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AMD XC6SLX25-2FG484C
- Part No.:
- XC6SLX25-2FG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX25-2FG484C.pdf
- Description:
- IC FPGA 266 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,797
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Product details
Overview
XC6SLX25-2FG484C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 24,051 logic cells, 18 Kbits of block RAM, and operates at -2 speed grade with 1.2 V core voltage in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package. It supports PCIe Gen1 endpoint functionality and is used in industrial I/O controllers requiring deterministic low-latency logic reconfiguration.
For engineers reviewing the XC6SLX25-2FG484C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count (348 user I/Os), LVDS support, embedded DSP48A1 slices (64), and thermal performance in convection-cooled enclosures.
Technical Context
The XC6SLX25-2FG484C implements a synchronous, SRAM-based configurable logic architecture with dedicated carry chains and distributed RAM. It integrates six clock management tiles (CMTs), each containing a DCM and PLL for jitter reduction and frequency synthesis.
It supports SelectIO standards including LVCMOS, LVTTL, SSTL, HSTL, and differential signaling (LVDS, TMDS, RSDS) across its 348 user I/O pins. Configuration is performed via Master SPI, Slave Serial, or JTAG interfaces with bitstream encryption optional.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,051 - provides sufficient resources for medium-complexity control logic and protocol bridging |
| Block RAM | 18 Kbits - supports small FIFOs, lookup tables, or configuration data buffering |
| User I/O Pins | 348 - enables high-channel-count interface consolidation (e.g., parallel sensor buses) |
| DSP Slices | 64 DSP48A1 - delivers 18×25-bit multiply-accumulate per slice for filtering or motor control |
| Speed Grade | -2 - guarantees timing closure up to 500 MHz system clock in worst-case industrial temperature |
| Core Voltage | 1.2 V ±3% - requires tight-regulation DC/DC supply with <10 mV ripple for stable operation |
| Package | 484-pin FBGA (23×23 mm, 1.0 mm pitch) - compatible with standard SMT reflow profiles and IPC-7351B footprint |
Pinout & Package
XC6SLX25-2FG484C is housed in a 484-ball fine-pitch BGA (FG484) package with 23×23 array, 1.0 mm ball pitch, and standard JEDEC MO-251AC mechanical outline. Thermal pad is not present; thermal dissipation relies on PCB copper area and via stitching.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be decoupled with 100 nF + 4.7 µF near package |
| P2 | IO_L1P_0 | Differential pair positive input - supports LVDS at up to 840 Mbps with internal termination |
| T1 | CLKIN_1 | Primary clock input for CMT1 - accepts single-ended or differential (LVDS/LVPECL) signals |
| R1 | M0 | Configuration mode select - sets boot source (SPI/JTAG) during power-up reset |
| Y2 | PROGRAM_B | Active-low asynchronous reset - initiates full reconfiguration when pulsed low |
| A1 | VCCAUX | 1.8 V auxiliary supply - powers configuration logic, JTAG, and transceivers |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PCI Express Endpoint | Gen1 x1 link with hard IP - eliminates external PHY and reduces latency by >300 ns vs soft-core implementation |
| Embedded Clock Management | 6 CMTs with DCM+PLL - enables independent clock domain crossing and jitter cleaning for mixed-signal systems |
| SelectIO Technology | Support for 19 I/O standards - allows direct interfacing to legacy and modern peripherals without level shifters |
| Configurable Logic Blocks (CLBs) | Each CLB contains two 6-input LUTs and 8 FFs - optimizes for both combinatorial depth and register-heavy pipelines |
| Bitstream Encryption | AES-128 with battery-backed RAM key storage - protects IP against physical readout and cloning attacks |
Applications
| Industrial Motion Controller | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time coordination of stepper/servo drives with encoder feedback loops and safety interlocks. IC Role / Device Role / Timing Role: FPGA fabric implements closed-loop PID execution, pulse-width modulation generation, and dual-lockstep watchdog logic. Use Value: Deterministic sub-µs interrupt response and 348 I/Os enable direct connection to 16-axis drive banks and analog front-ends. | Use Scenario: Aggregation and preprocessing of multi-channel ultrasound echo data before transfer to host CPU. IC Role / Device Role / Timing Role: Configurable logic synchronizes ADC sampling, applies beamforming coefficients, and packs data into PCIe TLPs. Use Value: 64 DSP48A1 slices perform real-time FIR filtering; PCIe Gen1 x1 provides 250 MB/s sustained throughput to host memory. |
| Avionics Data Concentrator | Test Equipment Pattern Generator |
Use Scenario: Consolidation of ARINC 429, MIL-STD-1553, and discrete I/O signals onto a common Ethernet backbone. IC Role / Device Role / Timing Role: Protocol translation engine with time-stamped packet injection and deterministic latency compensation. Use Value: Dual CMTs generate synchronized clocks for bus arbitration and timestamping; -2 speed grade ensures timing margin at -55°C to +105°C. | Use Scenario: Generation of high-fidelity digital stimulus waveforms for IC functional validation at speeds up to 200 MHz. IC Role / Device Role / Timing Role: High-speed pattern sequencer with programmable slew rate control and per-pin delay calibration. Use Value: LVDS outputs with 100 ps channel-to-channel skew support 1.6 Gbps vector rates; 24K logic cells enable complex state-machine-based test algorithms. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX45-2FG484C | 43,661 logic cells, 32 Kbits block RAM, same package - higher density but 25% greater static power | Required for designs needing >28K LUTs or >24 DSP slices - e.g., dual-camera ISP pipelines | Select when XC6SLX25-2FG484C fails timing closure or exceeds resource utilization in post-place-and-route analysis |
| XC7S25-2FTGB196C | Artix-7 family, 25K logic cells, 196-pin FTGB package - smaller footprint but only 210 user I/Os and no native PCIe | Suitable for space-constrained, non-PCIe applications like portable diagnostics or UAV flight controllers | Choose XC6SLX25-2FG484C over XC7S25-2FTGB196C when PCIe endpoint, LVDS channel count, or industrial temperature range (-40°C to +100°C) are mandatory |
Compared with XC6SLX45-2FG484C, the XC6SLX25-2FG484C offers lower cost and power for mid-range logic tasks; compared with XC7S25-2FTGB196C, it delivers superior I/O flexibility and integrated PCIe-critical for industrial backplane and medical imaging subsystems.
Availability
XC6SLX25-2FG484C is available at Aetrix Electronics and suitable for industrial motion control, medical imaging interface, and avionics data concentrator applications requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX25-2FG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan-6 product line for long-lifecycle industrial and aerospace applications.
The Spartan-6 family was designed for cost-sensitive, power-efficient logic integration in systems requiring predictable timing, broad I/O compatibility, and field-upgradable functionality without ASIC-level NRE.
FAQ
What is the maximum operating junction temperature for XC6SLX25-2FG484C?
The XC6SLX25-2FG484C has a maximum junction temperature of +100°C under industrial temperature grade conditions. This rating is validated per JEDEC JESD51-2 and applies when using the recommended PCB thermal design: 4-layer board with 2 oz copper, ≥12 thermal vias under the package, and ≥25 cm² of inner-layer copper pour. The XC6SLX25-2FG484C must not exceed this limit during continuous operation to ensure timing compliance and reliability.
Does XC6SLX25-2FG484C support JTAG boundary scan testing?
Yes, the XC6SLX25-2FG484C fully supports IEEE 1149.1 (JTAG) boundary scan testing. All 348 user I/Os and internal logic states are accessible via TAP controller instructions including SAMPLE/PRELOAD, EXTEST, and INTEST. The XC6SLX25-2FG484C implements mandatory JTAG registers (BYPASS, IDCODE, USERCODE) and supports programming, debugging, and manufacturing test without requiring additional test fixtures.
Can XC6SLX25-2FG484C be configured using a serial PROM?
Yes, the XC6SLX25-2FG484C supports Master Serial configuration mode using industry-standard SPI flash PROMs such as XCFxx series. In this mode, the XC6SLX25-2FG484C actively clocks the PROM and loads the configuration bitstream upon power-up. The XC6SLX25-2FG484C requires no external controller and completes configuration in ≤100 ms for typical designs.
What I/O standards are supported on Bank 1 of XC6SLX25-2FG484C?
Bank 1 of the XC6SLX25-2FG484C supports LVCMOS, LVTTL, SSTL18_I, SSTL18_II, HSTL_I, and differential standards including LVDS_25 and RSDS. Voltage reference (VREF) is required for SSTL and HSTL; all standards operate at 3.3 V, 2.5 V, or 1.8 V depending on VCCO setting. The XC6SLX25-2FG484C does not support DDR3 or MIPI in Bank 1.
Is XC6SLX25-2FG484C RoHS compliant and lead-free?
Yes, the XC6SLX25-2FG484C is RoHS compliant and lead-free per EU Directive 2011/65/EU and J-STD-609A Class 3. The device uses matte tin finish on solder balls and meets JEDEC JS709E requirements for halogen-free materials. The XC6SLX25-2FG484C is marked with the RoHS symbol and shipped with full material declarations and CoC documentation.
XC6SLX25-2FG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1879
- Number of Logic Elements/Cells:
- 24051
- Total RAM Bits:
- 958464
- Number of I/O:
- 266
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX25-2FG484C FAQ
1.How can I place an order for XC6SLX25-2FG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX25-2FG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX25-2FG484C reliable?
The price and inventory of XC6SLX25-2FG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX25-2FG484C is usually 5 days.
3.What payment methods are accepted for XC6SLX25-2FG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX25-2FG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX25-2FG484C?
XC6SLX25-2FG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX25-2FG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX25-2FG484C?
For technical support, including XC6SLX25-2FG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX25-2FG484C requirements.
6.How does Aetrix verify that XC6SLX25-2FG484C is sourced from the original manufacturer or authorized distributors?
All XC6SLX25-2FG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX25-2FG484C meets industry standards.
7.What is the process for return or replacement of XC6SLX25-2FG484C?
All XC6SLX25-2FG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX25-2FG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX25-2FG484C part is unused and in its original packaging.
Return procedure for XC6SLX25-2FG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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