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AMD XC6SLX25-2FTG256C
- Part No.:
- XC6SLX25-2FTG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC6SLX25-2FTG256C.pdf
- Description:
- IC FPGA 186 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:338
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Product details
Overview
XC6SLX25-2FTG256C from AMD (formerly Xilinx) is a Spartan-6 FPGA with 24,051 logic cells, 18 Kbits of block RAM, and 186 user I/Os in a 256-pin FTBGA package. It operates at -2 speed grade (1.2 V core, 100 MHz system clock), supporting embedded control, industrial interface bridging, and low-power video processing.
For engineers reviewing the XC6SLX25-2FTG256C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, block RAM depth, LVDS support, single-ended signaling compatibility, and industrial temperature range operation.
Technical Context
The XC6SLX25-2FTG256C implements a hierarchical FPGA architecture with six-input LUTs, dedicated carry logic, and integrated DSP48A1 slices for arithmetic acceleration. It supports SelectIO standards including LVCMOS, LVTTL, LVDS, and SSTL across its 186 user I/Os.
Configuration is performed via Master SPI or JTAG, with support for fallback configuration and multi-boot using external serial flash. The device includes internal oscillator, PLLs for clock multiplication and phase alignment, and power-on reset circuitry.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,051 - determines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 18 Kbits - provides on-chip memory for FIFOs, buffers, or small lookup tables without external memory |
| User I/Os | 186 - enables high-density peripheral interfacing with configurable voltage and standard support |
| Speed Grade | -2 - guarantees timing closure up to 100 MHz system clock frequency at 85°C junction temperature |
| Operating Temp | 0°C to 85°C - qualified for commercial and industrial ambient environments without derating |
| Core Voltage | 1.2 V ±3% - requires tight-regulation DC-DC supply with low-noise output |
| Package | FTG256 - 17×17 mm fine-pitch BGA with 1.0 mm ball pitch and exposed thermal pad |
Pinout & Package
XC6SLX25-2FTG256C is housed in a 256-ball Fine-Pitch Thin BGA (FTBGA) package with 17×17 array, 1.0 mm ball pitch, and thermally enhanced exposed pad. Pin assignments follow Xilinx Spartan-6 pinout conventions with dedicated configuration, clock, and I/O banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | CONFIG_DONE | Open-drain status signal indicating successful configuration completion |
| H2 | INIT_B | Active-low open-drain signal indicating device initialization status |
| K1 | PROGRAM_B | Active-low input that resets configuration memory and initiates reconfiguration |
| M1 | CCLK | Configuration clock input for Master SPI mode; driven by external source or internal oscillator |
| P1 | DIN | Serial data input for Master SPI configuration interface |
| R1 | TCK | JTAG test clock input per IEEE 1149.1 boundary-scan protocol |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated DSP48A1 Slices | 12 units enabling 18×18-bit multiply-accumulate operations per slice for real-time filtering |
| SelectIO Technology | Supports LVDS, LVCMOS, SSTL, and HSTL standards across all I/O banks with programmable drive strength |
| Embedded Block RAM | 18 Kbits distributed as 32 × 512-bit blocks, each independently addressable for dual-port operation |
| PLL Clock Management | Two integrated PLLs provide clock multiplication, phase shifting, and jitter reduction for synchronous design |
| Multi-Boot Configuration | Enables field-upgradable firmware via dual-image bitstream storage in external flash memory |
Applications
| Industrial PLC I/O Module | Video Interface Bridge |
|---|---|
Use Scenario: Real-time digital I/O expansion and protocol translation in modular automation controllers. IC Role / Device Role / Timing Role: FPGA fabric implements custom state machines, GPIO multiplexing, and Modbus RTU/ASCII framing logic. Use Value: 186 user I/Os allow direct connection to 32-channel digital input/output terminals without glue logic. | Use Scenario: Converting parallel RGB video signals to serialized LVDS streams for panel driving. IC Role / Device Role / Timing Role: Timing-critical pixel clock domain crossing and serialization using OSERDES primitives. Use Value: Built-in LVDS transmitters and 100 MHz system clock capability meet 720p60 timing requirements. |
| Medical Sensor Hub | Test Equipment Pattern Generator |
Use Scenario: Aggregating and preprocessing analog sensor data from multiple patient monitoring channels. IC Role / Device Role / Timing Role: Controls ADC sampling sequencing, applies FIR filtering via DSP48A1 slices, and formats data for UART transmission. Use Value: 18 Kbits block RAM stores filter coefficients and short-term waveform buffers without external memory. | Use Scenario: Generating precise digital stimulus patterns for IC functional validation. IC Role / Device Role / Timing Role: State-machine-based pattern sequencer with deterministic timing controlled by PLL-synchronized clocks. Use Value: -2 speed grade ensures sub-10 ns setup/hold margins for 100 MHz vector rates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX16-2FTG256C | Fewer logic cells (14,579) and reduced block RAM (16 Kbits); same package and speed grade | Suitable for lower-complexity control logic but insufficient for multi-channel video buffering | Select when design fits within smaller resource budget and cost sensitivity outweighs future scalability |
| XC6SLX45-2FGG484C | Higher logic density (43,661 cells), more I/Os (291), larger 484-pin FBGA package | Required for designs needing >186 I/Os or >18 Kbits RAM; incompatible PCB footprint | Choose when expanding functionality beyond XC6SLX25-2FTG256C limits and board redesign is acceptable |
Compared with XC6SLX25-2FTG256C, XC6SLX16-2FTG256C offers cost savings at the expense of logic and memory headroom, while XC6SLX45-2FGG484C delivers scalability at the cost of mechanical redesign and higher BOM cost.
Availability
XC6SLX25-2FTG256C is available at Aetrix Electronics and suitable for industrial PLC modules, medical sensor hubs, and video interface bridges requiring stable component supply and long-term production support.
Supply support for XC6SLX25-2FTG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and related software tools.
The Spartan-6 family was originally designed by Xilinx for cost-sensitive, high-volume applications requiring low power, small form factor, and reliable I/O flexibility.
FAQ
What is the maximum operating frequency supported by XC6SLX25-2FTG256C?
The XC6SLX25-2FTG256C is rated for a -2 speed grade, guaranteeing timing closure up to 100 MHz system clock frequency under industrial temperature conditions (0°C to 85°C). Actual achievable frequency depends on design complexity, routing, and I/O standard selection. The device includes two PLLs capable of generating higher internal clocks, but system-level performance remains constrained by the -2 timing model.
Does XC6SLX25-2FTG256C support LVDS signaling?
Yes, XC6SLX25-2FTG256C supports LVDS signaling on dedicated differential I/O pairs across multiple banks. Each LVDS pair can operate at up to 1.0 Gbps with proper termination and layout. The FPGA's SelectIO technology allows simultaneous use of LVDS with other standards like LVCMOS or SSTL in different I/O banks, provided voltage and reference constraints are met.
What configuration methods are supported by XC6SLX25-2FTG256C?
XC6SLX25-2FTG256C supports Master SPI, Slave Serial, and JTAG configuration modes. Master SPI uses internal oscillator or external CCLK to load bitstream from SPI flash. JTAG enables programming and debugging during development. The device also supports fallback configuration and multi-boot using dual-image bitstreams stored in external flash memory.
Is XC6SLX25-2FTG256C RoHS compliant and lead-free?
Yes, XC6SLX25-2FTG256C is RoHS compliant and manufactured with lead-free packaging. The FTG256 package uses matte tin surface finish on solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements. Full compliance documentation is available in AMD's official product change notices and material declarations.
Can XC6SLX25-2FTG256C be used in automotive applications?
No, XC6SLX25-2FTG256C is specified for commercial and industrial temperature ranges (0°C to 85°C) and is not qualified to AEC-Q100 standards. For automotive applications, AMD offers the Spartan-6Q family with extended temperature range (-40°C to 125°C) and automotive qualification. XC6SLX25-2FTG256C should only be deployed in non-safety-critical industrial or consumer systems.
XC6SLX25-2FTG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1879
- Number of Logic Elements/Cells:
- 24051
- Total RAM Bits:
- 958464
- Number of I/O:
- 186
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC6SLX25-2FTG256C FAQ
1.How can I place an order for XC6SLX25-2FTG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX25-2FTG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX25-2FTG256C reliable?
The price and inventory of XC6SLX25-2FTG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX25-2FTG256C is usually 5 days.
3.What payment methods are accepted for XC6SLX25-2FTG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX25-2FTG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX25-2FTG256C?
XC6SLX25-2FTG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX25-2FTG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX25-2FTG256C?
For technical support, including XC6SLX25-2FTG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX25-2FTG256C requirements.
6.How does Aetrix verify that XC6SLX25-2FTG256C is sourced from the original manufacturer or authorized distributors?
All XC6SLX25-2FTG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX25-2FTG256C meets industry standards.
7.What is the process for return or replacement of XC6SLX25-2FTG256C?
All XC6SLX25-2FTG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX25-2FTG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX25-2FTG256C part is unused and in its original packaging.
Return procedure for XC6SLX25-2FTG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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