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AMD XC6SLX16-N3CSG225C
- Part No.:
- XC6SLX16-N3CSG225C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 225-LFBGA, CSPBGA
- Datasheet:
-
XC6SLX16-N3CSG225C.pdf
- Description:
- IC FPGA 160 I/O 225CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,425
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Product details
Overview
XC6SLX16-N3CSG225C from AMD (formerly Xilinx) is a Spartan-6 FPGA with 14,579 logic cells, 576 Kbits of block RAM, and 186 user I/Os in a 225-pin CSBGA package. It operates at -3 speed grade (1.2 V core, industrial temperature range) and targets low-cost embedded control, industrial interface bridging, and video preprocessing applications.
For engineers reviewing the XC6SLX16-N3CSG225C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, block RAM depth, speed grade timing closure, and CSBGA-225 thermal/mechanical compatibility with existing PCB layouts.
Technical Context
The XC6SLX16-N3CSG225C implements a configurable logic fabric based on 6-input LUTs and distributed RAM, supported by dedicated DSP48A1 slices for arithmetic-intensive tasks. It integrates dual-clock DDR2/DDR3 memory controllers and supports LVDS, TMDS, and RSDS I/O standards up to 1.0 Gbps per lane.
Configuration is performed via SPIx4 or JTAG, with bitstream encryption available using AES-256. The device includes internal oscillator, power-on reset, and multi-voltage I/O banks supporting 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V signaling levels.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 14,579 - determines maximum combinational/sequential logic capacity for control state machines or data path implementation |
| Block RAM | 576 Kbits - supports FIFOs, buffers, or lookup tables up to 18 K × 32-bit depth without external memory |
| User I/Os | 186 - enables high-density peripheral interfacing including parallel buses, sensor arrays, or display controllers |
| Speed Grade | -3 - guarantees timing closure for designs operating up to 667 MHz DDR3 clocking and 500 MHz system logic |
| Package | 225-pin CSBGA (13 × 13 mm, 0.8 mm pitch) - provides thermal performance suitable for industrial ambient temperatures up to 100°C |
| I/O Standards | LVDS, TMDS, RSDS, SSTL, HSTL - allows direct connection to displays, memory, and high-speed serial links without level-shifting |
Pinout & Package
XC6SLX16-N3CSG225C is housed in a 225-pin Chip Scale Ball Grid Array (CSBGA) package with 13 × 13 ball array, 0.8 mm pitch, and exposed thermal pad. Pin functions are defined per bank-based I/O architecture with dedicated configuration, clock, and JTAG pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be decoupled locally to support 3.3 V or 2.5 V signaling |
| K1 | CLKIN_0 | Dedicated single-ended clock input - connects directly to on-board crystal or oscillator for global clock distribution |
| M2 | PROGRAM_B | Active-low configuration initiator - pulls low to reset and reload configuration from external SPI flash |
| P3 | TCK | JTAG test clock - required for boundary-scan testing and in-system programming |
| R1 | VCCAUX | 1.2 V auxiliary supply - powers configuration logic, PLLs, and transceivers; requires tight regulation |
Key Features
| Feature | Design Value |
|---|---|
| DSP48A1 Slices | 32 dedicated arithmetic units enabling 18 × 25-bit multiply-accumulate operations per slice at 500 MHz |
| Multi-Voltage I/O Banks | Independent voltage rails per bank allow mixed-signaling interfaces (e.g., 3.3 V GPIO + 1.8 V memory bus) on same device |
| AES-256 Bitstream Encryption | Prevents unauthorized configuration cloning by encrypting bitstream stored in external SPI flash |
| Integrated Clock Management | Two DCMs provide jitter-reduced clock synthesis, phase shifting, and frequency multiplication for synchronous design timing |
| Power-Down Mode | Reduces static current to <50 µA during idle periods while retaining configuration state in SRAM |
Applications
| Industrial PLC I/O Expansion | Automotive Camera Interface Bridge |
|---|---|
Use Scenario: Adding 32-channel digital I/O and analog input conditioning to legacy PLC backplanes. IC Role / Device Role / Timing Role: FPGA acts as protocol translator and real-time I/O controller with deterministic response under 10 µs. Use Value: Replaces multiple ASICs with one reprogrammable device, reducing BOM count and enabling field-upgradable logic. | Use Scenario: Converting MIPI CSI-2 camera streams to parallel BT.656 video for ADAS domain controllers. IC Role / Device Role / Timing Role: Video bridge implementing deserialization, pixel reordering, and format conversion in hard logic. Use Value: Eliminates need for external serializer/deserializer chips and reduces latency to <2 video lines. |
| Medical Ultrasound Beamformer | Test Equipment Digital Pattern Generator |
Use Scenario: Generating synchronized 128-channel time-delay profiles for phased-array transducer excitation. IC Role / Device Role / Timing Role: Real-time beam steering engine using distributed RAM and carry-chain arithmetic for sub-nanosecond delay resolution. Use Value: Achieves 16-bit phase precision across all channels without external DACs or timing ICs. | Use Scenario: Producing programmable 100+ MHz digital stimulus patterns for IC functional validation. IC Role / Device Role / Timing Role: High-speed pattern sequencer with on-chip memory and jitter-controlled output clocks. Use Value: Delivers deterministic edge placement ±50 ps, meeting JEDEC AC timing compliance for DDR4 PHY testing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX16-2CSG225C | Slower -2 speed grade; 15% lower maximum clock frequency in critical paths | Suitable for non-real-time control where timing margin >15% is acceptable | Select when cost sensitivity outweighs need for worst-case timing headroom |
| XC6SLX25-N3CSG324C | Higher density (24,051 LCs), larger 324-pin CSBGA package, +27% block RAM | Required for designs exceeding 14K LCs or needing >1 MB on-chip memory buffering | Choose when scalability beyond XC6SLX16-N3CSG225C resources is confirmed |
Compared with XC6SLX16-N3CSG225C, the -2 variant trades timing margin for cost, while the XC6SLX25-N3CSG324C offers headroom for future feature expansion but requires PCB redesign due to different package size and pinout.
Availability
XC6SLX16-N3CSG225C is available at Aetrix Electronics and suitable for industrial automation, medical imaging subsystems, and automotive ADAS interface modules requiring stable component supply over extended production lifecycles.
Supply support for XC6SLX16-N3CSG225C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, embedded, and edge applications.
The Spartan-6 family, including XC6SLX16-N3CSG225C, was designed for cost-sensitive, high-volume applications requiring low-power logic integration, flexible I/O, and long-term industrial availability.
FAQ
What is the maximum operating junction temperature for XC6SLX16-N3CSG225C?
The XC6SLX16-N3CSG225C has an industrial-grade temperature rating of –40°C to +100°C junction temperature. This specification is guaranteed under full I/O loading and worst-case voltage conditions, and thermal design must ensure the die temperature remains within this limit using appropriate PCB copper area and airflow. The XC6SLX16-N3CSG225C datasheet defines derating curves for power dissipation above 85°C ambient.
Does XC6SLX16-N3CSG225C support JTAG boundary-scan testing?
Yes, XC6SLX16-N3CSG225C fully supports IEEE 1149.1 JTAG boundary-scan with TDI, TDO, TMS, TCK, and TRST pins mapped to dedicated package balls. The device implements mandatory instruction register and boundary-scan register logic, enabling board-level interconnect testing and in-system programming. XC6SLX16-N3CSG225C requires no external pull-ups on JTAG lines beyond those specified in the Xilinx Configuration User Guide.
Can XC6SLX16-N3CSG225C configure from a 3.3 V SPI flash device?
Yes, XC6SLX16-N3CSG225C supports master SPI configuration mode with 3.3 V SPI flash devices. The CONFIG_IO voltage (VCCO for Bank 0) must be set to 3.3 V, and the SPI interface operates at up to 33 MHz in x1 mode. XC6SLX16-N3CSG225C includes internal level shifters to interface safely with 3.3 V flash while maintaining 1.2 V core logic integrity.
How many differential I/O pairs does XC6SLX16-N3CSG225C support?
XC6SLX16-N3CSG225C supports up to 93 differential I/O pairs (186 total user I/Os), subject to bank voltage and I/O standard constraints. Each pair requires matching P/N routing and shared VCCO, and LVDS operation is validated up to 1.0 Gbps with proper termination. XC6SLX16-N3CSG225C documentation specifies that not all pins can be used simultaneously as differential pairs due to adjacent pin restrictions in CSBGA-225 layout.
Is XC6SLX16-N3CSG225C compatible with Xilinx ISE Design Suite 14.7?
Yes, XC6SLX16-N3CSG225C is fully supported in Xilinx ISE Design Suite 14.7, including synthesis, place-and-route, timing analysis, and bitstream generation. The device is listed in the ISE device library under Spartan-6 LX family, and all speed grades including -3 are covered. XC6SLX16-N3CSG225C bitstreams generated in ISE 14.7 are production-ready and field-deployable.
XC6SLX16-N3CSG225C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 225-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1139
- Number of Logic Elements/Cells:
- 14579
- Total RAM Bits:
- 589824
- Number of I/O:
- 160
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 225-CSPBGA (13x13)
XC6SLX16-N3CSG225C FAQ
1.How can I place an order for XC6SLX16-N3CSG225C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX16-N3CSG225C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX16-N3CSG225C reliable?
The price and inventory of XC6SLX16-N3CSG225C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX16-N3CSG225C is usually 5 days.
3.What payment methods are accepted for XC6SLX16-N3CSG225C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX16-N3CSG225C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX16-N3CSG225C?
XC6SLX16-N3CSG225C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX16-N3CSG225C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX16-N3CSG225C?
For technical support, including XC6SLX16-N3CSG225C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX16-N3CSG225C requirements.
6.How does Aetrix verify that XC6SLX16-N3CSG225C is sourced from the original manufacturer or authorized distributors?
All XC6SLX16-N3CSG225C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX16-N3CSG225C meets industry standards.
7.What is the process for return or replacement of XC6SLX16-N3CSG225C?
All XC6SLX16-N3CSG225C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX16-N3CSG225C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX16-N3CSG225C part is unused and in its original packaging.
Return procedure for XC6SLX16-N3CSG225C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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