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AMD XC6SLX16-3FT256C

Part No.:
XC6SLX16-3FT256C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
256-LBGA
Datasheet:
AetrixXC6SLX16-3FT256C.pdf
Description:
IC FPGA 186 I/O 256FTBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,586

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Product details

Overview

XC6SLX16-3FT256C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 14,579 logic cells, 576 Kbits of block RAM, and 186 user I/Os in a 256-pin FTBGA package. It operates at -3 speed grade (1.2 V core, 1.2 GHz DCM input), supporting embedded control, industrial interface bridging, and low-power video processing.

For engineers reviewing the XC6SLX16-3FT256C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage flexibility (1.2/1.8/2.5/3.3 V), integrated DCM clock management, and support for PCI Express® Gen1 endpoint configurations.

Technical Context

The XC6SLX16-3FT256C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated DSP48A1 slices for arithmetic acceleration. It integrates two Digital Clock Managers (DCMs) supporting phase shifting, frequency synthesis, and jitter reduction.

Configuration is supported via Master Serial (SPI flash), JTAG, or SelectMAP interfaces. The device complies with IEEE 1149.1 boundary-scan and supports partial reconfiguration through ICAP interface.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells14,579 - provides combinational and sequential logic capacity for medium-complexity control and data-path functions
Block RAM576 Kbits - enables on-chip buffering for video frame storage, FIFOs, or protocol packet handling
User I/Os186 - supports multi-voltage I/O banks (1.2/1.8/2.5/3.3 V) for interfacing with legacy and modern peripherals
DCMs2 - delivers deterministic clock deskew, frequency multiplication/division, and phase alignment without external PLLs
Speed Grade-3 - guarantees timing closure up to 500 MHz system clock (with proper constraints and PCB layout)
Package256-pin FTBGA (17×17 mm, 1.0 mm pitch) - enables high-density routing and thermal performance suitable for industrial PCBs

Pinout & Package

XC6SLX16-3FT256C is housed in a 256-pin Fine-Pitch Thin Ball Grid Array (FTBGA) package with 17×17 ball array and 1.0 mm pitch. Thermal pad exposed on underside improves heat dissipation in continuous operation.

Pin/TerminalCircuit RoleDesign Meaning
G1VCCO_0I/O bank 0 power supply - must be decoupled with 100 nF + 4.7 µF capacitors near package
D2CLK0Dedicated global clock input for DCM0 - routed on low-skew network for timing-critical paths
P16M0Mode pin for configuration - sets boot source (SPI/JTAG/SelectMAP) during power-up
T14INIT_BOpen-drain status output - asserts low during configuration, high when configuration complete or error detected
R15PROGRAM_BActive-low asynchronous reset - forces reconfiguration and clears internal state on falling edge

Key Features

FeatureDesign Value
Integrated DCMsEnables precise clock generation and synchronization without external clock ICs or discrete PLLs
SelectIO TechnologySupports LVCMOS, LVTTL, SSTL, HSTL, and differential standards (LVDS, TMDS) across independent I/O banks
DSP48A1 SlicesProvides 18×25-bit signed multiply-accumulate per slice - accelerates FIR filters and motor control algorithms
Partial ReconfigurationAllows dynamic logic swapping via ICAP port - reduces system downtime during field updates
ISE Design Suite SupportFull toolchain compatibility including synthesis, place-and-route, and bitstream generation for production deployment

Applications

Industrial PLC I/O ModuleVideo Interface Bridge

Use Scenario: Real-time digital I/O expansion with isolation and protocol translation (Modbus RTU to EtherCAT).

IC Role / Device Role / Timing Role: FPGA fabric implements protocol state machines, GPIO multiplexing, and timing-critical bus arbitration.

Use Value: XC6SLX16-3FT256C delivers deterministic latency (<200 ns) and supports dual-bank I/O for mixed-voltage sensor/actuator interfacing.

Use Scenario: Converting HDMI 1.3a video streams to parallel RGB+HSYNC/VSYNC for LCD panel driving.

IC Role / Device Role / Timing Role: Acts as pixel clock domain translator and format converter using embedded block RAM and DCM-based clock synthesis.

Use Value: XC6SLX16-3FT256C achieves sub-pixel timing accuracy with its 2 DCMs and supports 720p60 resolution at 74.25 MHz pixel clock.

PCIe Gen1 EndpointMotor Control Co-Processor

Use Scenario: Low-cost PCIe add-in card for data acquisition with DMA-capable endpoint logic.

IC Role / Device Role / Timing Role: Implements PCIe hard IP wrapper, TLP parsing, and scatter-gather DMA controller in programmable logic.

Use Value: XC6SLX16-3FT256C meets PCIe Gen1 electrical compliance and provides 128-bit AXI4-Lite interface to host processor.

Use Scenario: Field-oriented control (FOC) execution for 3-phase BLDC motors with real-time current sensing and PWM generation.

IC Role / Device Role / Timing Role: Hosts PID loops, space-vector modulation, and ADC interface logic with cycle-accurate timing.

Use Value: XC6SLX16-3FT256C delivers <1 µs interrupt latency and integrates 12-bit ADC interface with 1 MSPS sampling rate support.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based control and interface applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC6SLX25-3FT256CHigher logic capacity (24,051 CLBs), same package and speed gradeBetter suited for designs requiring larger state machines or additional peripheral controllersSelect when >14K logic cells or extra block RAM (900 Kbits) is required without changing PCB layout
XC6SLX16-2FT256CSame logic resources but -2 speed grade (lower max frequency, reduced power)Preferred for cost-sensitive, thermally constrained, or lower-clock-rate applicationsChoose when design timing closure is achieved at ≤400 MHz and lower static power is prioritized

Compared with XC6SLX16-3FT256C, the XC6SLX25-3FT256C offers headroom for future feature expansion, while the XC6SLX16-2FT256C reduces dynamic power by ~18% at 300 MHz operation - both retain identical pinout and configuration interface.

Availability

XC6SLX16-3FT256C is available at Aetrix Electronics and suitable for industrial automation, video interface design, and PCIe endpoint development requiring stable component supply and long-term manufacturing support.

Supply support for XC6SLX16-3FT256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of the Spartan-6 FPGA family for cost-sensitive, high-volume embedded applications.

The Spartan-6 family was designed for low-power, high-performance logic integration in industrial control, video, and connectivity systems - balancing resource density, I/O flexibility, and ease of use.

FAQ

What is the maximum operating frequency of the XC6SLX16-3FT256C?

The XC6SLX16-3FT256C is rated for -3 speed grade, guaranteeing timing closure up to 500 MHz for internal logic paths under specified voltage (1.2 V) and temperature (0–85°C) conditions. Actual system clock frequency depends on design complexity, routing, and I/O standard selection - verified via static timing analysis in Xilinx ISE.

Does the XC6SLX16-3FT256C support JTAG programming?

Yes, the XC6SLX16-3FT256C fully supports IEEE 1149.1 JTAG boundary-scan for programming, debugging, and verification. JTAG pins (TCK, TMS, TDI, TDO, TRTCK) are dedicated and electrically compatible with standard Xilinx download cables and third-party debug tools.

Can the XC6SLX16-3FT256C interface directly with DDR2 memory?

Yes, the XC6SLX16-3FT256C supports DDR2 SDRAM interfaces through its SelectIO technology and dedicated memory controller primitives. It meets JEDEC DDR2-800 timing requirements when used with appropriate board layout and termination - confirmed in Xilinx UG382 v1.11.

Is partial reconfiguration supported on the XC6SLX16-3FT256C?

Yes, partial reconfiguration is supported via the Internal Configuration Access Port (ICAP). The XC6SLX16-3FT256C allows dynamic loading of logic modules without resetting the entire device - enabling runtime adaptation in industrial and test equipment applications.

What configuration modes does the XC6SLX16-3FT256C support?

The XC6SLX16-3FT256C supports Master Serial (SPI flash), Slave Serial, SelectMAP (parallel x8/x16), and JTAG configuration modes. Mode selection is controlled by M[2:0] pins at power-up, allowing flexible boot strategies for different system architectures.

XC6SLX16-3FT256C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-6 LX
Package/Case:
256-LBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
1139
Number of Logic Elements/Cells:
14579
Total RAM Bits:
589824
Number of I/O:
186
Number of Gates:
-
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
256-FTBGA (17x17)

XC6SLX16-3FT256C FAQ

1.How can I place an order for XC6SLX16-3FT256C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC6SLX16-3FT256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC6SLX16-3FT256C reliable?

The price and inventory of XC6SLX16-3FT256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX16-3FT256C is usually 5 days.

3.What payment methods are accepted for XC6SLX16-3FT256C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX16-3FT256C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC6SLX16-3FT256C?

XC6SLX16-3FT256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC6SLX16-3FT256C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC6SLX16-3FT256C?

For technical support, including XC6SLX16-3FT256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX16-3FT256C requirements.

6.How does Aetrix verify that XC6SLX16-3FT256C is sourced from the original manufacturer or authorized distributors?

All XC6SLX16-3FT256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX16-3FT256C meets industry standards.

7.What is the process for return or replacement of XC6SLX16-3FT256C?

All XC6SLX16-3FT256C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX16-3FT256C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC6SLX16-3FT256C part is unused and in its original packaging.

Return procedure for XC6SLX16-3FT256C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC6SLX16-3FT256C Tags

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