AMD XC6SLX25-2FGG484I

Overview

XC6SLX25-2FGG484I from AMD (formerly Xilinx) is a Spartan-6 FPGA with 24,051 logic cells, 1.8 V core voltage, -2 speed grade, and 484-pin Fine-Pitch Ball Grid Array (FBGA) packaging. It integrates 92 embedded 18×18 multipliers, 1,824 Kbits of block RAM, and supports DDR2/DDR3 memory interfaces for industrial control and communication infrastructure applications.

For engineers reviewing the XC6SLX25-2FGG484I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (348 user I/Os), thermal performance in industrial temperature range (–40°C to +100°C), configuration interface options (SPI, JTAG, SelectMAP), and compatibility with Xilinx ISE Design Suite v14.7.

Technical Context

The XC6SLX25-2FGG484I implements a configurable logic fabric based on six-input LUTs and flip-flops per CLB, with dedicated carry logic for arithmetic functions. It includes Digital Clock Managers (DCMs) for clock synthesis and phase alignment, supporting input frequencies from 10 MHz to 500 MHz.

Configuration is performed via Master SPI, Slave SPI, or JTAG modes using external PROM or processor-controlled loading. The device supports partial reconfiguration and uses 1.8 V VCCINT, 2.5 V VCCAUX, and 3.3 V VCCO for I/O banks-each bank independently configurable for LVCMOS, LVTTL, SSTL, or HSTL standards.

Key Specifications

Pinout & Package

XC6SLX25-2FGG484I is housed in a 484-ball Fine-Pitch BGA (FGG) package with 23×23 array, 1.0 mm ball pitch, and 22.5 mm × 22.5 mm body size. Thermal pad exposed on underside requires solder paste stencil design per Xilinx UG381.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic and interface applications.

Compared with XC6SLX45-2FGG484I, the XC6SLX25-2FGG484I offers lower static power and reduced PCB layer count due to identical pinout but fewer internal resources; versus XC7S25-2FTG256I, it retains ISE toolchain support and DCM-based clock management but consumes more power and occupies larger board area.

Availability

XC6SLX25-2FGG484I is available at Aetrix Electronics and suitable for industrial automation, medical imaging systems, and avionics data concentrators requiring stable component supply across long production lifecycles.

Supply support for XC6SLX25-2FGG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and maintains the Spartan-6 product family for industrial and aerospace applications requiring long-term availability and mature toolchain support.

The Spartan-6 family was designed for cost-sensitive, high-volume embedded systems needing balanced logic density, I/O flexibility, and low-power operation - especially where ISE Design Suite compatibility remains critical.

FAQ

What is the maximum supported memory interface speed for XC6SLX25-2FGG484I?

The XC6SLX25-2FGG484I supports DDR2 SDRAM up to 400 Mbps data rate and DDR3 SDRAM up to 800 Mbps using its SelectIO pins and DCM-based clocking. These speeds assume proper PCB layout, termination, and timing closure in Xilinx ISE with appropriate constraints files. The XC6SLX25-2FGG484I does not support LPDDR or GDDR memory standards.

Does XC6SLX25-2FGG484I support partial reconfiguration?

Yes, the XC6SLX25-2FGG484I supports partial reconfiguration through the ICAP (Internal Configuration Access Port) interface, allowing dynamic logic module swapping without full device reset. This capability requires use of Xilinx ISE 14.7 with PlanAhead tools and adherence to strict floorplanning rules. The XC6SLX25-2FGG484I implementation must reserve dedicated configuration logic and avoid routing conflicts in reconfigurable regions.

What configuration modes are supported by XC6SLX25-2FGG484I?

The XC6SLX25-2FGG484I supports Master SPI, Slave SPI, JTAG, and SelectMAP configuration modes. Master SPI uses internal oscillator to drive external SPI flash; Slave SPI relies on external controller clock; JTAG enables programming and debugging via boundary scan; SelectMAP allows high-speed parallel loading from microprocessor or FPGA companion device. All modes are electrically supported on the XC6SLX25-2FGG484I pinset.

Is XC6SLX25-2FGG484I RoHS compliant and lead-free?

Yes, the XC6SLX25-2FGG484I is RoHS-compliant and lead-free, meeting EU Directive 2011/65/EU and JEDEC JS709C requirements. The FGG484 package uses matte tin finish on solder balls, and the device is rated for SnPb and Pb-free assembly processes. Full compliance documentation, including material declarations and test reports, is available under AMD's product change notification system for XC6SLX25-2FGG484I.

Can XC6SLX25-2FGG484I operate at junction temperatures above 100°C?

No, the XC6SLX25-2FGG484I is rated for maximum junction temperature of +100°C under industrial temperature grade (I). Operation beyond this limit risks timing violation, configuration loss, or permanent damage. Thermal design must ensure junction temperature stays within specification using calculated θJA, ambient conditions, and power dissipation estimates from Xilinx XPE for the specific XC6SLX25-2FGG484I implementation.