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AMD XC6SLX16-2FTG256I
- Part No.:
- XC6SLX16-2FTG256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC6SLX16-2FTG256I.pdf
- Description:
- IC FPGA 186 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,306
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Product details
Overview
XC6SLX16-2FTG256I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 14,579 logic cells, 576 Kbits of block RAM, and 186 user I/Os in a 256-pin FTBGA package. It operates at -2 speed grade (1.2 V core, industrial temperature range -40°C to +100°C) and targets low-cost, high-volume embedded control and interface bridging applications.
For engineers reviewing the XC6SLX16-2FTG256I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, block RAM depth, LVCMOS33/LVDS I/O support, and industrial-grade thermal reliability.
Technical Context
The XC6SLX16-2FTG256I implements a configurable logic fabric based on 6-input LUTs and distributed RAM, with dedicated DSP48A1 slices supporting 18×18-bit multiply-accumulate operations. Its clocking system includes two DCMs (Digital Clock Managers) for phase alignment, frequency synthesis, and duty-cycle correction across up to eight output clocks.
Configuration is supported via Master Serial (SPI flash), JTAG, or SelectMAP modes. The device supports partial reconfiguration and includes integrated PCI Express® endpoint logic compliant with Gen1 x1 specification, enabling direct host communication without external bridge ICs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 14,579 - total configurable logic capacity for state machines, glue logic, and protocol engines |
| Block RAM | 576 Kbits - usable as dual-port memory, FIFO buffers, or lookup tables up to 36 Kbits per block |
| User I/O Pins | 186 - supports LVCMOS18/25/33, LVTTL, LVDS, and differential SSTL interfaces |
| DCMs | 2 - provide jitter-tolerant clock synthesis, phase shifting, and frequency multiplication/division |
| Speed Grade | -2 - guarantees timing closure at 1.2 V core supply and industrial temperature range (-40°C to +100°C) |
| PCIe Interface | Gen1 x1 endpoint - enables direct connection to host CPU without external PCIe switch or bridge |
Pinout & Package
XC6SLX16-2FTG256I is housed in a 256-ball Fine-Pitch Thin BGA (FTBGA) package with 1.0 mm ball pitch, 17 mm × 17 mm body size, and standard JEDEC MO-220 VGGD variation. Thermal pad exposed on underside improves power dissipation for sustained operation at industrial temperatures.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be set to match connected interface voltage (e.g., 3.3 V for LVCMOS33) |
| D2 | CLK0 | Primary global clock input - routed to both DCMs for system-wide timing control |
| A1 | PROGRAM_B | Active-low configuration reset - pulls device into configuration mode when asserted |
| T14 | INIT_B | Open-drain status signal - goes high when configuration completes successfully |
| R15 | CCLK | Configuration clock output - drives external SPI flash during Master Serial mode |
| P16 | DONE | Open-drain completion indicator - pulled high by external resistor after bitstream load and startup sequence |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated DSP48A1 Slices | 32 slices - enable real-time FIR filtering, motor control PWM generation, and FFT computation without consuming LUT resources |
| Integrated PCIe Endpoint | Gen1 x1 compliant - eliminates need for external PCIe-to-parallel bridge, reducing BOM count and board area |
| Multi-Voltage I/O Banks | 6 independent banks - allow simultaneous interfacing to 1.8 V, 2.5 V, and 3.3 V peripherals on same device |
| DCM-Based Clock Management | Two DCMs with fine-grained phase shift - support precise timing alignment for ADC sampling, video pixel clocks, and synchronous serial interfaces |
| Partial Reconfiguration Support | Runtime logic update capability - enables field-upgradable firmware modules and dynamic function switching without full reboot |
Applications
| Industrial PLC I/O Module | Automotive Camera Interface Bridge |
|---|---|
Use Scenario: Real-time digital I/O expansion and protocol translation between fieldbus (CAN/Modbus) and Ethernet backbone. IC Role / Device Role / Timing Role: FPGA acts as deterministic logic controller and timing coordinator, managing 100+ discrete sensor/actuator signals with sub-microsecond response latency. Use Value: XC6SLX16-2FTG256I delivers sufficient logic density and I/O count to replace multiple ASICs while maintaining industrial temperature operation and long-term supply stability. | Use Scenario: Aggregating and formatting raw image data from multiple MIPI CSI-2 camera sensors for transmission over LVDS or parallel bus to SoC. IC Role / Device Role / Timing Role: Protocol converter and serializer - aligns pixel clocks, inserts framing metadata, and handles lane deskew for multi-sensor synchronization. Use Value: XC6SLX16-2FTG256I provides native MIPI CSI-2 receiver support and flexible I/O voltage scaling to interface directly with diverse image sensors without level-shifting components. |
| Medical Imaging Front-End | Test & Measurement Signal Generator |
Use Scenario: Digitizing and preprocessing analog sensor outputs (ECG, EEG) before sending to ARM-based host processor via AXI or PCIe. IC Role / Device Role / Timing Role: Real-time signal conditioner - performs digital filtering, decimation, and channel multiplexing with deterministic latency under 2 µs. Use Value: XC6SLX16-2FTG256I integrates sufficient block RAM for coefficient storage and DSP slices for fixed-point filtering, eliminating external DSP chips in portable diagnostic devices. | Use Scenario: Generating precise arbitrary waveforms (sine, square, pulse) with programmable amplitude, offset, and jitter control for calibration and validation. IC Role / Device Role / Timing Role: Digital waveform synthesizer - uses distributed RAM and LUT-based DDS architecture to produce 12-bit, 100 MS/s output with <1% THD. Use Value: XC6SLX16-2FTG256I offers predictable timing behavior and low-jitter clock routing essential for metrology-grade signal fidelity and repeatable test results. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX9-2FTG256I | Fewer logic cells (9,152), reduced block RAM (576 Kbits unchanged), same package and speed grade | Suitable for simpler control tasks with lower gate count; insufficient for PCIe endpoint or multi-channel video processing | Select when design fits within 9K LUTs and requires identical footprint and thermal rating |
| XC7S15-1CSGA225I | Artix-7 family, higher performance (-1 speed grade), 15K logic cells, 900 Kbits block RAM, smaller 225-pin CSBGAs | Better suited for higher-speed serial protocols (e.g., SATA, USB 2.0 PHY) and larger algorithmic workloads | Choose for new designs needing improved DSP throughput or future-proofing; not pin-compatible with XC6SLX16-2FTG256I |
Compared with XC6SLX9-2FTG256I, the XC6SLX16-2FTG256I adds 5.4K logic cells and full PCIe endpoint capability; compared with XC7S15-1CSGA225I, it trades higher density and newer architecture for mature industrial qualification and proven long-lifecycle availability.
Availability
XC6SLX16-2FTG256I is available at Aetrix Electronics and suitable for industrial automation, automotive ADAS subsystems, and medical instrumentation requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX16-2FTG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops and markets adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded applications.
The Spartan-6 family was designed for cost-sensitive, high-volume applications demanding reliable performance, low power, and long-term availability - especially in industrial control, vision systems, and communications infrastructure.
FAQ
What is the maximum operating frequency of the XC6SLX16-2FTG256I?
The XC6SLX16-2FTG256I is rated for a -2 speed grade, meaning its internal logic paths are guaranteed to operate up to 595 MHz for register-to-register timing and 333 MHz for I/O setup/hold timing under industrial temperature conditions. Actual achievable frequency depends on design complexity, placement, and routing - verified through static timing analysis in Vivado or ISE tools using the XC6SLX16-2FTG256I device model.
Does the XC6SLX16-2FTG256I support JTAG programming?
Yes, the XC6SLX16-2FTG256I fully supports IEEE 1149.1 JTAG boundary-scan programming and debugging. It uses TDI, TDO, TCK, and TMS pins for configuration bitstream loading and real-time logic analysis via ChipScope or similar tools. JTAG mode is enabled by default at power-up and remains active unless disabled via configuration settings in the XC6SLX16-2FTG256I bitstream.
What I/O standards are supported by the XC6SLX16-2FTG256I?
The XC6SLX16-2FTG256I supports LVCMOS18, LVCMOS25, LVCMOS33, LVTTL, PCI, HSTL_I, SSTL18_I, SSTL2_I, and differential standards including LVDS, Mini-LVDS, RSDS, and BLVDS. Each of its six I/O banks can be independently configured for different VCCO voltages, allowing mixed-voltage interfacing without external level shifters in the XC6SLX16-2FTG256I design.
Is the XC6SLX16-2FTG256I qualified for industrial temperature operation?
Yes, the XC6SLX16-2FTG256I carries the 'I' suffix indicating industrial temperature grade (-40°C to +100°C junction temperature). Its thermal design, packaging, and characterization are validated across this full range, making it suitable for deployment in uncontrolled environments such as factory floors, vehicle cabins, and outdoor equipment enclosures where the XC6SLX16-2FTG256I must maintain functional reliability without derating.
Can the XC6SLX16-2FTG256I be used as a PCIe endpoint in embedded systems?
Yes, the XC6SLX16-2FTG256I includes a hard PCIe Gen1 x1 endpoint block compliant with the PCI Express Base Specification v1.1. It supports enumeration, memory-mapped I/O, and DMA transfers without external transceivers or protocol converters - enabling direct integration into host systems where the XC6SLX16-2FTG256I serves as a peripheral accelerator or intelligent I/O controller.
XC6SLX16-2FTG256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1139
- Number of Logic Elements/Cells:
- 14579
- Total RAM Bits:
- 589824
- Number of I/O:
- 186
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC6SLX16-2FTG256I FAQ
1.How can I place an order for XC6SLX16-2FTG256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX16-2FTG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX16-2FTG256I reliable?
The price and inventory of XC6SLX16-2FTG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX16-2FTG256I is usually 5 days.
3.What payment methods are accepted for XC6SLX16-2FTG256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX16-2FTG256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX16-2FTG256I?
XC6SLX16-2FTG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX16-2FTG256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX16-2FTG256I?
For technical support, including XC6SLX16-2FTG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX16-2FTG256I requirements.
6.How does Aetrix verify that XC6SLX16-2FTG256I is sourced from the original manufacturer or authorized distributors?
All XC6SLX16-2FTG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX16-2FTG256I meets industry standards.
7.What is the process for return or replacement of XC6SLX16-2FTG256I?
All XC6SLX16-2FTG256I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX16-2FTG256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX16-2FTG256I part is unused and in its original packaging.
Return procedure for XC6SLX16-2FTG256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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