AMD XC6SLX25-2FT256I
- Part No.:
- XC6SLX25-2FT256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC6SLX25-2FT256I.pdf
- Description:
- IC FPGA 186 I/O 256FTBGA
- Quantity:
- Payment:

- Shipping:

Inventory:195
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Product details
Overview
XC6SLX25-2FT256I from AMD (formerly Xilinx) is a Spartan-6 FPGA with 24,051 logic cells, 1.8 V core voltage, -2 speed grade, and 256-pin FTBGA package. It integrates 92 DSP48A1 slices, 1,728 Kbits of block RAM, and supports PCIe Gen1 endpoint functionality in industrial control and embedded vision systems.
For engineers reviewing the XC6SLX25-2FT256I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (186 user I/Os), differential signaling support (LVDS, TMDS), configuration interface options (SPI, SelectMAP), and thermal performance in extended temperature (-40°C to +100°C).
Technical Context
The XC6SLX25-2FT256I implements a synchronous, SRAM-based FPGA architecture with configurable logic blocks (CLBs), dedicated carry chains, and distributed RAM. It supports dual-register flip-flops per LUT, shift register LUTs (SRL32), and built-in clock management via DCMs (Digital Clock Managers) with phase shifting and frequency synthesis.
Configuration is performed via Master SPI or Slave SelectMAP mode using external PROM or processor. JTAG boundary-scan (IEEE 1149.1) is supported for debugging and programming. The device includes internal pull-up resistors on configuration pins and supports multi-boot via fallback address mapping.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,051 - determines maximum combinational/sequential logic capacity for custom digital functions |
| User I/O Pins | 186 - supports parallel interfaces, high-speed serial links, and mixed-voltage domain connectivity |
| Block RAM | 1,728 Kbits - enables on-chip buffering, FIFOs, and data storage without external memory |
| DSP Slices | 92 × DSP48A1 - provides dedicated 18×18 multiplier-accumulator units for signal processing |
| Speed Grade | -2 - guarantees timing closure up to 500 MHz system clock in worst-case industrial conditions |
| Operating Temp | -40°C to +100°C - qualified for extended-temperature industrial and transportation applications |
| Core Voltage | 1.8 V ±3% - defines power delivery requirements and impacts dynamic power consumption |
Pinout & Package
XC6SLX25-2FT256I is housed in a 256-ball Fine-Pitch Thin BGA (FTBGA) package with 1.0 mm ball pitch and 17×17 array. Package dimensions are 17 mm × 17 mm × 1.35 mm (height), RoHS-compliant, and designed for reflow soldering.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - sets output voltage level (1.2–3.3 V) for associated pins |
| H2 | IO_L0N_0 | Differential pair negative input - used with IO_L0P_0 for LVDS/TMDS receiver termination |
| J1 | IO_L1P_0 | Differential pair positive input - supports 800 Mbps DDR3 source-synchronous interfaces |
| K2 | M0 | Configuration mode select - low = Master SPI, high = Slave SelectMAP or JTAG |
| T14 | CCLK | Configuration clock - drives internal configuration logic during SPI or SelectMAP load |
| R15 | DONE | Configuration status indicator - goes high when bitstream loading and startup sequence complete |
Key Features
| Feature | Design Value |
|---|---|
| Integrated DCMs | Two Digital Clock Managers per device - enable jitter-reduced clock synthesis, phase alignment, and frequency multiplication/division |
| SelectIO Technology | Supports 18 I/O standards including LVCMOS, SSTL, HSTL, and differential LVDS - simplifies interface to memory, sensors, and FPD-Link |
| PCIe Endpoint Logic | Built-in hard IP for PCIe Gen1 x1 - eliminates need for external bridge IC and reduces latency in host communication |
| Multi-Boot Capability | Supports dual-bitstream fallback via M[2:0] pins - enables field-upgradable firmware with safe recovery path |
| ISE Design Suite Support | Fully compatible with Xilinx ISE 14.7 - ensures stable toolchain for legacy industrial designs requiring long-term maintenance |
Applications
| Industrial PLC Controller | Embedded Vision Camera |
|---|---|
Use Scenario: Real-time motion control and I/O expansion in programmable logic controllers with deterministic cycle times. IC Role / Device Role / Timing Role: FPGA fabric implements custom state machines, PWM generators, and EtherCAT slave protocol stack. Use Value: 186 user I/Os allow direct connection to 24V digital inputs/outputs; -2 speed grade ensures sub-1 µs logic propagation for tight servo loop timing. | Use Scenario: High-resolution image preprocessing in smart cameras for factory automation inspection. IC Role / Device Role / Timing Role: Configurable logic processes Bayer demosaicing, histogram equalization, and edge detection before JPEG compression. Use Value: 92 DSP48A1 slices accelerate pixel-level arithmetic; block RAM buffers full-frame sensor data at 60 fps without external DRAM. |
| Avionics Data Concentrator | Railway Signaling Interface |
Use Scenario: Aggregation and protocol translation between ARINC 429, MIL-STD-1553, and RS-422 subsystems in regional aircraft. IC Role / Device Role / Timing Role: FPGA implements multiple concurrent serial transceivers with precise bit-timing and CRC generation. Use Value: Extended temperature rating (-40°C to +100°C) meets DO-160E Section 22 Category A environmental testing; SelectIO supports all required voltage levels. | Use Scenario: Interlocking logic and fail-safe I/O conditioning in European railway ETCS Level 1 balise transmission modules. IC Role / Device Role / Timing Role: FPGA executes SIL-3 certified safety logic using lockstep dual-core configuration and periodic self-test routines. Use Value: Internal DCMs generate synchronized clocks for watchdog timers and diagnostic sampling; multi-boot enables safe firmware updates without system downtime. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX16-2FTG256I | 14,579 logic cells, 1,152 Kbits block RAM, same FTBGA-256 package | Limited DSP resources (58 slices) and lower I/O count (102) restrict complex algorithm offload | Choose when design fits within reduced resource budget and cost sensitivity outweighs future scalability |
| XC7S25-2FTGB196I | Artix-7 architecture, 23,000 logic cells, 1.0 V core, 196-pin FTBGA, no native PCIe Gen1 | Higher performance per watt but requires migration to Vivado toolchain and lacks hard PCIe endpoint | Prefer for new designs needing lower static power and longer roadmap support, accepting software/toolchain transition effort |
Compared with XC6SLX25-2FT256I, XC6SLX16-2FTG256I offers cost reduction at the expense of DSP and I/O headroom, while XC7S25-2FTGB196I trades mature PCIe integration for improved power efficiency and newer silicon process - both require PCB redesign due to non-pin-compatible footprints.
Availability
XC6SLX25-2FT256I is available at Aetrix Electronics and suitable for industrial PLC controllers, embedded vision systems, and avionics data concentrators requiring stable component supply across long-lifecycle programs.
Supply support for XC6SLX25-2FT256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan-6 product family for industrial and aerospace applications requiring long-term availability and proven reliability.
The Spartan-6 family targets cost-sensitive, high-volume embedded systems where predictable timing, low power, and mature tool support (ISE 14.7) are critical for certification and maintenance.
FAQ
What is the maximum operating frequency of the XC6SLX25-2FT256I?
The XC6SLX25-2FT256I has a -2 speed grade, guaranteeing timing closure up to 500 MHz for internal logic paths under worst-case industrial temperature and voltage conditions. Actual system clock frequencies depend on design complexity, routing, and I/O standard selection - for example, DDR3 interfaces typically run at 400–533 MHz data rates using source-synchronous capture.
Does the XC6SLX25-2FT256I support JTAG programming and debugging?
Yes, the XC6SLX25-2FT256I fully supports IEEE 1149.1 JTAG boundary-scan for programming, configuration verification, and real-time debugging. TDI, TDO, TMS, TCK, and TCK pins are assigned to dedicated balls (e.g., R16, T16, U15, U16, T15), enabling use with standard Xilinx Platform Cable USB or third-party JTAG adapters.
Can the XC6SLX25-2FT256I be configured via SPI flash memory?
Yes, the XC6SLX25-2FT256I supports Master SPI configuration mode using standard quad-SPI or standard SPI flash devices (e.g., Micron N25Q, Spansion S25FL). Configuration is initiated automatically on power-up when M[2:0] pins are set to 001, and the device loads the bitstream directly from the connected flash without external controller intervention.
What I/O standards are supported by the XC6SLX25-2FT256I?
The XC6SLX25-2FT256I supports 18 SelectIO standards including LVCMOS (1.2–3.3 V), SSTL18, HSTL_I, LVDS, TMDS, and RSDS. Each I/O bank operates independently with its own VCCO voltage, allowing mixed-voltage interfaces - for instance, interfacing 1.8 V memory with 3.3 V sensors on the same device.
Is the XC6SLX25-2FT256I qualified for extended temperature operation?
Yes, the XC6SLX25-2FT256I is rated for -40°C to +100°C junction temperature and is manufactured and tested to meet industrial-grade reliability standards. This qualification supports deployment in uncontrolled environments such as rail-side cabinets, turbine enclosures, and outdoor surveillance housings without additional thermal derating.
XC6SLX25-2FT256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1879
- Number of Logic Elements/Cells:
- 24051
- Total RAM Bits:
- 958464
- Number of I/O:
- 186
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC6SLX25-2FT256I FAQ
1.How can I place an order for XC6SLX25-2FT256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX25-2FT256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX25-2FT256I reliable?
The price and inventory of XC6SLX25-2FT256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX25-2FT256I is usually 5 days.
3.What payment methods are accepted for XC6SLX25-2FT256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX25-2FT256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX25-2FT256I?
XC6SLX25-2FT256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX25-2FT256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX25-2FT256I?
For technical support, including XC6SLX25-2FT256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX25-2FT256I requirements.
6.How does Aetrix verify that XC6SLX25-2FT256I is sourced from the original manufacturer or authorized distributors?
All XC6SLX25-2FT256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX25-2FT256I meets industry standards.
7.What is the process for return or replacement of XC6SLX25-2FT256I?
All XC6SLX25-2FT256I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX25-2FT256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX25-2FT256I part is unused and in its original packaging.
Return procedure for XC6SLX25-2FT256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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