My Inquiry
My Account
AMD XC6SLX25-2CSG324C
- Part No.:
- XC6SLX25-2CSG324C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XC6SLX25-2CSG324C.pdf
- Description:
- IC FPGA 226 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:126
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC6SLX25-2CSG324C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 24,051 logic cells, 18 Kbits of block RAM, and 186 user I/Os in a 324-pin CSGA package. It operates at -2 speed grade with 1.2 V core voltage and supports LVCMOS, LVTTL, SSTL, and HSTL I/O standards. It is used in industrial control logic and embedded vision preprocessing.
For engineers reviewing the XC6SLX25-2CSG324C datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O voltage flexibility, embedded memory capacity, and industrial temperature range support.
Technical Context
The XC6SLX25-2CSG324C implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated DSP48A1 slices for arithmetic operations and integrated clock management using DCM and PLL blocks. It supports multi-standard I/O with programmable drive strength and slew rate control.
Configuration is performed via SPI serial flash or JTAG, and it includes built-in system monitoring for on-chip temperature and supply voltage. The device targets cost-sensitive, high-volume applications requiring deterministic timing and low static power.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,051 - provides gate count equivalent for medium-complexity digital logic implementation |
| Block RAM | 18 Kbits - supports small buffers, FIFOs, or lookup tables without external memory |
| User I/O Pins | 186 - enables direct interface to multiple peripherals or sensors in compact PCB layouts |
| Speed Grade | -2 - guarantees timing closure up to 500 MHz system clock in critical paths |
| Core Voltage | 1.2 V - reduces dynamic power consumption versus 1.8 V or 2.5 V FPGAs |
| Operating Temp | 0 °C to +85 °C - qualified for commercial and extended industrial environments |
| I/O Standards | LVCMOS, LVTTL, SSTL, HSTL - allows interoperability with legacy and DDR memory interfaces |
Pinout & Package
XC6SLX25-2CSG324C is housed in a 324-ball fine-pitch CSPBGA (CSGA) package with 1.0 mm ball pitch and 15 × 15 mm body size. Pin functions are organized into banks with independent VCCO and VREF per bank.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | CONFIG_IO / INIT_B | Active-low configuration initialization signal; pulled high during normal operation |
| H2 | PROGRAM_B | Active-low global reset that clears configuration memory and restarts boot process |
| K1 | CLKIN_0 | Dedicated single-ended clock input for primary DCM/PLL clock source |
| M3 | VCCAUX | 1.8 V auxiliary supply for configuration circuitry and I/O banks |
| T14 | VCCO_0 | Programmable I/O bank voltage (1.2–3.3 V) for Bank 0 |
| U15 | GND | Signal ground reference for adjacent I/O and core logic |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated DSP48A1 Slices | 12 units supporting 18 × 18 signed multiplication and accumulation in one cycle |
| Embedded Block RAM | 18 Kbits distributed across 32 dual-port RAM blocks for concurrent read/write access |
| Multi-Standard I/O | Supports 12 I/O standards including SSTL18_I for DDR2 memory interfacing |
| DCM and PLL Clock Management | Two DCMs and one PLL enable precise clock synthesis, phase shifting, and jitter reduction |
| System Monitor | On-die temperature and supply voltage sensor with I²C interface for real-time health monitoring |
Applications
| Industrial PLC Logic | Embedded Vision Preprocessing |
|---|---|
Use Scenario: Real-time ladder logic execution and I/O scanning in modular automation controllers. IC Role / Device Role / Timing Role: Configurable logic fabric replaces ASIC-based control engines with field-upgradable functionality. Use Value: 24,051 logic cells and 186 I/Os enable integration of motion control, safety interlocks, and HMI communication in one device. | Use Scenario: Pixel-level filtering and frame buffering before transmission to host processor in smart cameras. IC Role / Device Role / Timing Role: Parallel image pipeline accelerator with synchronized pixel clock domain handling. Use Value: DSP48A1 slices and block RAM allow real-time median filtering and line buffering without external memory latency. |
| Communications Backplane Interface | Test Equipment Pattern Generation |
Use Scenario: Protocol bridging between PCIe endpoint and custom backplane bus in modular instrumentation racks. IC Role / Device Role / Timing Role: Glue logic and serializer/deserializer for parallel-to-serial conversion with deterministic latency. Use Value: Multi-standard I/O and -2 speed grade ensure reliable 100 MHz parallel bus capture and 2.5 Gbps serial output alignment. | Use Scenario: High-speed digital pattern generation for IC functional validation in ATE systems. IC Role / Device Role / Timing Role: Deterministic state machine driving 186-channel parallel stimulus vectors with sub-cycle timing control. Use Value: 1.2 V core and fine-grained timing control reduce pattern jitter below ±50 ps for <100 MHz test clocks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic and I/O interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX16-2CSG324C | 14,579 logic cells, 16 Kbits block RAM, same package and speed grade | Lower logic density limits complex state machines or larger buffer implementations | Select when design fits within reduced resource budget and cost sensitivity outweighs scalability needs |
| XC6SLX45-2CSG324C | 43,661 logic cells, 32 Kbits block RAM, identical pinout and thermal profile | Higher gate count supports additional protocol stacks or video scaling pipelines | Choose when future feature expansion or higher I/O concurrency is required without board redesign |
Compared with XC6SLX16-2CSG324C and XC6SLX45-2CSG324C, the XC6SLX25-2CSG324C offers balanced logic density and I/O count for mid-tier industrial designs-enabling full feature sets without over-provisioning resources or increasing BOM cost.
Availability
XC6SLX25-2CSG324C is available at Aetrix Electronics and suitable for industrial PLC logic, embedded vision preprocessing, and communications backplane interface requiring stable component supply and long-term production support.
Supply support for XC6SLX25-2CSG324C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing, graphics, and visualization technologies for data center, client, and embedded markets.
The Spartan-6 family was designed for cost-optimized, high-volume applications requiring low-power logic implementation, flexible I/O, and industrial-grade reliability-targeting industrial automation, vision, and communications infrastructure.
FAQ
What is the maximum operating frequency supported by XC6SLX25-2CSG324C?
The XC6SLX25-2CSG324C is rated at speed grade -2, guaranteeing timing closure for system clock frequencies up to 500 MHz in critical paths. Actual achievable frequency depends on design complexity, routing, and I/O standard selection. The device includes DCM and PLL blocks capable of generating internal clocks with precise phase alignment and jitter suppression for synchronous logic domains.
Does XC6SLX25-2CSG324C support configuration via SPI flash memory?
Yes, XC6SLX25-2CSG324C supports master SPI configuration mode using industry-standard serial NOR flash devices. Configuration data is loaded automatically on power-up when M[2:0] pins are set to 001. The device also supports JTAG boundary-scan programming and fallback configuration modes for robust field updates and recovery.
What I/O standards are supported by XC6SLX25-2CSG324C?
XC6SLX25-2CSG324C supports LVCMOS, LVTTL, SSTL, and HSTL I/O standards across its 186 user I/Os. Each I/O bank has independent VCCO and VREF settings, enabling mixed-voltage operation-for example, SSTL18_I for DDR2 memory interfacing alongside 3.3 V LVCMOS for legacy peripherals-all within the same device.
Is XC6SLX25-2CSG324C suitable for industrial temperature environments?
Yes, XC6SLX25-2CSG324C is specified for operation from 0 °C to +85 °C (Commercial Extended temperature range), making it suitable for industrial control cabinets, factory-floor vision systems, and outdoor communications equipment where ambient temperatures exceed standard commercial limits but do not reach automotive extremes.
How many block RAMs does XC6SLX25-2CSG324C contain, and what is their architecture?
XC6SLX25-2CSG324C contains 32 block RAM primitives totaling 18 Kbits of memory. Each block RAM is dual-port, supporting independent read and write operations at different addresses simultaneously. They can be configured as true dual-port RAM, single-port RAM, or shift registers, enabling efficient FIFOs, frame buffers, and lookup tables without external memory components.
XC6SLX25-2CSG324C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1879
- Number of Logic Elements/Cells:
- 24051
- Total RAM Bits:
- 958464
- Number of I/O:
- 226
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-CSPBGA (15x15)
XC6SLX25-2CSG324C FAQ
1.How can I place an order for XC6SLX25-2CSG324C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX25-2CSG324C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX25-2CSG324C reliable?
The price and inventory of XC6SLX25-2CSG324C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX25-2CSG324C is usually 5 days.
3.What payment methods are accepted for XC6SLX25-2CSG324C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX25-2CSG324C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX25-2CSG324C?
XC6SLX25-2CSG324C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX25-2CSG324C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX25-2CSG324C?
For technical support, including XC6SLX25-2CSG324C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX25-2CSG324C requirements.
6.How does Aetrix verify that XC6SLX25-2CSG324C is sourced from the original manufacturer or authorized distributors?
All XC6SLX25-2CSG324C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX25-2CSG324C meets industry standards.
7.What is the process for return or replacement of XC6SLX25-2CSG324C?
All XC6SLX25-2CSG324C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX25-2CSG324C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX25-2CSG324C part is unused and in its original packaging.
Return procedure for XC6SLX25-2CSG324C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC6SLX25-2CSG324C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
