AMD XC6SLX16-N3CPG196I

Overview

XC6SLX16-N3CPG196I from AMD (formerly Xilinx) is a Spartan-6 FPGA with 14,579 logic cells, 576 Kbits of block RAM, and 186 user I/Os in a 196-pin CSBGA package. It operates at -3 speed grade (1.2 V core, industrial temperature range -40°C to +100°C) and targets low-cost, high-volume embedded control and interface bridging applications.

For engineers reviewing the XC6SLX16-N3CPG196I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, block RAM depth, differential signaling support (LVDS), and industrial-grade thermal performance.

Technical Context

The XC6SLX16-N3CPG196I implements a configurable logic fabric based on 6-input LUTs and distributed RAM, with dedicated DSP48A1 slices supporting 18×25-bit multiply-accumulate operations. It integrates six CMT clock management tiles, each containing a DCM and PLL for jitter reduction and frequency synthesis.

Configuration is supported via Master Serial (SPI flash), Slave SelectMAP, or JTAG, with bitstream encryption and SEU mitigation features enabled. The device supports LVCMOS, LVTTL, SSTL, HSTL, and LVDS I/O standards across its 186 user pins, with programmable slew rate and drive strength per bank.

Key Specifications

Pinout & Package

XC6SLX16-N3CPG196I is housed in a 196-pin Chip Scale Ball Grid Array (CSBGA) package measuring 14 mm × 14 mm with 0.8 mm pitch. The package supports reflow soldering and provides thermal and electrical performance suitable for industrial PCB layouts.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC6SLX16-N3CPG196I, the XC6SLX16-3CPG196C trades industrial reliability for lower cost, while XC6SLX25-N3CSG324I offers headroom for feature expansion at the expense of board area and routing complexity.

Availability

XC6SLX16-N3CPG196I is available at Aetrix Electronics and suitable for industrial automation, automotive diagnostics, and medical sensor systems requiring stable component supply across long production lifecycles.

Supply support for XC6SLX16-N3CPG196I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now leads development of adaptive computing platforms including FPGAs, ACAPs, and related software tools.

The Spartan-6 family, including XC6SLX16-N3CPG196I, was designed for cost-sensitive, high-volume applications demanding reliable logic density, low static power, and flexible I/O interfacing.

FAQ

What is the maximum operating frequency of the XC6SLX16-N3CPG196I?

The XC6SLX16-N3CPG196I is rated at speed grade -3, supporting system clock frequencies up to 333 MHz and DDR3 data rates up to 667 Mbps. Actual achievable frequency depends on design placement, routing, and I/O standard selection - verified timing reports must be generated using Xilinx ISE 14.7 or Vivado 2018.3+ with appropriate constraints applied to the XC6SLX16-N3CPG196I.

Does the XC6SLX16-N3CPG196I support JTAG programming?

Yes, the XC6SLX16-N3CPG196I supports IEEE 1149.1 JTAG boundary-scan for programming, debugging, and verification. Pins TCK, TMS, TDI, and TDO are assigned to dedicated JTAG interface pins and remain active regardless of configuration mode. JTAG is used for initial bitstream loading, partial reconfiguration, and real-time debug access to internal logic states during operation of the XC6SLX16-N3CPG196I.

What power supplies are required for the XC6SLX16-N3CPG196I?

The XC6SLX16-N3CPG196I requires three regulated supplies: 1.2 V ±3% for core logic (VCCINT), 2.5 V or 3.3 V for I/O banks (VCCO), and 1.2 V for auxiliary circuits (VCCAUX). Each supply must be independently decoupled with low-ESR capacitors placed near respective power balls. Power sequencing - VCCAUX first, then VCCINT, then VCCO - is mandatory to prevent latch-up and ensure reliable configuration of the XC6SLX16-N3CPG196I.

Is the XC6SLX16-N3CPG196I RoHS compliant?

Yes, the XC6SLX16-N3CPG196I is RoHS-6 compliant (lead-free, halogen-free) and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) when shipped in original sealed packaging. The 196-pin CSBGA package uses matte tin finish on solder balls and complies with IPC/JEDEC J-STD-033 handling guidelines. Compliance documentation for the XC6SLX16-N3CPG196I is available through AMD's product change notifications and material declarations portal.

Can the XC6SLX16-N3CPG196I be configured from SPI flash memory?

Yes, the XC6SLX16-N3CPG196I supports Master Serial configuration mode, allowing autonomous boot from industry-standard SPI flash devices (e.g., Micron, Winbond, Macronix) without an external controller. The FPGA initiates read cycles on power-up using dedicated CONFIG_IO pins, loads the bitstream into configuration memory, and asserts DONE upon successful completion - a key capability enabling standalone operation of the XC6SLX16-N3CPG196I in embedded systems.