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AMD XC6SLX16-L1CSG324C
- Part No.:
- XC6SLX16-L1CSG324C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XC6SLX16-L1CSG324C.pdf
- Description:
- IC FPGA 232 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,879
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Product details
Overview
XC6SLX16-L1CSG324C from AMD (formerly Xilinx) is a Spartan-6 FPGA with 14,579 logic cells, 576 Kbits of block RAM, and 186 user I/Os in a 324-pin CSGA package. It operates at -1 speed grade (1.2 V core, industrial temperature range), supporting embedded control, digital signal processing, and interface bridging in space-constrained industrial systems.
For engineers reviewing the XC6SLX16-L1CSG324C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, block RAM depth, LVDS support, configuration mode compatibility, and thermal performance under sustained logic utilization.
Technical Context
The XC6SLX16-L1CSG324C implements a configurable logic fabric based on 6-input LUTs and distributed RAM, paired with 18 DSP48A1 slices for arithmetic-intensive tasks. It supports SelectIO standards including LVCMOS, LVTTL, LVDS, and TMDS up to 1.0 Gbps per differential pair.
Configuration is performed via Master SPI, Slave Serial, or JTAG modes using external PROM or processor-controlled initialization. Built-in clock management includes two DCMs (Digital Clock Managers) with phase shifting, frequency synthesis, and duty cycle correction capabilities.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 14,579 - determines maximum combinational/sequential logic capacity for state machines or data path implementation |
| Block RAM | 576 Kbits - supports dual-port FIFOs, coefficient storage, or frame buffers up to 18 K × 32-bit depth |
| User I/Os | 186 - enables high-density peripheral interfacing with bank-wise voltage flexibility (1.2–3.3 V) |
| DSP Slices | 18 - provides dedicated 18 × 18 multiplier-accumulators for filtering or motor control algorithms |
| DCMs | 2 - delivers jitter-tolerant clock synthesis and phase alignment across multiple clock domains |
| Speed Grade | -1 - guarantees timing closure at 1.2 V core supply with operation up to 800 MHz internal clocking |
Pinout & Package
XC6SLX16-L1CSG324C uses a 324-ball fine-pitch CSP (CSGA) package with 1.0 mm ball pitch, designed for low-inductance routing and thermal dissipation in compact PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - sets output voltage level for pins A1–D12 in Bank 0 |
| K1 | VCCAUX | Analog auxiliary supply - powers configuration circuitry, DCMs, and JTAG interface |
| M1 | GND | Ground reference - required for signal integrity and thermal conduction to PCB plane |
| P1 | PROGRAM_B | Active-low configuration initiator - forces reconfiguration when pulsed low after power-up |
| T1 | CCLK | Configuration clock input - drives serial bitstream loading from external SPI PROM |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Memory Controller | Supports DDR2/DDR3 SDRAM interfaces up to 800 Mbps with built-in calibration logic |
| SelectIO Technology | Enables mixed-voltage I/O banks with programmable drive strength and slew rate control |
| Embedded Security | Includes bitstream encryption via AES-128 and HMAC authentication for secure configuration |
| Low-Power Architecture | Dynamic power gating reduces static current to ≤ 50 µA in suspend mode |
Applications
| Industrial PLC I/O Module | Automotive Camera Interface Bridge |
|---|---|
Use Scenario: Real-time digital I/O expansion with deterministic scan cycles and fieldbus protocol offload. IC Role / Device Role / Timing Role: FPGA acts as protocol-aware logic engine handling Modbus RTU framing, CRC validation, and GPIO multiplexing. Use Value: Enables 186-channel I/O consolidation with sub-10 µs input-to-output latency and isolated bank voltage control. | Use Scenario: Converting MIPI CSI-2 camera streams to parallel BT.656 video for legacy display controllers. IC Role / Device Role / Timing Role: FPGA performs deserialization, pixel reordering, and clock domain crossing between 1.5 Gbps MIPI and 27 MHz BT.656 domains. Use Value: Delivers 1080p30 video bridging with <1 line delay and integrated DCM-based pixel clock recovery. |
| Medical Imaging Data Preprocessor | Test Equipment Pattern Generator |
Use Scenario: Real-time noise reduction and histogram equalization on ultrasound echo data before ADC digitization. IC Role / Device Role / Timing Role: FPGA implements pipelined FIR filters and lookup-table-based gamma correction using block RAM as coefficient storage. Use Value: Processes 12-bit echo samples at 40 MSPS with 576 Kbits of on-chip memory eliminating external SRAM. | Use Scenario: Generating multi-channel, synchronized digital stimulus waveforms for IC functional testing. IC Role / Device Role / Timing Role: FPGA serves as deterministic pattern sequencer with precise edge placement controlled by DCM outputs. Use Value: Achieves 1 ns edge resolution across 186 I/Os using internal PLL-derived clocks and output delay calibration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic and interface bridging applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX16-2CSG324C | Higher speed grade (-2) supports 10% faster internal timing and higher-frequency I/O standards | Better suited for designs requiring >800 Mbps LVDS or tighter setup/hold margins | Select XC6SLX16-2CSG324C only if timing closure fails at -1 grade with critical paths near limit |
| XC6SLX25-L1CSG324C | 24,050 logic cells and 900 Kbits block RAM - 65% more resources in identical package | Enables larger state machines or additional protocol stacks without board redesign | Choose XC6SLX25-L1CSG324C when design scales beyond 14K LC usage but must retain same footprint and thermal profile |
Compared with XC6SLX16-2CSG324C and XC6SLX25-L1CSG324C, the XC6SLX16-L1CSG324C offers optimal cost-performance balance for fixed-function industrial control where resource headroom and extreme speed are not required.
Availability
XC6SLX16-L1CSG324C is available at Aetrix Electronics and suitable for industrial automation, medical diagnostics equipment, and test instrumentation requiring stable component supply over extended production lifecycles.
Supply support for XC6SLX16-L1CSG324C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development of adaptive computing platforms including FPGAs, ACAPs, and software tools for hardware-accelerated systems.
The Spartan-6 family was engineered for cost-sensitive, high-volume applications demanding reliable I/O flexibility, low static power, and seamless integration with microcontrollers and analog front-ends.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX16-L1CSG324C?
The XC6SLX16-L1CSG324C supports I/O voltages from 1.2 V to 3.3 V across its 12 configurable I/O banks. Each bank operates independently, allowing mixed-voltage interfaces such as 1.8 V LVDS receivers alongside 3.3 V GPIO drivers on the same device without level shifters.
Does XC6SLX16-L1CSG324C support JTAG boundary-scan testing?
Yes, XC6SLX16-L1CSG324C includes IEEE 1149.1-compliant JTAG TAP controller for boundary-scan testing, programming, and debug access. Pins TCK, TMS, TDI, and TDO are dedicated and mapped to balls D1, E1, F1, and G1 respectively in the CSG324 package.
Can XC6SLX16-L1CSG324C be configured using an external microcontroller?
Yes, XC6SLX16-L1CSG324C supports Slave Serial and SelectMAP configuration modes, enabling direct bitstream loading from an external microcontroller via GPIO or parallel bus. The INIT_B and DONE pins provide handshake signals for synchronization during configuration.
What thermal considerations apply to XC6SLX16-L1CSG324C in continuous operation?
XC6SLX16-L1CSG324C has a maximum junction temperature of 100°C and requires a PCB with at least one internal ground plane and thermal vias under the package. At full utilization, typical power dissipation is 1.8 W; derating begins above 85°C ambient without forced airflow.
Is bitstream encryption available on XC6SLX16-L1CSG324C?
Yes, XC6SLX16-L1CSG324C supports AES-128 bitstream encryption and HMAC-SHA-256 authentication. Encryption keys are stored in on-chip eFUSE and activated during configuration, preventing unauthorized readback or cloning of the programmed logic design.
XC6SLX16-L1CSG324C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1139
- Number of Logic Elements/Cells:
- 14579
- Total RAM Bits:
- 589824
- Number of I/O:
- 232
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-CSPBGA (15x15)
XC6SLX16-L1CSG324C FAQ
1.How can I place an order for XC6SLX16-L1CSG324C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX16-L1CSG324C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX16-L1CSG324C reliable?
The price and inventory of XC6SLX16-L1CSG324C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX16-L1CSG324C is usually 5 days.
3.What payment methods are accepted for XC6SLX16-L1CSG324C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX16-L1CSG324C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX16-L1CSG324C?
XC6SLX16-L1CSG324C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX16-L1CSG324C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX16-L1CSG324C?
For technical support, including XC6SLX16-L1CSG324C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX16-L1CSG324C requirements.
6.How does Aetrix verify that XC6SLX16-L1CSG324C is sourced from the original manufacturer or authorized distributors?
All XC6SLX16-L1CSG324C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX16-L1CSG324C meets industry standards.
7.What is the process for return or replacement of XC6SLX16-L1CSG324C?
All XC6SLX16-L1CSG324C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX16-L1CSG324C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX16-L1CSG324C part is unused and in its original packaging.
Return procedure for XC6SLX16-L1CSG324C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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