My Inquiry
My Account
AMD XC6SLX16-N3FT256I
- Part No.:
- XC6SLX16-N3FT256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC6SLX16-N3FT256I.pdf
- Description:
- IC FPGA 186 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,107
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC6SLX16-N3FT256I from AMD (formerly Xilinx) is a Spartan-6 FPGA with 14,579 logic cells, 576 Kbits of block RAM, and 186 user I/Os in a 256-pin FTBGA package. It operates at -3 speed grade (1.2 V core, industrial temperature range -40°C to +100°C) and supports LVCMOS, LVTTL, SSTL, and differential signaling standards. It is used in industrial motor control interface modules requiring deterministic I/O timing and partial reconfiguration.
For engineers reviewing the XC6SLX16-N3FT256I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage flexibility, embedded DSP slice count, configuration mode support (Master SPI, Slave SelectMAP), and industrial-grade thermal reliability.
Technical Context
The XC6SLX16-N3FT256I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and six-input LUTs. It integrates 32 embedded 18×18 multipliers and 128 Kbits of distributed RAM for arithmetic-intensive tasks.
Configuration is supported via Master SPI, Slave SelectMAP, or JTAG modes, with bitstream encryption and CRC error checking. The device uses internal voltage regulation and supports dual-supply I/O banks with independent VCCO per bank and programmable slew rate and drive strength.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 14,579 - defines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 576 Kbits - supports FIFOs, buffers, and data tables without external memory |
| User I/Os | 186 - enables high-density peripheral interfacing with bank-wise voltage assignment |
| Speed Grade | -3 - guarantees timing closure up to 667 Mbps DDR3 interface operation at industrial temperature |
| Core Voltage | 1.2 V ±3% - requires tight-tolerance DC-DC regulation for stable CLB operation |
| Operating Temp | -40°C to +100°C - validated for extended industrial environments without derating |
| DSP Slices | 32 - provides dedicated 18×18 multipliers for real-time filtering or encoder processing |
Pinout & Package
XC6SLX16-N3FT256I is housed in a 256-pin Fine-Pitch Thin BGA (FTBGA) package with 1.0 mm pitch, 17×17 array, and 1.2 mm height. Thermal pad on underside improves PCB heat dissipation under sustained logic utilization.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - sets output voltage level for pins A1–D12 |
| P2 | PROGRAM_B | Active-low asynchronous configuration initiator - pulls low to reset and reload bitstream |
| T11 | M0 | Configuration mode select - determines boot source (SPI vs SelectMAP) |
| R15 | CLKIN | Dedicated global clock input - routes to BUFG for low-skew system timing |
| A14 | INIT_B | Open-drain status indicator - goes high-Z after successful configuration |
Key Features
| Feature | Design Value |
|---|---|
| Multi-Voltage I/O Banks | Supports concurrent 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfaces - eliminates level-shifter ICs in mixed-voltage systems |
| Embedded DSP Slices | 32 × 18×18 multipliers with pre-adder - enables single-cycle multiply-accumulate for PID loop acceleration |
| Configurable I/O Standards | LVCMOS, LVTTL, SSTL, HSTL, differential LVDS - allows direct connection to ADCs, encoders, and industrial fieldbus PHYs |
| Partial Reconfiguration Support | Enables dynamic logic module swapping - reduces downtime during firmware updates in motion control PLCs |
Applications
| Industrial Motor Drive Interface | Programmable Logic Controller (PLC) I/O Expansion |
|---|---|
Use Scenario: Real-time PWM generation and encoder feedback capture in servo drives. IC Role / Device Role / Timing Role: FPGA fabric implements time-critical PWM timing engine and quadrature decoder with sub-10 ns jitter. Use Value: Eliminates need for separate timer ICs and reduces gate count required for position-loop computation. | Use Scenario: Adding isolated digital I/O channels to legacy PLC backplanes via mezzanine card. IC Role / Device Role / Timing Role: Configurable I/O transceiver with programmable debounce, edge detection, and status reporting logic. Use Value: Enables field-upgradable I/O mapping without hardware redesign or firmware flash cycles. |
| Factory Automation Vision Preprocessor | Energy Metering Communication Gateway |
Use Scenario: On-camera image histogram calculation and ROI cropping before transmission over GigE Vision. IC Role / Device Role / Timing Role: Parallel pixel stream processor using block RAM as line buffers and DSP slices for intensity math. Use Value: Reduces host CPU load by offloading real-time image statistics computation. | Use Scenario: Protocol translation between DLMS/COSEM over PLC and Modbus RTU over RS-485 in smart meters. IC Role / Device Role / Timing Role: Dual-protocol state machine with UART controllers, CRC engines, and secure key storage. Use Value: Supports certified metering firmware updates while maintaining regulatory compliance for data integrity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX16-2FT256I | Slower -2 speed grade; lower max I/O toggle rate and DDR3 clock frequency | Suitable for non-real-time control where timing margin exceeds 15% | Select when cost sensitivity outweighs need for worst-case timing headroom |
| XC6SLX25-N3FT256I | Higher logic density (24,051 LUTs), more block RAM (900 Kbits), same package | Required when adding Ethernet MAC or multiple CAN FD controllers beyond XC6SLX16 capacity | Choose when future-proofing for feature expansion without PCB change |
Compared with XC6SLX16-N3FT256I, the -2 variant trades timing performance for cost, while the XC6SLX25-N3FT256I offers headroom for protocol stack integration-both retain identical pinout and thermal profile but differ in resource allocation and speed grading.
Availability
XC6SLX16-N3FT256I is available at Aetrix Electronics and suitable for industrial motor control, factory automation vision preprocessing, and energy metering communication gateway designs requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX16-N3FT256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development of adaptive computing platforms including FPGA, SoC, and ACAP families for high-performance embedded and datacenter applications.
The Spartan-6 family was designed for cost-sensitive, high-volume industrial and automotive applications requiring reliable I/O flexibility, low static power, and long-term availability-XC6SLX16-N3FT256I targets mid-complexity control and interface functions.
FAQ
What is the configuration method supported by XC6SLX16-N3FT256I?
XC6SLX16-N3FT256I supports Master SPI, Slave SelectMAP, and JTAG configuration modes. Master SPI uses on-board serial flash for autonomous startup; Slave SelectMAP enables high-speed parallel loading from microcontroller; JTAG is used for debugging and programming during development. All modes are fully supported in Vivado 2022.2 and earlier ISE tools.
Does XC6SLX16-N3FT256I support differential I/O standards?
Yes, XC6SLX16-N3FT256I supports LVDS, RSDS, and BLVDS differential standards across multiple I/O banks. Each differential pair requires adjacent pins within the same bank and must share common VCCO and reference voltage. Termination resistors must be externally placed per Xilinx UG381 guidelines.
What is the maximum operating frequency of the internal clock network in XC6SLX16-N3FT256I?
The global clock buffer (BUFG) in XC6SLX16-N3FT256I supports up to 500 MHz in industrial temperature conditions at -3 speed grade. This limit applies to clocks routed through dedicated clock spines; regional clocks (BUFR) are rated to 375 MHz. Timing analysis must account for PVT variation per DS162 specification.
Can XC6SLX16-N3FT256I be used in automotive applications?
XC6SLX16-N3FT256I is qualified for industrial temperature range (-40°C to +100°C) but is not AEC-Q100 qualified. It has been deployed in non-safety-critical automotive subsystems such as body control modules and infotainment gateways where customer qualification testing meets functional safety requirements.
Is partial reconfiguration supported on XC6SLX16-N3FT256I?
Yes, XC6SLX16-N3FT256I supports partial reconfiguration using Xilinx ISE Design Suite 14.7 with PlanAhead tools. Dynamic module swapping requires specific floorplanning, frame-based bitstream generation, and external controller coordination. Verified use cases include runtime update of encoder interpolation logic in motion controllers.
XC6SLX16-N3FT256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1139
- Number of Logic Elements/Cells:
- 14579
- Total RAM Bits:
- 589824
- Number of I/O:
- 186
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC6SLX16-N3FT256I FAQ
1.How can I place an order for XC6SLX16-N3FT256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX16-N3FT256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX16-N3FT256I reliable?
The price and inventory of XC6SLX16-N3FT256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX16-N3FT256I is usually 5 days.
3.What payment methods are accepted for XC6SLX16-N3FT256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX16-N3FT256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX16-N3FT256I?
XC6SLX16-N3FT256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX16-N3FT256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX16-N3FT256I?
For technical support, including XC6SLX16-N3FT256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX16-N3FT256I requirements.
6.How does Aetrix verify that XC6SLX16-N3FT256I is sourced from the original manufacturer or authorized distributors?
All XC6SLX16-N3FT256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX16-N3FT256I meets industry standards.
7.What is the process for return or replacement of XC6SLX16-N3FT256I?
All XC6SLX16-N3FT256I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX16-N3FT256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX16-N3FT256I part is unused and in its original packaging.
Return procedure for XC6SLX16-N3FT256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC6SLX16-N3FT256I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
