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AMD XC6SLX16-N3CSG324I

Part No.:
XC6SLX16-N3CSG324I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
324-LFBGA, CSPBGA
Datasheet:
AetrixXC6SLX16-N3CSG324I.pdf
Description:
IC FPGA 232 I/O 324CSBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:248

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Product details

Overview

XC6SLX16-N3CSG324I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 14,579 logic cells, 576 Kbits of block RAM, and support for DDR2/DDR3 memory interfaces. It operates at -3 speed grade with industrial temperature range (-40°C to +100°C) and uses a 324-pin CSBGA package. This device serves as a configurable logic fabric in embedded vision preprocessing pipelines.

For engineers reviewing the XC6SLX16-N3CSG324I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count (232 user I/Os), LVDS-capable banks, and industrial-grade thermal performance.

Technical Context

The XC6SLX16-N3CSG324I implements a hierarchical FPGA architecture with six-input LUTs, dedicated carry logic, and integrated DSP48A1 slices for arithmetic acceleration. It supports SelectIO standards including LVCMOS, LVDS, and SSTL across 12 I/O banks.

Configuration is performed via Master SPI or JTAG, with bitstream encryption available through AES-256. The device includes internal clock management using DCMs (Digital Clock Managers) supporting frequency synthesis, phase shifting, and duty cycle correction.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells14,579 - determines maximum combinational/sequential logic capacity for custom digital functions
Block RAM576 Kbits - provides on-chip memory for FIFOs, buffers, or small lookup tables without external SRAM
User I/Os232 - enables high-density peripheral interfacing with configurable voltage and standard support
Speed Grade-3 - guarantees timing closure up to 667 Mbps DDR3 data rate and 333 MHz system clock
Operating Temp-40°C to +100°C - qualifies for industrial environments without derating or forced cooling
Package324-pin CSBGA (15×15 mm, 0.8 mm pitch) - supports fine-pitch PCB assembly with thermal pad for power dissipation

Pinout & Package

XC6SLX16-N3CSG324I uses a 324-pin Chip Scale Ball Grid Array (CSBGA) with exposed thermal pad. Pin functions are banked across 12 I/O banks, each supporting independent VCCO and reference voltage settings.

Pin/TerminalCircuit RoleDesign Meaning
G1CONFIG_IO / INIT_BActive-low configuration initialization signal; asserts during bitstream load failure or power-on reset
K1PROGRAM_BActive-low asynchronous reconfiguration trigger; resets configuration logic and clears CLB contents
M1CCLKConfiguration clock input; drives serial bitstream loading from external SPI flash or master processor
P1DONEOpen-drain status output indicating successful configuration completion and I/O enable
T1VCCO_0I/O bank 0 output voltage supply; sets logic threshold for all pins in Bank 0 (e.g., 1.8V or 3.3V)

Key Features

FeatureDesign Value
Dedicated DSP48A1 Slices32 units with 18×18 multipliers and 48-bit accumulators for real-time filtering or FFT computation
DCM Clock ManagementTwo DCMs per device providing jitter-tolerant clock synthesis, phase alignment, and frequency multiplication/division
SelectIO TechnologySupports 18 I/O standards including LVDS (350 Mbps), SSTL-18, and HSTL with programmable drive strength and slew rate
AES-256 Bitstream EncryptionHardware-accelerated encryption prevents reverse engineering and unauthorized configuration cloning

Applications

Industrial Motor ControlAutomotive ADAS Preprocessing

Use Scenario: Real-time encoder interpolation and PWM waveform generation for servo drives.

IC Role / Device Role / Timing Role: Configurable logic fabric executing closed-loop control algorithms with sub-microsecond latency.

Use Value: Enables deterministic timing response and integration of safety monitoring logic alongside motion control.

Use Scenario: Camera sensor interface aggregation and Bayer pattern preprocessing before GPU offload.

IC Role / Device Role / Timing Role: Parallel pixel stream processing unit with synchronized multi-camera capture and on-the-fly color correction.

Use Value: Reduces host processor load by performing fixed-function image operations at line rate (up to 100 MP/s).

Medical Imaging InterfaceTest & Measurement Equipment

Use Scenario: High-speed ADC/DAC bridging between analog front-end and PCIe host interface in ultrasound systems.

IC Role / Device Role / Timing Role: Protocol translation and data packing engine handling time-critical sampling clocks and burst transfers.

Use Value: Maintains precise sample-to-sample timing integrity while adapting between proprietary sensor bus and standard host interface.

Use Scenario: Digital pattern generation and acquisition synchronization in automated test equipment (ATE).

IC Role / Device Role / Timing Role: Deterministic state machine controlling stimulus timing, response sampling, and pass/fail evaluation.

Use Value: Achieves <1 ns jitter on output edges and <500 ps input capture uncertainty under industrial temperature conditions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC6SLX25-N3CSG324IHigher logic density (24,051 LUTs), same package and speed gradeSupports larger algorithm partitions and additional peripheral controllersChoose when design requires >14K LUTs but must retain identical footprint and thermal profile
XC7S15-1CSGA225IArtix-7 family, 12,800 logic cells, smaller 225-pin CSP package, lower static powerLacks native DDR3 controller; requires external PHY for high-speed memoryPrefer for new designs prioritizing power efficiency and smaller board area over legacy IP reuse

Compared with XC6SLX16-N3CSG324I, the XC6SLX25-N3CSG324I offers headroom for future feature expansion within identical mechanical constraints, while the XC7S15-1CSGA225I trades memory interface capability for reduced size and active power-making it suitable for battery-constrained edge nodes where DDR3 bandwidth is not required.

Availability

XC6SLX16-N3CSG324I is available at Aetrix Electronics and suitable for industrial motor control, medical imaging interface, and test & measurement equipment requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for XC6SLX16-N3CSG324I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of the Spartan-6 FPGA family. AMD is a global semiconductor leader focused on adaptive computing solutions.

The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring balanced logic density, I/O flexibility, and low-power operation-including industrial automation, embedded vision, and communications infrastructure.

FAQ

What is the maximum supported DDR3 data rate for XC6SLX16-N3CSG324I?

The XC6SLX16-N3CSG324I supports DDR3 interfaces up to 667 Mbps per pin (333 MHz clock) in compliance with JEDEC DDR3-667 specifications. This capability is validated for industrial temperature operation and requires proper PCB layout adherence to Xilinx UG382 guidelines for memory interface routing and termination.

Does XC6SLX16-N3CSG324I include built-in configuration memory?

No, XC6SLX16-N3CSG324I does not include on-chip non-volatile configuration memory. It relies on external SPI flash or a master processor to load the configuration bitstream at power-up. Configuration can be initiated via CCLK-driven serial mode or JTAG boundary-scan for debugging and programming.

Can XC6SLX16-N3CSG324I operate in automotive AEC-Q100 qualified systems?

XC6SLX16-N3CSG324I is rated for industrial temperature (-40°C to +100°C) but is not AEC-Q100 qualified. For automotive applications requiring qualification, designers should consider AMD's XA Spartan-6 Q-grade variants (e.g., XA6SLX16-3CSG324Q), which undergo additional stress testing and screening per AEC-Q100 Rev H.

How many DCMs are available in XC6SLX16-N3CSG324I?

XC6SLX16-N3CSG324I contains two Digital Clock Managers (DCMs). Each DCM supports input clock frequency multiplication, division, phase shifting, and duty cycle correction-enabling precise clock domain crossing and synchronization across multiple I/O banks and internal logic domains.

Is AES-256 bitstream encryption enabled by default on XC6SLX16-N3CSG324I?

No, AES-256 bitstream encryption is not enabled by default on XC6SLX16-N3CSG324I. It requires explicit bitstream generation with encryption keys programmed into the device's eFUSE array using Xilinx iMPACT or Vivado tools. Once enabled, decryption occurs automatically during configuration without software overhead.

XC6SLX16-N3CSG324I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-6 LX
Package/Case:
324-LFBGA, CSPBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
1139
Number of Logic Elements/Cells:
14579
Total RAM Bits:
589824
Number of I/O:
232
Number of Gates:
-
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
324-CSPBGA (15x15)

XC6SLX16-N3CSG324I FAQ

1.How can I place an order for XC6SLX16-N3CSG324I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC6SLX16-N3CSG324I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC6SLX16-N3CSG324I reliable?

The price and inventory of XC6SLX16-N3CSG324I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX16-N3CSG324I is usually 5 days.

3.What payment methods are accepted for XC6SLX16-N3CSG324I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX16-N3CSG324I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC6SLX16-N3CSG324I?

XC6SLX16-N3CSG324I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC6SLX16-N3CSG324I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC6SLX16-N3CSG324I?

For technical support, including XC6SLX16-N3CSG324I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX16-N3CSG324I requirements.

6.How does Aetrix verify that XC6SLX16-N3CSG324I is sourced from the original manufacturer or authorized distributors?

All XC6SLX16-N3CSG324I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX16-N3CSG324I meets industry standards.

7.What is the process for return or replacement of XC6SLX16-N3CSG324I?

All XC6SLX16-N3CSG324I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX16-N3CSG324I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC6SLX16-N3CSG324I part is unused and in its original packaging.

Return procedure for XC6SLX16-N3CSG324I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC6SLX16-N3CSG324I Tags

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