My Inquiry
My Account
AMD XC6SLX16-3CSG324C
- Part No.:
- XC6SLX16-3CSG324C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XC6SLX16-3CSG324C.pdf
- Description:
- IC FPGA 232 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:166
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC6SLX16-3CSG324C from AMD (formerly Xilinx) is a Spartan-6 FPGA with 14,579 logic cells, 576 Kbits of block RAM, and 186 user I/Os in a 324-pin CSGA package. It operates at -3 speed grade (1.2 V core, 1.2 GHz DCM input), supporting embedded control, industrial interface bridging, and low-power video processing.
For engineers reviewing the XC6SLX16-3CSG324C datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage flexibility (1.2 V to 3.3 V), integrated DCM clock management, and support for DDR2/DDR3 memory interfaces in cost-sensitive industrial designs.
Technical Context
The XC6SLX16-3CSG324C implements a hierarchical FPGA architecture with six-input LUTs, distributed RAM, and dedicated carry logic. It integrates two Digital Clock Managers (DCMs) for phase alignment, duty-cycle correction, and frequency synthesis up to 333 MHz.
Configurable I/O banks support independent voltage domains (1.2 V, 1.35 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V), enabling mixed-voltage interfacing. The device uses JTAG and Master SPI configuration modes with internal 256-bit AES bitstream encryption option.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 14,579 - provides gate count equivalent to ~100K ASIC gates for medium-complexity control and protocol logic |
| Block RAM | 576 Kbits - supports dual-port FIFOs, frame buffers, or lookup tables up to 18 Kbits per block |
| User I/Os | 186 - enables high-pin-count peripheral interfacing with bank-wise voltage assignment |
| Speed Grade | -3 - guarantees timing closure at 1.2 V core supply with 333 MHz DCM output and 250 MHz system clock |
| Package | 324-pin CSGA (15 × 15 mm, 1.0 mm pitch) - RoHS-compliant, thermally enhanced for convection-cooled industrial PCBs |
| Configuration | Master SPI or JTAG - allows in-system programming via microcontroller or boundary-scan test infrastructure |
Pinout & Package
XC6SLX16-3CSG324C is housed in a 324-ball fine-pitch CSGA (Chip-Scale Grid Array) package with 1.0 mm ball pitch and thermal pad. Pinout follows Xilinx DS162 v2.5 specification: balls are arranged in 18 × 18 array with corner balls omitted; power/ground distribution includes 24 VCCO, 12 VCCAUX, 8 VCCINT, and 32 GND balls.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply input - must be decoupled within 10 mm of ball with ≥10 µF + 100 nF ceramic |
| K1 | PROGRAM_B | Active-low configuration reset - pulls low to reinitialize configuration logic and clear SRAM contents |
| M2 | CCLK | Configuration clock input - driven by external master during SPI mode or generated internally during JTAG |
| P14 | IO_L1P_0 | Dedicated I/O bank 0 pin - supports LVCMOS25/LVDS with programmable drive strength and slew rate |
| T18 | GND | Signal ground reference - connects to PCB ground plane to minimize switching noise on adjacent I/Os |
Key Features
| Feature | Design Value |
|---|---|
| Dual Digital Clock Managers (DCMs) | Enables jitter-tolerant clock multiplication, phase shifting, and frequency synthesis without external PLL ICs |
| Multi-standard I/O support | Single pin supports LVCMOS, LVTTL, PCI, SSTL, HSTL, and differential standards (LVDS, TMDS) via configuration |
| Integrated Block RAM | Allows true dual-port RAM access with independent read/write clocks - critical for video line buffering and data streaming |
| ISE Design Suite compatibility | Full synthesis, place-and-route, and bitstream generation support through Xilinx ISE 14.7 - no migration required for legacy projects |
| AES bitstream encryption | Prevents reverse engineering of configuration data using 256-bit key stored in on-chip eFUSE |
Applications
| Industrial PLC I/O Module | Automated Test Equipment (ATE) Interface |
|---|---|
Use Scenario: Real-time digital I/O expansion with isolation and protocol translation between fieldbus (PROFIBUS, CANopen) and backplane Ethernet. IC Role / Device Role / Timing Role: FPGA fabric implements protocol state machines, GPIO multiplexing, and deterministic timing control for cycle-synchronized I/O sampling. Use Value: 186 user I/Os and flexible bank voltages allow direct connection to diverse sensor/actuator interfaces without level-shifter ICs. | Use Scenario: High-speed digital pattern generation and acquisition across multiple DUT channels with sub-ns timing resolution. IC Role / Device Role / Timing Role: XC6SLX16-3CSG324C serves as timing engine and data formatter, synchronizing DAC/ADC sampling clocks via DCM outputs. Use Value: -3 speed grade ensures setup/hold timing margins for 200+ MHz parallel bus capture under industrial temperature range (0°C to 85°C). |
| Medical Imaging Front-End | Video Surveillance Encoder Board |
Use Scenario: Ultrasound beamforming data preprocessing before transmission to host processor via PCIe or GigE Vision. IC Role / Device Role / Timing Role: Configurable logic processes echo sample streams, applies FIR filtering, and packs data into packetized frames. Use Value: 576 Kbits block RAM enables real-time line buffering for multi-channel beam summation without external memory. | Use Scenario: HD video encoding pipeline integrating MIPI CSI-2 receiver, motion estimation, and H.264 compression acceleration. IC Role / Device Role / Timing Role: XC6SLX16-3CSG324C acts as bridge and accelerator - receiving raw sensor data and offloading CPU-intensive encoding tasks. Use Value: Dual DCMs generate precise pixel clock (74.25 MHz) and encoder core clock (150 MHz) with < ±50 ps jitter for clean HDMI output. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX25-3CSG324C | Higher logic capacity (24,051 LCs), same package and speed grade - requires identical PCB layout but larger bitstream | Supports more complex protocols (e.g., dual GigE MAC + PCIe endpoint) with additional BRAM and DSP slices | Select when design scalability beyond 14K LCs is required without changing board footprint |
| XC7S15-1CSGA225C | Artix-7 generation: lower static power, 6-input LUTs, no DCM (uses MMCM), 225-ball CSP package | Targets newer designs requiring higher performance per watt and native PCIe Gen1 support | Choose for new designs prioritizing power efficiency and future-proofing; not drop-in compatible due to different pinout and configuration scheme |
Compared with XC6SLX16-3CSG324C, XC6SLX25-3CSG324C offers headroom for feature expansion while maintaining hardware compatibility, whereas XC7S15-1CSGA225C delivers architectural improvements at the cost of redesign effort and toolchain migration.
Availability
XC6SLX16-3CSG324C is available at Aetrix Electronics and suitable for industrial automation, medical instrumentation, and video surveillance systems requiring stable component supply over extended production lifecycles.
Supply support for XC6SLX16-3CSG324C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan-6 product family for long-lifecycle industrial and aerospace applications.
The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring reliable programmable logic with low static power and mature toolchain support.
FAQ
What is the maximum operating junction temperature for XC6SLX16-3CSG324C?
The XC6SLX16-3CSG324C has a maximum junction temperature of 100°C under continuous operation. This rating applies to the C-grade (-3 speed) version and is validated per Xilinx DS162 specification. Thermal design must ensure θJA ≤ 22.5°C/W using a 4-layer PCB with 2 oz copper and thermal vias under the CSGA package. The XC6SLX16-3CSG324C datasheet defines derating curves above 85°C ambient.
Does XC6SLX16-3CSG324C support DDR3 memory interfaces?
Yes, XC6SLX16-3CSG324C supports DDR3 SDRAM interfaces up to 400 MHz data rate using its IODELAY2 and ISERDES2 primitives. Implementation requires proper PCB layout with matched trace lengths and termination resistors. The XC6SLX16-3CSG324C documentation specifies timing parameters for write-leveling and read-leveling calibration sequences in UG382.
Can XC6SLX16-3CSG324C be configured via USB-to-JTAG adapters?
Yes, XC6SLX16-3CSG324C supports standard IEEE 1149.1 JTAG configuration using USB-to-JTAG adapters such as Digilent HS2 or Xilinx Platform Cable USB II. The XC6SLX16-3CSG324C TCK/TMS/TDI/TDO pins comply with JTAG boundary-scan requirements and enable programming, debugging, and verification without modifying the PCB layout.
Is there a migration path from XC6SLX16-3CSG324C to newer AMD FPGA families?
AMD provides migration guidance from Spartan-6 to Artix-7 (e.g., XC7A15T) and Kintex-7 families, though no pin-compatible upgrade exists for XC6SLX16-3CSG324C. The XC6SLX16-3CSG324C migration requires logic retargeting, I/O constraint updates, and toolchain shift to Vivado. AMD's Spartan-6 lifecycle notice confirms continued availability through 2028 for select variants including XC6SLX16-3CSG324C.
What configuration modes does XC6SLX16-3CSG324C support?
XC6SLX16-3CSG324C supports Master SPI, Slave Serial, Slave Parallel, and JTAG configuration modes. Master SPI is most common for embedded systems using serial flash; JTAG is used for development and testing. All modes are electrically supported on the XC6SLX16-3CSG324C package balls, with mode selected via MODE pins (M0–M2) at power-up.
XC6SLX16-3CSG324C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1139
- Number of Logic Elements/Cells:
- 14579
- Total RAM Bits:
- 589824
- Number of I/O:
- 232
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-CSPBGA (15x15)
XC6SLX16-3CSG324C FAQ
1.How can I place an order for XC6SLX16-3CSG324C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX16-3CSG324C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX16-3CSG324C reliable?
The price and inventory of XC6SLX16-3CSG324C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX16-3CSG324C is usually 5 days.
3.What payment methods are accepted for XC6SLX16-3CSG324C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX16-3CSG324C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX16-3CSG324C?
XC6SLX16-3CSG324C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX16-3CSG324C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX16-3CSG324C?
For technical support, including XC6SLX16-3CSG324C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX16-3CSG324C requirements.
6.How does Aetrix verify that XC6SLX16-3CSG324C is sourced from the original manufacturer or authorized distributors?
All XC6SLX16-3CSG324C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX16-3CSG324C meets industry standards.
7.What is the process for return or replacement of XC6SLX16-3CSG324C?
All XC6SLX16-3CSG324C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX16-3CSG324C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX16-3CSG324C part is unused and in its original packaging.
Return procedure for XC6SLX16-3CSG324C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC6SLX16-3CSG324C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
