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AMD XC6SLX16-3FTG256C
- Part No.:
- XC6SLX16-3FTG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC6SLX16-3FTG256C.pdf
- Description:
- IC FPGA 186 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,855
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Product details
Overview
XC6SLX16-3FTG256C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 14,579 logic cells, 18 Kbits of block RAM, and 108 user I/Os in a 256-pin FTBGA package. It operates at -3 speed grade (1.2 V core, 1.2 GHz max I/O toggle rate) and targets cost-sensitive industrial control and embedded vision interfaces.
For engineers reviewing the XC6SLX16-3FTG256C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage flexibility (1.2/1.8/2.5/3.3 V), integrated DSP48A1 slices for filtering, and support for DDR2/DDR3 memory interfaces with dedicated clocking resources.
Technical Context
The XC6SLX16-3FTG256C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated carry chains for arithmetic. It integrates six Digital Clock Managers (DCMs) and phase-matched digital clock managers for jitter reduction and clock synthesis across multiple domains.
It supports SelectIO™ technology with programmable drive strength, slew rate, and on-chip termination (up to 50 Ω). Configuration is performed via SPI serial PROM, JTAG, or master/slave parallel modes using internal configuration memory.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 14,579 - total available LUT-based logic resources for combinational and sequential logic implementation |
| Block RAM | 18 Kbits - distributed across 32 × 512-bit dual-port RAM blocks for data buffering and FIFOs |
| User I/Os | 108 - configurable single-ended or differential I/Os supporting multiple voltage standards |
| Speed Grade | -3 - guarantees timing closure at 1.2 V core supply with worst-case junction temperature of 85°C |
| DSP Slices | 32 × DSP48A1 - fixed-point multiply-accumulate units enabling real-time FIR/IIR filtering |
| Config Memory | Internal - non-volatile configuration memory enables single-chip boot without external PROM |
Pinout & Package
XC6SLX16-3FTG256C is housed in a 256-ball Fine-Pitch Thin BGA (FTBGA) package with 1.0 mm ball pitch and 17 × 17 array. The package supports reflow soldering and meets JEDEC MO-255 standards.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCO_0 | I/O bank power | Supplies 1.2/1.8/2.5/3.3 V to Bank 0 I/Os; must match signal voltage standard |
| VCCAUX | Auxiliary power | Provides 2.5 V to configuration circuitry, DCMs, and JTAG interface |
| VCCINT | Core power | 1.2 V supply for CLBs, interconnect, and internal logic; requires low-noise regulation |
| PROGRAM_B | Configuration control | Active-low input that initiates configuration reset and reloads bitstream from external source |
| DONE | Status indicator | Open-drain output signaling successful configuration completion and release of I/Os |
Key Features
| Feature | Design Value |
|---|---|
| Integrated DCMs | Six fully digital clock managers provide frequency synthesis, phase shifting, and duty-cycle correction without external components |
| SelectIO™ Technology | Per-pin I/O standard assignment enables mixed-voltage interfaces on same bank with programmable termination |
| DSP48A1 Slices | 32 dedicated arithmetic units deliver 18 × 25-bit signed multiplication and accumulation per cycle for real-time signal processing |
| Memory Interface Support | Hardened logic and dedicated clock routing enable reliable DDR2/DDR3 SDRAM interfaces up to 800 Mbps data rate |
Applications
| Industrial PLC I/O Module | Embedded Vision Preprocessing |
|---|---|
Use Scenario: Real-time digital I/O expansion and protocol bridging (Modbus RTU to EtherCAT) in compact PLC chassis. IC Role / Device Role / Timing Role: FPGA fabric implements custom state machines and timing-critical serial protocol engines with sub-microsecond latency. Use Value: XC6SLX16-3FTG256C delivers deterministic I/O response and multi-protocol concurrency within 256-ball footprint and industrial temperature range. | Use Scenario: On-camera image enhancement pipeline including Bayer demosaicing, gamma correction, and edge sharpening before JPEG encoding. IC Role / Device Role / Timing Role: XC6SLX16-3FTG256C processes raw sensor data in-line using pipelined DSP48A1 slices and block RAM buffers. Use Value: XC6SLX16-3FTG256C enables low-latency, power-efficient preprocessing without offloading to host CPU or requiring external memory bandwidth. |
| Medical Ultrasound Beamformer | Automotive ADAS Sensor Hub |
Use Scenario: Time-aligned channel delay and summation for phased-array ultrasound transducers with 64-channel parallel processing. IC Role / Device Role / Timing Role: XC6SLX16-3FTG256C implements synchronized digital delay lines and coherent summing logic with precise clock domain crossing. Use Value: XC6SLX16-3FTG256C provides deterministic sub-nanosecond timing alignment across all 64 channels using dedicated DCM outputs. | Use Scenario: Aggregation and preprocessing of radar, camera, and ultrasonic sensor data in Tier-1 automotive ECU with ASIL-B functional safety requirements. IC Role / Device Role / Timing Role: XC6SLX16-3FTG256C serves as sensor fusion preprocessor with configurable I/O for heterogeneous sensor interfaces and built-in CRC checking. Use Value: XC6SLX16-3FTG256C supports dual-lockstep monitoring mode and ECC-capable configuration memory for fault detection in safety-critical paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX9-2FTG256C | Fewer logic cells (9,152), no DSP48A1 slices, lower speed grade (-2) | Limited to simpler control logic; insufficient for real-time filtering or DDR3 interface | Select when design fits within reduced resource budget and avoids high-speed memory or arithmetic-intensive functions |
| XC7S15-1CSGA225C | Artix-7 family; higher logic density (12,800 LUTs), 70 DSP slices, native PCIe Gen1 endpoint support | Requires updated toolchain (Vivado vs ISE), larger package (225-pin CSBGA), higher static power | Choose for future-proofing, higher throughput, or integration of PCIe, but expect layout and firmware migration effort |
Compared with XC6SLX16-3FTG256C, XC6SLX9-2FTG256C trades performance and features for lower cost and power, while XC7S15-1CSGA225C offers architectural upgrades at the expense of legacy toolchain compatibility and increased board area.
Availability
XC6SLX16-3FTG256C is available at Aetrix Electronics and suitable for industrial automation, embedded vision, medical imaging, and automotive sensor interface designs requiring stable component supply and long-term manufacturing continuity.
Supply support for XC6SLX16-3FTG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for hardware-accelerated systems.
The Spartan-6 family was designed for cost-optimized, high-volume applications demanding low-power logic implementation, embedded processing, and flexible I/O interfacing in industrial and consumer equipment.
FAQ
What is the maximum supported I/O voltage for XC6SLX16-3FTG256C?
XC6SLX16-3FTG256C supports I/O voltages of 1.2 V, 1.8 V, 2.5 V, and 3.3 V per bank, with each bank independently configurable. This allows mixed-voltage operation on a single device, such as interfacing with both 3.3 V sensors and 1.8 V memory devices simultaneously without level shifters.
Does XC6SLX16-3FTG256C include on-chip memory for configuration storage?
No, XC6SLX16-3FTG256C does not include non-volatile configuration memory. It requires an external SPI flash PROM or other configuration source. Configuration is loaded at power-up via Master Serial or JTAG mode, and the bitstream resides in volatile SRAM-based configuration memory.
Can XC6SLX16-3FTG256C interface directly with DDR3 SDRAM?
Yes, XC6SLX16-3FTG256C supports DDR3 SDRAM interfaces up to 800 Mbps data rate using its dedicated clock routing, IODELAY2 primitives, and source-synchronous capture logic. Implementation requires proper PCB layout, calibration, and use of Xilinx MIG v3.7 or later IP core.
What development tools are required to program XC6SLX16-3FTG256C?
XC6SLX16-3FTG256C is supported exclusively by Xilinx ISE Design Suite 14.7. Vivado does not support Spartan-6 devices. Programming requires ISE Project Navigator for synthesis and place-and-route, iMPACT for bitstream generation and configuration, and compatible JTAG cables (e.g., Platform Cable USB II).
Is XC6SLX16-3FTG256C qualified for extended temperature operation?
XC6SLX16-3FTG256C is rated for commercial temperature range (0°C to +85°C). The "C" suffix denotes commercial grade; industrial-grade variants (e.g., XC6SLX16-3FTG256I) are available with -40°C to +100°C operation and different speed binning.
XC6SLX16-3FTG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1139
- Number of Logic Elements/Cells:
- 14579
- Total RAM Bits:
- 589824
- Number of I/O:
- 186
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC6SLX16-3FTG256C FAQ
1.How can I place an order for XC6SLX16-3FTG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX16-3FTG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX16-3FTG256C reliable?
The price and inventory of XC6SLX16-3FTG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX16-3FTG256C is usually 5 days.
3.What payment methods are accepted for XC6SLX16-3FTG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX16-3FTG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX16-3FTG256C?
XC6SLX16-3FTG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX16-3FTG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX16-3FTG256C?
For technical support, including XC6SLX16-3FTG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX16-3FTG256C requirements.
6.How does Aetrix verify that XC6SLX16-3FTG256C is sourced from the original manufacturer or authorized distributors?
All XC6SLX16-3FTG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX16-3FTG256C meets industry standards.
7.What is the process for return or replacement of XC6SLX16-3FTG256C?
All XC6SLX16-3FTG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX16-3FTG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX16-3FTG256C part is unused and in its original packaging.
Return procedure for XC6SLX16-3FTG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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