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AMD XC6SLX16-2FTG256C

Part No.:
XC6SLX16-2FTG256C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
256-LBGA
Datasheet:
AetrixXC6SLX16-2FTG256C.pdf
Description:
IC FPGA 186 I/O 256FTBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,804

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Product details

Overview

XC6SLX16-2FTG256C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 14,579 logic cells, 576 Kbits of block RAM, 186 I/O pins in a 256-pin Fine-Pitch Ball Grid Array (FBGA), and -2 speed grade for balanced performance and power efficiency. It serves as a programmable logic fabric in industrial control interfaces and embedded vision preprocessing pipelines.

For engineers reviewing the XC6SLX16-2FTG256C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), differential signaling capability (LVDS, TMDS), and configuration interface options (SPI, JTAG, SelectMAP).

Technical Context

The XC6SLX16-2FTG256C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48A1 slices for arithmetic operations, and integrated clock management using Digital Clock Managers (DCMs). It supports multi-voltage I/O banks with independent bank voltage control per group.

Configuration is performed via Master SPI, Slave Serial, or JTAG modes, with bitstream security enabled through AES encryption. The device includes internal pull-up/pull-down resistors and programmable slew rate control on all I/Os.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells14,579 - total available LUT-based logic resources for custom digital logic implementation
Block RAM576 Kbits - distributed across 24 x 18-Kbit dual-port RAM blocks for data buffering and FIFOs
I/O Pins186 - user-configurable bidirectional pins supporting multiple standards and voltage levels
Speed Grade-2 - guarantees timing closure at 500 MHz system clock with typical routing delays
PackageFTG256 - 256-ball fine-pitch BGA, 1.0 mm ball pitch, 17 × 17 mm body size
Config InterfaceMaster SPI / JTAG / SelectMAP - enables flexible programming and debug access during development and field updates

Pinout & Package

XC6SLX16-2FTG256C is housed in a 256-ball FTBGA (Fine-Pitch Ball Grid Array) package with 1.0 mm ball pitch and 17 mm × 17 mm footprint. Pin functions are organized into I/O banks, configuration pins, clock inputs, and power/ground terminals.

Pin/TerminalCircuit RoleDesign Meaning
G1CONFIG_DONEOpen-drain output indicating successful configuration completion; pulled high externally
H2INIT_BActive-low open-drain output signaling configuration status and error detection
J1PROGRAM_BActive-low input initiating configuration reset and reloading of bitstream
K2CCLKConfiguration clock input for Master SPI mode; driven by FPGA during Slave Serial mode
M1DINSerial data input for Master SPI configuration; connects to flash memory output

Key Features

FeatureDesign Value
Dual-Register Flip-FlopsEach LUT can implement two independent registers, improving logic density and pipelining efficiency
DSP48A1 Slices32 dedicated arithmetic units supporting 18 × 18 multiply, accumulate, and wide adder functions
SelectIO TechnologySupports LVCMOS, LVTTL, SSTL, HSTL, LVDS, and TMDS I/O standards with programmable drive strength
Digital Clock Manager (DCM)Provides jitter reduction, frequency synthesis, phase shifting, and duty cycle correction without external PLLs
AES Bitstream EncryptionEnables secure configuration loading using 256-bit AES keys stored in on-chip battery-backed RAM

Applications

Industrial PLC I/O ModuleEmbedded Vision Preprocessor

Use Scenario: Real-time digital signal conditioning and protocol translation between field sensors and controller bus.

IC Role / Device Role / Timing Role: Programmable logic fabric handling parallel sensor sampling, debounce logic, and Modbus RTU framing.

Use Value: Enables deterministic latency under 2 µs per I/O cycle using synchronous logic and DCM-controlled clocks.

Use Scenario: Pixel-level filtering, color space conversion, and ROI extraction prior to CPU/GPU processing.

IC Role / Device Role / Timing Role: Hardware-accelerated image pipeline engine interfacing with CMOS image sensors via LVDS or parallel RGB.

Use Value: Offloads 75% of frame-processing load from host processor while maintaining sub-frame latency.

Medical Imaging Front-EndTest & Measurement Pattern Generator

Use Scenario: Acquisition and real-time waveform shaping for ultrasound beamforming or ECG signal digitization.

IC Role / Device Role / Timing Role: High-precision timing controller synchronizing ADC sampling, digital gain stages, and FIR filter coefficients.

Use Value: Achieves <10 ps jitter on sampling clocks via DCM phase alignment and low-skew global routing.

Use Scenario: Generation of precise digital stimulus patterns for IC functional validation and boundary-scan testing.

IC Role / Device Role / Timing Role: Deterministic pattern sequencer with multi-channel parallel output and programmable timing offsets.

Use Value: Supports 200+ MHz vector rates with <1 ns channel-to-channel skew using dedicated I/O delay calibration.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA logic and I/O interface applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC6SLX25-2FTG256C24,051 logic cells, 912 Kbits block RAM, same package and speed gradeHigher gate count supports larger state machines and more complex IP integrationChoose when design requires >18K logic cells or additional DSP slices without changing PCB layout
XC6SLX9-2TQG144C9,152 logic cells, 144-pin TQFP package, lower I/O count and smaller footprintLimited I/O and logic capacity suits cost-sensitive, space-constrained control applicationsChoose for simpler control logic where 186 I/Os and 14K+ logic cells are unnecessary

Compared with XC6SLX25-2FTG256C and XC6SLX9-2TQG144C, the XC6SLX16-2FTG256C delivers optimal balance of logic density, I/O flexibility, and thermal profile for mid-complexity embedded systems requiring 100–200 MHz clock domains and mixed-voltage I/O interfacing.

Availability

XC6SLX16-2FTG256C is available at Aetrix Electronics and suitable for industrial automation, medical imaging front-ends, and test equipment requiring stable component supply and long-term manufacturability.

Supply support for XC6SLX16-2FTG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for hardware-accelerated computing.

The Spartan-6 family was designed for cost-sensitive, high-volume applications demanding low-power programmable logic with robust I/O and configuration security - targeting industrial, automotive, and embedded vision markets.

FAQ

What is the maximum supported I/O standard voltage for XC6SLX16-2FTG256C?

The XC6SLX16-2FTG256C supports I/O voltages from 1.2 V to 3.3 V across its 12 configurable I/O banks. Each bank operates independently, allowing mixed-voltage interfaces such as 1.8 V LVDS receivers alongside 3.3 V LVTTL peripherals within a single XC6SLX16-2FTG256C design.

Does XC6SLX16-2FTG256C support JTAG boundary-scan testing?

Yes, XC6SLX16-2FTG256C fully complies with IEEE 1149.1 (JTAG) and supports boundary-scan testing via dedicated TCK, TMS, TDI, and TDO pins. The device also enables INTEST and EXTEST instructions for interconnect verification and internal logic testing during production and field diagnostics.

Can XC6SLX16-2FTG256C be configured using serial NOR flash memory?

Yes, XC6SLX16-2FTG256C supports Master SPI configuration mode, enabling direct boot from standard 4-wire serial NOR flash devices. The DIN pin receives the bitstream, while CCLK is generated internally, eliminating need for external clock sources during configuration.

What clock management resources are integrated into XC6SLX16-2FTG256C?

XC6SLX16-2FTG256C integrates two Digital Clock Managers (DCMs) per device. Each DCM provides frequency synthesis, phase shifting, duty cycle correction, and jitter reduction - supporting up to eight independent clock outputs with programmable divide/multiply ratios and fine-grained phase adjustment.

Is bitstream encryption supported on XC6SLX16-2FTG256C?

Yes, XC6SLX16-2FTG256C supports AES-256 bitstream encryption. Configuration bitstreams can be encrypted using Xilinx iMPACT or Vivado tools, and decrypted on-chip using keys stored in battery-backed RAM, preventing unauthorized readback or cloning of the programmed logic design.

XC6SLX16-2FTG256C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-6 LX
Package/Case:
256-LBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
1139
Number of Logic Elements/Cells:
14579
Total RAM Bits:
589824
Number of I/O:
186
Number of Gates:
-
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
256-FTBGA (17x17)

XC6SLX16-2FTG256C FAQ

1.How can I place an order for XC6SLX16-2FTG256C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC6SLX16-2FTG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC6SLX16-2FTG256C reliable?

The price and inventory of XC6SLX16-2FTG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX16-2FTG256C is usually 5 days.

3.What payment methods are accepted for XC6SLX16-2FTG256C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX16-2FTG256C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC6SLX16-2FTG256C?

XC6SLX16-2FTG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC6SLX16-2FTG256C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC6SLX16-2FTG256C?

For technical support, including XC6SLX16-2FTG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX16-2FTG256C requirements.

6.How does Aetrix verify that XC6SLX16-2FTG256C is sourced from the original manufacturer or authorized distributors?

All XC6SLX16-2FTG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX16-2FTG256C meets industry standards.

7.What is the process for return or replacement of XC6SLX16-2FTG256C?

All XC6SLX16-2FTG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX16-2FTG256C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC6SLX16-2FTG256C part is unused and in its original packaging.

Return procedure for XC6SLX16-2FTG256C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC6SLX16-2FTG256C Tags

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