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AMD XC6SLX16-3FTG256I
- Part No.:
- XC6SLX16-3FTG256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC6SLX16-3FTG256I.pdf
- Description:
- IC FPGA 186 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:699
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Product details
Overview
XC6SLX16-3FTG256I from AMD (formerly Xilinx) is a Spartan-6 FPGA with 14,579 logic cells, 576 Kbits of block RAM, and 186 user I/Os in a 256-pin FTBGA package. It operates at -3 speed grade (1.2 V core, industrial temperature range -40°C to +100°C) and targets cost-sensitive embedded control and interface bridging applications.
For engineers reviewing the XC6SLX16-3FTG256I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, block RAM depth, differential signaling support (LVDS), and industrial-grade thermal reliability.
Technical Context
The XC6SLX16-3FTG256I implements a hierarchical FPGA architecture with six-input LUTs, dedicated carry logic, and integrated DSP48A1 slices for arithmetic acceleration. It supports SelectIO standards including LVCMOS, LVTTL, LVDS, and SSTL, with programmable slew rate and drive strength per bank.
Configuration is performed via Master SPI or JTAG, with dual-boot capability using external serial flash. The device includes internal oscillator, power-on reset circuitry, and IEEE 1149.1 boundary-scan support for testability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 14,579 - determines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 576 Kbits - supports FIFOs, buffers, or small lookup tables without external memory |
| User I/Os | 186 - enables high-density peripheral interfacing with bank-wise voltage flexibility |
| Speed Grade | -3 - guarantees timing closure up to 667 Mbps DDR3 data rate and 333 MHz system clock |
| Operating Temp | -40°C to +100°C - qualified for industrial environments without derating |
| Core Voltage | 1.2 V ±3% - requires tight-regulation DC-DC supply with low ripple |
Pinout & Package
XC6SLX16-3FTG256I is housed in a 256-pin Fine-Pitch Thin BGA (FTBGA) package with 1.0 mm ball pitch, 17 × 17 array, and 1.2 mm height. Package conforms to JEDEC MO-255 standard and supports reflow soldering per IPC/JEDEC J-STD-020.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - sets output voltage level for pins A1–D12 |
| K1 | VCCAUX | 1.8 V auxiliary supply - powers configuration logic, PLLs, and transceivers |
| T1 | GND | Ground reference - required for signal integrity and thermal dissipation |
| R2 | PROGRAM_B | Active-low configuration initiator - pulls low to reset and reload bitstream |
| P3 | DONE | Open-drain status indicator - goes high when configuration completes successfully |
Key Features
| Feature | Design Value |
|---|---|
| DSP48A1 Slices | 32 dedicated arithmetic units - enable real-time FIR filtering or FFT without LUT resource overhead |
| SelectIO Standards | LVDS, SSTL, HSTL, LVCMOS - allow direct connection to DDR2/DDR3, camera sensors, and industrial buses |
| Embedded Memory | 18 × 36 Kbit block RAMs - configurable as dual-port RAM or shift register for pipeline buffering |
| PLL Clock Management | 2 integrated PLLs - generate multiple phase-aligned clocks from single input, supporting video pixel clocking |
Applications
| Industrial PLC I/O Module | Video Interface Bridge |
|---|---|
Use Scenario: Real-time digital I/O expansion with fieldbus protocol handling in compact PLC chassis. IC Role / Device Role / Timing Role: FPGA fabric implements custom state machines and parallel I/O scanning logic; PLL generates precise 10 kHz scan clock. Use Value: 186 user I/Os consolidate discrete logic and reduce board layer count versus CPLD-based solutions. | Use Scenario: Converting MIPI CSI-2 camera output to parallel BT.656 video stream for FPGA-based vision processor. IC Role / Device Role / Timing Role: Deserializes high-speed MIPI lanes using SelectIO LVDS receivers; synchronizes pixel data with embedded block RAM buffers. Use Value: DSP48A1 slices perform real-time gamma correction before frame buffering, eliminating external ASIC. |
| Medical Sensor Hub | Communications Backplane Controller |
Use Scenario: Aggregating analog sensor data (ECG, SpO₂) via ADC interfaces and applying digital filtering before transmission. IC Role / Device Role / Timing Role: Configurable logic routes multi-channel ADC streams; block RAM stores filter coefficients and intermediate samples. Use Value: Industrial temperature rating ensures stable operation inside sealed medical enclosures without active cooling. | Use Scenario: Managing slot-level presence detection, power sequencing, and hot-swap control on modular telecom backplanes. IC Role / Device Role / Timing Role: Implements JTAG boundary-scan controller and I²C master for PMBus-compliant power management ICs. Use Value: Dual-boot capability allows safe firmware updates without system downtime during field maintenance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX16-2FTG256C | Speed grade -2 (slower max frequency), commercial temp range (0°C to +85°C) | Limited to non-industrial environments; lower static power consumption | Choose for cost-sensitive consumer or lab equipment where extended temperature is unnecessary |
| XC6SLX25-3FTG256I | Higher logic density (24,051 cells), same package and speed grade | Supports larger state machines and additional peripheral interfaces without PCB change | Choose when design scalability or future feature expansion is required within same footprint |
Compared with XC6SLX16-3FTG256I, the -2C variant trades industrial reliability for lower cost and power, while the LX25-3I offers headroom for logic growth-both retain identical pinout and configuration interface, enabling reuse of PCB layout and boot firmware.
Availability
XC6SLX16-3FTG256I is available at Aetrix Electronics and suitable for industrial automation, medical edge devices, and communications infrastructure requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX16-3FTG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous compute acceleration.
The Spartan-6 family was designed for high-volume, cost-optimized applications demanding low-power logic fabric, flexible I/O, and industrial-grade reliability-targeting embedded control, display, and connectivity subsystems.
FAQ
What is the configuration mode supported by XC6SLX16-3FTG256I?
The XC6SLX16-3FTG256I supports Master SPI, Slave Serial, and JTAG configuration modes. Master SPI is most common for production systems using external quad-SPI flash; JTAG is used for debugging and programming during development. The XC6SLX16-3FTG256I does not support BPI or NAND flash boot modes.
Does XC6SLX16-3FTG256I include built-in transceivers?
No, the XC6SLX16-3FTG256I does not include high-speed serial transceivers. It relies on its SelectIO technology for parallel and low-speed differential signaling (e.g., LVDS at up to 1 Gbps). For multi-gigabit serial links, designers must select higher-density Spartan-6 variants like XC6SLX45 or use external PHYs with the XC6SLX16-3FTG256I.
What is the maximum operating frequency of XC6SLX16-3FTG256I?
The XC6SLX16-3FTG256I is rated for a system clock frequency up to 333 MHz and DDR3 data rates up to 667 Mbps under industrial conditions. Actual achievable frequency depends on design complexity, routing, and timing constraints; synthesis reports from Vivado or ISE tools must be used to verify timing closure for each implementation.
Can XC6SLX16-3FTG256I be reprogrammed in-system?
Yes, the XC6SLX16-3FTG256I supports in-system programming via JTAG or SPI interface. Its configuration memory is SRAM-based and volatile, so it loads a new bitstream on every power-up. External non-volatile memory (e.g., SPI flash) stores the bitstream, and the XC6SLX16-3FTG256I automatically loads it during startup unless interrupted by PROGRAM_B assertion.
What power supply rails are required for XC6SLX16-3FTG256I?
The XC6SLX16-3FTG256I requires three primary supplies: 1.2 V for core logic (VCCINT), 1.8 V for auxiliary circuits (VCCAUX), and bank-specific I/O voltages (VCCO, 1.2–3.3 V). Each rail must meet AMD's specified tolerance, ripple, and sequencing requirements-especially VCCAUX powering up before or simultaneously with VCCINT to avoid configuration failure.
XC6SLX16-3FTG256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1139
- Number of Logic Elements/Cells:
- 14579
- Total RAM Bits:
- 589824
- Number of I/O:
- 186
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC6SLX16-3FTG256I FAQ
1.How can I place an order for XC6SLX16-3FTG256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX16-3FTG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX16-3FTG256I reliable?
The price and inventory of XC6SLX16-3FTG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX16-3FTG256I is usually 5 days.
3.What payment methods are accepted for XC6SLX16-3FTG256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX16-3FTG256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX16-3FTG256I?
XC6SLX16-3FTG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX16-3FTG256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX16-3FTG256I?
For technical support, including XC6SLX16-3FTG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX16-3FTG256I requirements.
6.How does Aetrix verify that XC6SLX16-3FTG256I is sourced from the original manufacturer or authorized distributors?
All XC6SLX16-3FTG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX16-3FTG256I meets industry standards.
7.What is the process for return or replacement of XC6SLX16-3FTG256I?
All XC6SLX16-3FTG256I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX16-3FTG256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX16-3FTG256I part is unused and in its original packaging.
Return procedure for XC6SLX16-3FTG256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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