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AMD XC6SLX25-2FT256C
- Part No.:
- XC6SLX25-2FT256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC6SLX25-2FT256C.pdf
- Description:
- IC FPGA 186 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,259
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Product details
Overview
XC6SLX25-2FT256C from AMD (formerly Xilinx) is a Spartan-6 FPGA with 24,051 logic cells, 1.8 V core voltage, -2 speed grade, and 256-pin FTBGA package. It integrates 92 DSP48A1 slices, 1,824 Kbits of block RAM, and supports PCIe Gen1 endpoint functionality in industrial control and embedded vision systems.
For engineers reviewing the XC6SLX25-2FT256C datasheet, pinout, applications, or equivalent options, key selection considerations include I/O count (186 user I/Os), LVDS support, clock management (DCM and PLL), and industrial temperature range (0°C to 85°C).
Technical Context
The XC6SLX25-2FT256C implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It includes two Digital Clock Managers (DCMs) and one Phase-Locked Loop (PLL) for clock synthesis, multiplication, phase shifting, and duty-cycle correction.
It supports SelectIO standards including LVCMOS, LVTTL, HSTL, SSTL, and differential standards such as LVDS, Mini-LVDS, RSDS, and BLVDS. Configuration is performed via Master SPI, Slave Serial, or JTAG interfaces using external PROM or processor-controlled loading.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,051 - total available LUT+FF pairs for combinational and sequential logic implementation |
| User I/O Pins | 186 - configurable single-ended and differential I/Os supporting multiple voltage standards |
| Block RAM | 1,824 Kbits - distributed across 72 x 18-Kb blocks for data buffering and FIFOs |
| DSP Slices | 92 - 18×25-bit multiplier-accumulator units for filtering and math-intensive functions |
| Speed Grade | -2 - guarantees timing closure at specified maximum frequencies for critical paths |
| Operating Temp | 0°C to +85°C - qualified for industrial environment operation without derating |
| Core Voltage | 1.2 V ±3% - supplies internal logic; requires low-noise regulation and decoupling |
Pinout & Package
XC6SLX25-2FT256C is housed in a 256-pin Fine-Pitch Thin BGA (FTBGA) package with 1.0 mm ball pitch, 17 × 17 array, and thermal pad. Package dimensions are 17 mm × 17 mm × 1.35 mm (height).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - sets output voltage level for associated pins |
| K1 | GCLK0 | Global clock input - low-skew routing to all clock-capable resources |
| M2 | PROGRAM_B | Active-low configuration reset - initiates reconfiguration from external source |
| P4 | INIT_B | Open-drain status output - indicates configuration status and errors |
| T1 | CCLK | Configuration clock - drives serial configuration data into FPGA |
| R1 | DONE | Open-drain completion signal - goes high when configuration completes successfully |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PCI Express Endpoint | Hard IP block supporting Gen1 x1 link - eliminates need for external bridge IC in host-attached designs |
| Dual-Channel DDR2/DDR3 Memory Controller | Supports up to 400 MHz data rate with 64-bit bus width - enables direct connection to external memory without glue logic |
| Low-Power Advanced IO | Supports 1.2–3.3 V I/O standards with programmable drive strength and slew rate - reduces EMI and improves signal integrity |
| Embedded Block RAM | 72 × 18-Kb blocks with true dual-port capability - allows simultaneous read/write access for buffer and lookup table applications |
| Configurable Logic Blocks | Each CLB contains four 6-input LUTs and eight FFs - balances density and performance for mid-range logic capacity |
Applications
| Industrial PLC I/O Module | Machine Vision Preprocessing Unit |
|---|---|
Use Scenario: Real-time digital I/O expansion and protocol translation (Modbus TCP, EtherCAT) in programmable logic controllers. IC Role / Device Role / Timing Role: Configurable logic fabric handles custom state machines and interface bridging; DCMs manage synchronous timing across multiple fieldbus domains. Use Value: XC6SLX25-2FT256C provides deterministic latency and 186 I/Os for sensor/actuator interfacing while meeting IEC 61131-3 execution timing requirements. | Use Scenario: On-camera preprocessing of Bayer-pattern image data before transmission to host processor. IC Role / Device Role / Timing Role: FPGA acts as pixel pipeline accelerator - performing demosaicing, white balance, and gamma correction in real time. Use Value: XC6SLX25-2FT256C delivers 92 DSP48A1 slices for parallel pixel math and LVDS I/O for high-speed image sensor interface at <100 µs latency. |
| Medical Imaging Interface Adapter | Avionics Data Concentrator |
Use Scenario: Bridging legacy analog video (PAL/NTSC) and digital imaging buses (Camera Link, CoaXPress) in diagnostic ultrasound systems. IC Role / Device Role / Timing Role: XC6SLX25-2FT256C serves as protocol converter and timing synchronizer between asynchronous video sources and digital back-end processors. Use Value: XC6SLX25-2FT256C supports multi-standard I/O banks and DCM-based pixel clock regeneration to maintain sub-line jitter compliance per IEC 62304. | Use Scenario: Aggregating ARINC 429, MIL-STD-1553, and discrete I/O signals in flight control computers. IC Role / Device Role / Timing Role: FPGA implements deterministic time-triggered communication stacks and hardware watchdog supervision. Use Value: XC6SLX25-2FT256C meets DO-254 Level A design assurance with -2 speed grade ensuring worst-case timing margin across temperature and voltage. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic and interface acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX16-2FTG256I | Fewer logic cells (14,579), same package, industrial temp range (-40°C to +100°C) | Limited DSP and RAM resources - suitable only for simpler control logic, not vision preprocessing | Select when lower cost and reduced feature set meet functional requirements |
| XC7S25-1CSGA225C | Artix-7 generation, higher logic density (23,000 LUTs), 1.0 V core, smaller 225-pin CSBGA package | Includes integrated ADC and more advanced transceivers - better for mixed-signal or high-speed serial integration | Choose for new designs requiring longer lifecycle, lower power, or enhanced analog interface capability |
Compared with XC6SLX25-2FT256C, XC6SLX16-2FTG256I offers cost reduction at the expense of DSP and memory bandwidth, while XC7S25-1CSGA225C provides architectural upgrades including hardened ADC and improved transceiver support - both require PCB redesign due to non-pin-compatible footprints.
Availability
XC6SLX25-2FT256C is available at Aetrix Electronics and suitable for industrial automation, embedded vision, medical imaging, and avionics applications requiring stable component supply and long-term manufacturing continuity.
Supply support for XC6SLX25-2FT256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for data center, AI, and embedded markets.
The Spartan-6 family, including XC6SLX25-2FT256C, was designed for cost-sensitive, high-volume embedded applications requiring balanced logic density, I/O flexibility, and industrial-grade reliability.
FAQ
What is the maximum operating frequency of the XC6SLX25-2FT256C?
The XC6SLX25-2FT256C has a -2 speed grade, meaning its guaranteed maximum clock frequency for internal logic is 500 MHz for register-to-register paths under industrial temperature and voltage conditions. This value is validated per Xilinx DS162 and applies to fully constrained and routed designs meeting timing closure requirements. The actual achievable frequency depends on design complexity, placement, and routing.
Does the XC6SLX25-2FT256C support DDR3 memory interfaces?
Yes, the XC6SLX25-2FT256C supports DDR3 SDRAM interfaces through its embedded Memory Interface Generator (MIG) v3.7 and later tools. It achieves data rates up to 400 MHz (800 Mbps) with 64-bit bus width using dedicated I/O banks and calibration logic. Support requires proper board layout, termination, and MIG-generated controller IP configured for the specific memory part.
Is the XC6SLX25-2FT256C RoHS compliant and lead-free?
Yes, the XC6SLX25-2FT256C is RoHS compliant and manufactured with lead-free (Pb-free) packaging per J-STD-609. The FTBGA package uses matte tin finish on solder balls and complies with EU Directive 2011/65/EU. Full compliance documentation, including material declarations and test reports, is available from AMD's product change notifications and quality portal.
Can the XC6SLX25-2FT256C be configured via JTAG only?
No - while JTAG is supported for debugging and programming, the XC6SLX25-2FT256C requires an external configuration source (e.g., SPI flash, microcontroller, or processor) for reliable power-on initialization. JTAG alone cannot load full bitstreams at startup; it is used for boundary scan, partial reconfiguration, or debug access after configuration completes.
What development tools are required to program the XC6SLX25-2FT256C?
Xilinx ISE Design Suite 14.7 is the officially supported toolchain for the XC6SLX25-2FT256C. It includes synthesis (XST), implementation (MAP, PAR), and bitstream generation (BITGEN). Vivado does not support Spartan-6 devices. Programming is performed using iMPACT or third-party tools compatible with Xilinx SVF/JAM files and JTAG or slave serial protocols.
XC6SLX25-2FT256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1879
- Number of Logic Elements/Cells:
- 24051
- Total RAM Bits:
- 958464
- Number of I/O:
- 186
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC6SLX25-2FT256C FAQ
1.How can I place an order for XC6SLX25-2FT256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX25-2FT256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX25-2FT256C reliable?
The price and inventory of XC6SLX25-2FT256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX25-2FT256C is usually 5 days.
3.What payment methods are accepted for XC6SLX25-2FT256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX25-2FT256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX25-2FT256C?
XC6SLX25-2FT256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX25-2FT256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX25-2FT256C?
For technical support, including XC6SLX25-2FT256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX25-2FT256C requirements.
6.How does Aetrix verify that XC6SLX25-2FT256C is sourced from the original manufacturer or authorized distributors?
All XC6SLX25-2FT256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX25-2FT256C meets industry standards.
7.What is the process for return or replacement of XC6SLX25-2FT256C?
All XC6SLX25-2FT256C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX25-2FT256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX25-2FT256C part is unused and in its original packaging.
Return procedure for XC6SLX25-2FT256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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