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AMD XC6SLX16-3CSG225C

Part No.:
XC6SLX16-3CSG225C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
225-LFBGA, CSPBGA
Datasheet:
AetrixXC6SLX16-3CSG225C.pdf
Description:
IC FPGA 160 I/O 225CSBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,211

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Product details

Overview

XC6SLX16-3CSG225C from AMD (formerly Xilinx) is a Spartan-6 FPGA with 14,579 logic cells, 576 Kbits of block RAM, and 186 user I/Os in a 225-pin CSGA package. It operates at -3 speed grade (1.2 V core, 100 MHz system clock), targeting low-power embedded control and industrial interface bridging.

For engineers reviewing the XC6SLX16-3CSG225C datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage flexibility (1.2 V/1.8 V/2.5 V/3.3 V), integrated DSP48A1 slices for arithmetic acceleration, and support for SPI/BPI configuration modes in space-constrained designs.

Technical Context

The XC6SLX16-3CSG225C implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for high-speed arithmetic. It integrates twelve 18×18 multipliers and up to 576 Kbits of distributed and block RAM for local data buffering and FIFO implementation.

Configuration is supported via Master SPI, Slave SPI, or SelectMAP interfaces, with JTAG boundary-scan for debug and programming. The device includes digital clock managers (DCMs) for internal clock synthesis, phase alignment, and frequency multiplication without external PLLs.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells14,579 - provides gate count equivalent for medium-complexity control and protocol logic
Block RAM576 Kbits - supports dual-port buffers, FIFOs, and small lookup tables
User I/Os186 - enables dense peripheral interfacing with mixed-voltage support
Speed Grade-3 - guarantees timing closure up to 100 MHz system clock at 1.2 V core
DSP Slices12 × DSP48A1 - accelerates multiply-accumulate operations for sensor preprocessing
DCM Units4 - delivers jitter-tolerant clock synthesis and phase shifting without external components

Pinout & Package

XC6SLX16-3CSG225C is housed in a 225-ball fine-pitch CSGA (Chip-Scale Grid Array) package with 1.0 mm ball pitch, optimized for compact PCB layouts and thermal performance in industrial enclosures.

Pin/TerminalCircuit RoleDesign Meaning
G1VCCO_0I/O bank 0 power supply - must be set to match connected peripheral voltage (1.2–3.3 V)
K1VCCAUX1.8 V auxiliary supply for configuration circuitry and DCMs
R1VCCINT1.2 V core supply - requires low-noise regulation for stable logic operation
T1PROGRAM_BActive-low asynchronous reset - initiates reconfiguration from external source
U1INIT_BOpen-drain status output - signals configuration completion or error
W1CCLKConfiguration clock input - drives internal bitstream loading during SPI mode

Key Features

FeatureDesign Value
Multi-Voltage I/O BanksSupports independent 1.2 V, 1.8 V, 2.5 V, and 3.3 V I/O standards per bank - simplifies mixed-interface board design
Integrated DCMsFour digital clock managers enable internal clock doubling, phase shift, and duty-cycle correction - eliminates need for external clock ICs
SPI Configuration InterfaceMaster/Slave SPI mode allows direct connection to serial flash - reduces BOM count and boot time vs. parallel PROM
DSP48A1 SlicesTwelve 18×18 multipliers with pre-adders and accumulators - enables real-time FIR filtering and motor control loops

Applications

Industrial PLC I/O ModuleAutomotive Diagnostic Interface

Use Scenario: Modular fieldbus gateway aggregating RS-485, CAN, and digital I/O in factory automation cabinets.

IC Role / Device Role / Timing Role: FPGA acts as protocol translator and real-time sequencer, managing timing-critical I/O sampling and bus arbitration.

Use Value: 186 user I/Os and multi-voltage banks allow direct connection to diverse sensors and actuators without level-shifter ICs.

Use Scenario: OBD-II to USB/CAN FD bridge in vehicle service tools supporting UDS and manufacturer-specific diagnostics.

IC Role / Device Role / Timing Role: FPGA handles CAN message parsing, timestamping, and USB packet framing with deterministic latency.

Use Value: Integrated DCMs ensure precise 125 ns CAN bit timing alignment across temperature, eliminating external oscillator drift compensation.

Medical Sensor HubTest Equipment Pattern Generator

Use Scenario: Portable patient monitor consolidating analog front-end data from ECG, SpO₂, and temperature sensors.

IC Role / Device Role / Timing Role: FPGA performs synchronized ADC sampling, digital filtering, and data packing before transmission over UART or USB.

Use Value: 576 Kbits block RAM enables double-buffered acquisition at 10 kS/s while maintaining real-time responsiveness.

Use Scenario: Benchtop digital pattern generator producing programmable stimulus waveforms for IC validation.

IC Role / Device Role / Timing Role: FPGA implements high-speed state machines and timing engines to drive parallel LVCMOS outputs with sub-ns skew control.

Use Value: -3 speed grade guarantees 100 MHz deterministic timing for 8-bit parallel bus generation with setup/hold compliance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based interface and control applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Xilinx XC6SLX25-3CSG324CHigher logic capacity (24,051 LUTs), 220 I/Os, larger 324-ball CSGA packageBetter suited for designs requiring additional protocol stacks or larger on-chip FIFOsSelect when XC6SLX16-3CSG225C resource utilization exceeds 85% in synthesis reports
Lattice LCMXO3LF-2100C-5BG256CMachXO3L FPGA with 2,100 LUTs, 203 I/Os, 1.2 V core, but no block RAM or DSP slicesTargeted at simple glue logic and I/O expansion, not compute-intensive signal processingChoose for cost-sensitive, low-compute applications where XC6SLX16-3CSG225C resources are significantly underutilized

Compared with XC6SLX16-3CSG225C, XC6SLX25-3CSG324C offers headroom for feature growth but increases PCB area and power; LCMXO3LF-2100C-5BG256C reduces cost and static power but lacks block RAM and DSP capability required for sensor preprocessing or protocol acceleration.

Availability

XC6SLX16-3CSG225C is available at Aetrix Electronics and suitable for industrial control systems, medical instrumentation, and test equipment requiring stable component supply and long-term lifecycle support.

Supply support for XC6SLX16-3CSG225C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for high-performance embedded and datacenter applications.

The Spartan-6 family was originally designed by Xilinx for cost-sensitive, low-power applications requiring reliable I/O interfacing and moderate logic density - ideal for industrial and automotive edge devices.

FAQ

What is the maximum operating temperature for XC6SLX16-3CSG225C?

The XC6SLX16-3CSG225C is rated for commercial temperature range (0 °C to +85 °C ambient). Its CSGA package provides efficient thermal dissipation, enabling sustained operation at full utilization within this range when PCB copper pour and airflow meet Xilinx UG386 guidelines. The XC6SLX16-3CSG225C does not support industrial (-40 °C to +100 °C) or extended temperature grades.

Does XC6SLX16-3CSG225C support JTAG programming?

Yes, XC6SLX16-3CSG225C fully supports IEEE 1149.1 JTAG boundary-scan for programming, debugging, and verification. The TDI, TDO, TCK, TMS, and TRST pins are dedicated for this interface, and configuration can be performed using standard Xilinx iMPACT or Vivado tools. JTAG is active immediately after power-up and remains functional throughout device operation, making XC6SLX16-3CSG225C suitable for field firmware updates.

Can XC6SLX16-3CSG225C configure from a serial NOR flash?

Yes, XC6SLX16-3CSG225C supports Master SPI configuration mode and is compatible with common 3.3 V serial NOR flash devices such as Micron MT25QL series and Winbond W25Qxx. The XC6SLX16-3CSG225C boots automatically upon power-up when M[2:0] pins are set to 001, reading the bitstream from address 0x000000. This eliminates external microcontrollers and reduces boot latency compared to processor-controlled loading.

What I/O standards are supported by XC6SLX16-3CSG225C?

XC6SLX16-3CSG225C supports LVCMOS, LVTTL, PCI, SSTL, HSTL, and differential standards including LVDS and RSDS across its 12 I/O banks. Each bank operates independently at 1.2 V, 1.35 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V, allowing mixed-voltage interfaces on a single XC6SLX16-3CSG225C device. I/O voltage settings are configured per-bank via VCCO pins and constrained in the UCF or XDC file.

Is XC6SLX16-3CSG225C pin-compatible with other Spartan-6 devices?

No, XC6SLX16-3CSG225C is not pin-compatible with other Spartan-6 devices due to differing ball counts and I/O bank arrangements. The 225-ball CSGA footprint is unique to the LX16 and LX25 variants in the CSG225 package option. Migration to XC6SLX25-3CSG324C requires PCB redesign, while downgrading to XC6SLX9-3CSG225C retains the same package but reduces I/O count and logic resources - both require layout verification per Xilinx AR# 51152.

XC6SLX16-3CSG225C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-6 LX
Package/Case:
225-LFBGA, CSPBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
1139
Number of Logic Elements/Cells:
14579
Total RAM Bits:
589824
Number of I/O:
160
Number of Gates:
-
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
225-CSPBGA (13x13)

XC6SLX16-3CSG225C FAQ

1.How can I place an order for XC6SLX16-3CSG225C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC6SLX16-3CSG225C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC6SLX16-3CSG225C reliable?

The price and inventory of XC6SLX16-3CSG225C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX16-3CSG225C is usually 5 days.

3.What payment methods are accepted for XC6SLX16-3CSG225C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX16-3CSG225C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC6SLX16-3CSG225C?

XC6SLX16-3CSG225C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC6SLX16-3CSG225C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC6SLX16-3CSG225C?

For technical support, including XC6SLX16-3CSG225C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX16-3CSG225C requirements.

6.How does Aetrix verify that XC6SLX16-3CSG225C is sourced from the original manufacturer or authorized distributors?

All XC6SLX16-3CSG225C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX16-3CSG225C meets industry standards.

7.What is the process for return or replacement of XC6SLX16-3CSG225C?

All XC6SLX16-3CSG225C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX16-3CSG225C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC6SLX16-3CSG225C part is unused and in its original packaging.

Return procedure for XC6SLX16-3CSG225C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC6SLX16-3CSG225C Tags

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  • XC6SLX16-3CSG225C PDF
  • XC6SLX16-3CSG225C Datasheet
  • XC6SLX16-3CSG225C Specifications
  • XC6SLX16-3CSG225C Images
  • AMD
  • AMD XC6SLX16-3CSG225C
  • Buy XC6SLX16-3CSG225C
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