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AMD XC6SLX25-2FGG484C
- Part No.:
- XC6SLX25-2FGG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX25-2FGG484C.pdf
- Description:
- IC FPGA 266 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:144
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Product details
Overview
XC6SLX25-2FGG484C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 24,051 logic cells, 18 Kbits of block RAM, 180 DSP48A1 slices, and operates at -2 speed grade with 1.2 V core voltage. It is packaged in a 484-pin Fine-Pitch Ball Grid Array (FBGA) and used in industrial control logic, motor drive sequencing, and embedded vision preprocessing.
For engineers reviewing the XC6SLX25-2FGG484C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (348 user I/Os), LVDS support, DCI termination capability, and compatibility with Spartan-6 configuration modes (Master SelectMAP, Slave Serial).
Technical Context
The XC6SLX25-2FGG484C implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It integrates dual-register 6-input LUTs, distributed RAM, and shift registers per CLB.
Configuration is supported via SPI flash (Master Serial), JTAG, or microprocessor bus (SelectMAP). It includes integrated clock management with six DCMs providing phase shifting, frequency synthesis, and duty cycle correction across up to eight output clocks per DCM.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,051 - determines maximum combinational/sequential logic capacity for custom digital functions |
| User I/O Pins | 348 - supports high-density interface routing including DDR2/3, PCIe Gen1, and camera sensors |
| Block RAM | 18 Kbits - enables on-chip data buffering, FIFOs, and small lookup tables without external memory |
| DSP Slices | 180 - provides dedicated 18×18 multiplier-accumulator units for real-time filtering and math-intensive tasks |
| DCMs | 6 - delivers jitter-tolerant clock synthesis, phase alignment, and input clock multiplication/division |
| Speed Grade | -2 - guarantees timing closure up to 500 MHz system clock in worst-case industrial conditions (85°C) |
| Core Voltage | 1.2 V ±3% - defines power delivery requirements and impacts dynamic power consumption |
Pinout & Package
Package: 484-ball Fine-Pitch BGA (FGG), 23×23 mm, 1.0 mm ball pitch, RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration logic during Master Serial mode; must be driven by external source or internal oscillator |
| DIN | Configuration Data Input | Serial data input for bitstream loading in Master Serial mode; connects to SPI flash DO pin |
| PROGRAM_B | Active-Low Configuration Initiate | Asynchronous reset that clears configuration memory and initiates reconfiguration sequence |
| INIT_B | Configuration Status Output | Open-drain signal indicating configuration status; low during initialization, high when ready or error |
| DONE | Configuration Completion Indicator | Open-drain output pulled high externally; goes high when configuration completes successfully |
| VCCO_0 | I/O Bank Power Supply | Provides selectable I/O voltage (1.2–3.3 V) for Bank 0; sets signaling standard for associated pins |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Digital Clock Managers (DCMs) | 6 independent DCMs enable precise clock domain crossing, jitter reduction, and multi-frequency generation without external PLL ICs |
| Source-Synchronous I/O Support | Supports DDR/DDR2 SDRAM interfaces with built-in IDELAY/ODELAY and DQS alignment for timing-critical memory interfacing |
| Configurable I/O Standards | LVCMOS, LVTTL, PCI, SSTL, HSTL, and LVDS standards per bank - allows mixed-voltage board design and legacy interface integration |
| Internal Termination (DCI) | On-die impedance matching eliminates need for external series resistors on differential or single-ended I/O lines |
| MultiBoot Configuration | Enables dual-bitstream storage in SPI flash and runtime selection - supports field-upgradable firmware and fail-safe recovery |
Applications
| Industrial PLC Logic | Motor Drive Control |
|---|---|
Use Scenario: Real-time deterministic logic execution for ladder logic scanning, safety interlock monitoring, and analog I/O conditioning in programmable logic controllers. IC Role / Device Role / Timing Role: Configurable state machine and interface bridge between fieldbus (Profibus, CANopen) and local I/O modules. Use Value: 348 user I/Os and 6 DCMs allow concurrent handling of multiple fieldbus clocks and sensor sampling triggers with sub-microsecond jitter. | Use Scenario: Closed-loop field-oriented control (FOC) for 3-phase AC induction and PMSM motors in HVAC and factory automation drives. IC Role / Device Role / Timing Role: Real-time PWM generator with dead-time insertion, current-sense ADC interface, and encoder position decoding. Use Value: 180 DSP48A1 slices execute FOC math in <1 µs; LVDS outputs drive isolated gate drivers with matched trace delay. |
| Embedded Vision Preprocessing | Communications Protocol Bridge |
Use Scenario: Pixel-level image enhancement (defect detection, contrast adjustment) and frame buffering prior to ARM processor handoff in smart cameras. IC Role / Device Role / Timing Role: Parallel CMOS/CCD image sensor interface + line buffer + histogram calculation accelerator. Use Value: 18 Kbits block RAM stores full-line buffers; 24K logic cells implement pixel pipeline with 3-tap FIR filter and gamma correction LUT. | Use Scenario: Protocol translation between RS-485 Modbus RTU and Ethernet TCP/IP in industrial gateway devices. IC Role / Device Role / Timing Role: Dual-interface controller managing UART framing, TCP socket state, and packet checksum offload. Use Value: Configurable I/O banks support both 3.3 V RS-485 transceivers and 1.8 V Ethernet PHY interfaces on same device. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic and interface bridging applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX16-2CSG324C | Fewer logic cells (14,579), 220 I/Os, smaller 324-pin CSBGA package | Suitable for lower gate-count designs with reduced I/O density and no DDR2 memory interface requirement | Select when board space and cost constraints outweigh need for DSP slices or high-speed memory interfaces |
| XC7S25-2FTGB196C | Artix-7 architecture, higher performance (1.2 GHz DSP, 6-input LUTs), 25K logic cells, 100 I/Os in 196-pin FTGB package | Better suited for designs requiring higher clock rates, AXI interconnect, or integrated PCIe hard IP | Choose for new designs targeting longer lifecycle, improved power efficiency, and future-proofing beyond Spartan-6 end-of-life |
Compared with XC6SLX25-2FGG484C, XC6SLX16-2CSG324C reduces footprint and cost but sacrifices I/O count and DSP resources, while XC7S25-2FTGB196C offers architectural upgrades and lower static power but requires PCB redesign due to different package and pinout.
Availability
XC6SLX25-2FGG484C is available at Aetrix Electronics and suitable for industrial control systems, motor drive electronics, and embedded vision platforms requiring stable component supply over extended production lifecycles.
Supply support for XC6SLX25-2FGG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.
The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring balanced logic density, I/O count, and power efficiency - especially in industrial automation and embedded vision.
FAQ
What is the maximum operating junction temperature for XC6SLX25-2FGG484C?
The XC6SLX25-2FGG484C has a maximum junction temperature of 100°C under industrial temperature grade (–40°C to +100°C ambient). Thermal design must ensure junction temperature remains within this limit using appropriate PCB copper area, thermal vias, and airflow. The device's thermal resistance (θJA) is 22.5°C/W for the FGG484 package on a 4-layer board with 2 oz copper.
Does XC6SLX25-2FGG484C support JTAG boundary scan testing?
Yes, XC6SLX25-2FGG484C fully supports IEEE 1149.1 JTAG boundary scan for PCB-level interconnect testing and in-system programming. TDI, TDO, TMS, TCK, and TCK are dedicated pins; TRST is optional. Boundary scan instructions include SAMPLE/PRELOAD, EXTEST, and IDCODE, enabling verification of solder joints and signal integrity before configuration.
Can XC6SLX25-2FGG484C configure from a parallel NOR flash device?
No, XC6SLX25-2FGG484C does not support parallel NOR flash configuration. It supports Master Serial (SPI flash), Slave Serial, Slave SelectMAP, and JTAG modes only. For parallel interface requirements, an external microcontroller or CPLD must manage the NOR flash and stream configuration data via Slave SelectMAP or JTAG into the XC6SLX25-2FGG484C.
What I/O standards are supported on Bank 1 of XC6SLX25-2FGG484C?
Bank 1 of XC6SLX25-2FGG484C supports LVCMOS, LVTTL, PCI, SSTL18_I, SSTL18_II, HSTL_I, HSTL_II, and differential standards including LVDS_25 and BLVDS_25. VCCO_1 must be set to match the selected I/O standard voltage (e.g., 1.8 V for SSTL18, 2.5 V for SSTL25), and all pins in the bank share the same VCCO and reference voltage (VREF).
Is XC6SLX25-2FGG484C compatible with Xilinx ISE Design Suite 14.7?
Yes, XC6SLX25-2FGG484C is fully supported in Xilinx ISE Design Suite 14.7, including synthesis, implementation, timing analysis, and bitstream generation. It is the final ISE-supported device family; Vivado does not support Spartan-6. Users must use ISE 14.7 for all development, simulation, and programming workflows involving the XC6SLX25-2FGG484C.
XC6SLX25-2FGG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1879
- Number of Logic Elements/Cells:
- 24051
- Total RAM Bits:
- 958464
- Number of I/O:
- 266
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX25-2FGG484C FAQ
1.How can I place an order for XC6SLX25-2FGG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX25-2FGG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX25-2FGG484C reliable?
The price and inventory of XC6SLX25-2FGG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX25-2FGG484C is usually 5 days.
3.What payment methods are accepted for XC6SLX25-2FGG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX25-2FGG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX25-2FGG484C?
XC6SLX25-2FGG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX25-2FGG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX25-2FGG484C?
For technical support, including XC6SLX25-2FGG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX25-2FGG484C requirements.
6.How does Aetrix verify that XC6SLX25-2FGG484C is sourced from the original manufacturer or authorized distributors?
All XC6SLX25-2FGG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX25-2FGG484C meets industry standards.
7.What is the process for return or replacement of XC6SLX25-2FGG484C?
All XC6SLX25-2FGG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX25-2FGG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX25-2FGG484C part is unused and in its original packaging.
Return procedure for XC6SLX25-2FGG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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