measurement synchronization in automated test systems. IC Role / Device Role / Timing Role: Timing engine generating calibrated trigger sequences and capturing timestamped analog samples. Use Value: -2 speed grade ensures <1 ns clock skew across 195 I/Os for sub-nanosecond edge alignment in multi-channel instruments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic and I/O expansion applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX25-2FT256I | Higher logic capacity (24,051 CLBs), same package and speed grade | Better suited for designs requiring larger state machines or deeper FIFOs | Select when future scalability or additional DSP slices (48 vs. 32) are required |
| XC6SLX9-2TQG144I | Smaller footprint (144-pin TQFP), reduced I/O count (102), lower logic density (9,152 CLBs) | Targeted at cost-sensitive, space-constrained embedded control where full I/O count is unnecessary | Choose for simplified layout and lower BOM cost where 195 I/Os and 14K+ logic cells exceed requirements |
Compared with XC6SLX25-2FT256I and XC6SLX9-2TQG144I, the XC6SLX16-2FT256I balances I/O density, logic resources, and thermal profile for mid-complexity industrial interfaces-offering optimal resource utilization without over-provisioning or under-specifying.
Availability
XC6SLX16-2FT256I is available at Aetrix Electronics and suitable for industrial automation, embedded vision, and test equipment requiring stable component supply throughout long production lifecycles.
Supply support for XC6SLX16-2FT256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now leads development of adaptive computing platforms including FPGAs, ACAPs, and related software tools.
The Spartan-6 family was originally designed by Xilinx for cost-sensitive, high-volume applications demanding low power, small form factor, and seamless integration with microprocessors and memory interfaces.
FAQ
What is the maximum supported DDR3 data rate for XC6SLX16-2FT256I?
The XC6SLX16-2FT256I supports DDR3 interfaces up to 800 Mbps per pin, enabled by its -2 speed grade and integrated DQS logic. This allows reliable operation with DDR3-1600 memory components when configured with proper I/O standards and board-level signal integrity controls. The XC6SLX16-2FT256I achieves this using source-synchronous strobe capture and programmable input delays.
Does XC6SLX16-2FT256I support JTAG boundary-scan testing?
Yes, XC6SLX16-2FT256I fully supports IEEE 1149.1 JTAG boundary-scan for PCB-level interconnect testing and in-system programming. The TDI, TDO, TMS, and TCK pins are dedicated and compliant with standard JTAG chain topologies. This capability is integral to the XC6SLX16-2FT256I configuration architecture and requires no additional IP or firmware.
Can XC6SLX16-2FT256I operate in a 1.2V I/O bank configuration?
Yes, XC6SLX16-2FT256I supports 1.2V operation in I/O banks configured for SSTL12 or HSUL_12 standards. Each bank's VCCO must be supplied at 1.2V, and appropriate IOSTANDARD attributes must be assigned in the UCF or XDC constraints file. This capability is verified in the XC6SLX16-2FT256I datasheet Table 13 and applies to banks 0–3 and 5–6.
What configuration modes does XC6SLX16-2FT256I support?
XC6SLX16-2FT256I supports Master SPI, Slave Serial, Slave Parallel, and JTAG configuration modes. Master SPI is most common for standalone operation using external SPI flash, while JTAG is used for debugging and programming during development. All modes are implemented in hardware and require no soft-core processor intervention in the XC6SLX16-2FT256I.
Is XC6SLX16-2FT256I pin-compatible with other Spartan-6 devices in FT256 package?
No, XC6SLX16-2FT256I is not pin-compatible with other Spartan-6 devices in the FT256 package, such as XC6SLX25-2FT256I or XC6SLX45-2FT256I. While they share the same physical footprint and ball count, power and I/O pin assignments differ significantly across densities due to internal routing and bank allocation changes. Pin mapping must be verified per device using the respective package drawings for XC6SLX16-2FT256I.
XC6SLX16-2FT256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1139
- Number of Logic Elements/Cells:
- 14579
- Total RAM Bits:
- 589824
- Number of I/O:
- 186
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC6SLX16-2FT256I FAQ
1.How can I place an order for XC6SLX16-2FT256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX16-2FT256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX16-2FT256I reliable?
The price and inventory of XC6SLX16-2FT256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX16-2FT256I is usually 5 days.
3.What payment methods are accepted for XC6SLX16-2FT256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX16-2FT256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX16-2FT256I?
XC6SLX16-2FT256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX16-2FT256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX16-2FT256I?
For technical support, including XC6SLX16-2FT256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX16-2FT256I requirements.
6.How does Aetrix verify that XC6SLX16-2FT256I is sourced from the original manufacturer or authorized distributors?
All XC6SLX16-2FT256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX16-2FT256I meets industry standards.
7.What is the process for return or replacement of XC6SLX16-2FT256I?
All XC6SLX16-2FT256I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX16-2FT256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX16-2FT256I part is unused and in its original packaging.
Return procedure for XC6SLX16-2FT256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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