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AMD XC6SLX25-2FTG256I
- Part No.:
- XC6SLX25-2FTG256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC6SLX25-2FTG256I.pdf
- Description:
- IC FPGA 186 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:173
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Product details
Overview
XC6SLX25-2FTG256I from AMD (formerly Xilinx) is a Spartan-6 FPGA with 24,051 logic cells, 186 I/O pins, and a -2 speed grade supporting 800 Mbps DDR3 interface operation. It integrates 92 embedded 18×18 multipliers and 716 kB of block RAM, deployed in industrial control systems requiring deterministic timing and reconfigurable logic.
For engineers reviewing the XC6SLX25-2FTG256I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage flexibility (1.2 V to 3.3 V), integrated clock management (DCM and PLL), and support for JTAG boundary-scan compliance per IEEE 1149.1.
Technical Context
The XC6SLX25-2FTG256I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It supports dual-register flip-flops per LUT and includes six Digital Clock Managers (DCMs) and two Phase-Locked Loops (PLLs) for clock synthesis and skew control.
This device uses 45 nm CMOS process technology and operates across industrial temperature range (–40°C to +100°C). Configuration is performed via Master Serial, Slave Serial, or JTAG modes using external SPI flash or processor-controlled interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,051 - provides gate count equivalent to ~150K ASIC gates for combinational and sequential logic implementation |
| I/O Pins | 186 - supports high-density board interconnect with programmable drive strength and slew rate control |
| Block RAM | 716 kB - enables on-chip data buffering, FIFOs, and lookup table storage without external memory |
| Multipliers | 92 × 18×18 - accelerates DSP functions including FIR filtering and motor control algorithms |
| Speed Grade | -2 - guarantees timing closure up to 500 MHz system clock frequency under worst-case industrial conditions |
| Operating Temp | –40°C to +100°C - qualified for deployment in uncontrolled industrial enclosures and outdoor equipment |
Pinout & Package
XC6SLX25-2FTG256I is housed in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package with 1.0 mm ball pitch and 17×17 array configuration. The package supports lead-free (Pb-free) soldering and meets JEDEC J-STD-020 moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank power supply for Bank 0 - must be set to match interfaced peripheral voltage (1.2 V/1.5 V/1.8 V/2.5 V/3.3 V) |
| P2 | CLKIN_1 | Dedicated single-ended clock input for DCM/PLL - accepts 1.2–200 MHz external reference clocks |
| T14 | M0 | Configuration mode select - sets boot source as Master Serial (SPI flash) when pulled low during power-up |
| R15 | INIT_B | Open-drain status output - asserts low during configuration initialization and remains high after successful bitstream load |
| V16 | PROGRAM_B | Active-low asynchronous reset - forces reconfiguration and clears internal state when pulsed low |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Register LUTs | Enables time-multiplexed logic and pipelined datapaths without additional CLB resources |
| Integrated DCMs & PLLs | Provides jitter-reduced clock synthesis, phase shifting, and frequency multiplication for synchronous subsystems |
| SelectIO Technology | Supports LVCMOS, LVTTL, SSTL, HSTL, and differential standards (LVDS, TMDS) on same I/O bank |
| ISE Design Suite Support | Full toolchain compatibility with Xilinx ISE 14.7 for synthesis, place-and-route, and bitstream generation |
Applications
| Industrial PLC Logic | Video Interface Bridge |
|---|---|
Use Scenario: Real-time motion control sequencing in modular automation cabinets with fieldbus coexistence. IC Role / Device Role / Timing Role: Configurable logic fabric executing cyclic executive tasks and managing EtherCAT slave timing windows. Use Value: Deterministic latency under 1 µs per scan cycle enabled by hard-wired routing and -2 speed grade timing margins. | Use Scenario: Converting parallel RGB video from image sensors to embedded DisplayPort or HDMI streams. IC Role / Device Role / Timing Role: Pixel-rate glue logic with embedded serializers, timing alignment, and color-space conversion pipelines. Use Value: 800 Mbps DDR3 interface supports frame buffer access for real-time scaling and overlay compositing. |
| Medical Imaging Front-End | Test Equipment Pattern Generator |
Use Scenario: Time-of-flight signal processing in portable ultrasound transducer modules. IC Role / Device Role / Timing Role: High-speed ADC interface controller with digital beamforming and echo correlation logic. Use Value: 186 I/O pins allow simultaneous connection to 64-channel ADC arrays and low-jitter clock distribution networks. | Use Scenario: Generating synchronized multi-channel digital stimulus waveforms for IC functional validation. IC Role / Device Role / Timing Role: Programmable pattern sequencer with precise edge placement and variable-width pulse generation. Use Value: Dual-register LUTs and dedicated carry chains enable sub-nanosecond timing resolution in waveform synthesis logic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX16-2FTG256I | Fewer logic cells (14,579), reduced block RAM (576 kB), identical package and I/O count | Suitable for lower-complexity control tasks but lacks capacity for full-frame video buffering | Select when design fits within 60% of XC6SLX25-2FTG256I resource utilization and cost reduction is prioritized |
| XC6SLX45-2FGG484I | Higher logic density (43,661 cells), larger 484-pin FBGA package, increased I/O (316 pins) | Required for designs needing >24K LUTs or >200 I/Os; not footprint-compatible | Choose when XC6SLX25-2FTG256I resource usage exceeds 90% and board redesign is acceptable |
Compared with XC6SLX16-2FTG256I and XC6SLX45-2FGG484I, the XC6SLX25-2FTG256I delivers optimal balance of logic capacity, I/O count, and 256-pin footprint for mid-range industrial and imaging applications where board space and BOM cost constrain higher-density alternatives.
Availability
XC6SLX25-2FTG256I is available at Aetrix Electronics and suitable for industrial automation, medical imaging front-ends, and test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX25-2FTG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan-6 FPGA family. The company specializes in adaptive computing platforms for embedded, data center, and edge applications.
The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring low static power, flexible I/O, and proven reconfigurable logic - targeting industrial control, video processing, and communications infrastructure.
FAQ
What is the maximum supported DDR3 data rate for XC6SLX25-2FTG256I?
The XC6SLX25-2FTG256I supports DDR3 SDRAM interfaces up to 800 Mbps per pin (400 MHz clock frequency) using its SelectIO technology and dedicated memory interface logic. This capability is verified in Xilinx UG381 v1.11 and applies directly to the XC6SLX25-2FTG256I's Bank 1 and Bank 2 I/O banks configured for SSTL15.
Does XC6SLX25-2FTG256I support JTAG boundary-scan testing?
Yes, XC6SLX25-2FTG256I fully complies with IEEE 1149.1 (JTAG) standard. Its TDI, TDO, TMS, TCK, and TCK pins are dedicated and electrically characterized for boundary-scan operation across the full industrial temperature range, enabling PCB-level interconnect verification and in-system programming.
What configuration modes are supported by XC6SLX25-2FTG256I?
XC6SLX25-2FTG256I supports Master Serial (via SPI flash), Slave Serial (processor-driven), and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-up, and all three methods are documented in Xilinx UG380 v1.12 with timing requirements validated for the XC6SLX25-2FTG256I speed grade.
Is XC6SLX25-2FTG256I RoHS compliant and lead-free?
Yes, XC6SLX25-2FTG256I is RoHS compliant and manufactured with lead-free (Pb-free) terminations. The FTG256 package meets JEDEC J-STD-020C moisture sensitivity level 3 and is qualified for Pb-free reflow soldering profiles up to 260°C peak temperature.
Can XC6SLX25-2FTG256I operate at 100°C junction temperature?
Yes, XC6SLX25-2FTG256I is rated for industrial temperature range (–40°C to +100°C ambient), and its thermal characteristics-verified in Xilinx AR54133-support sustained operation at 100°C ambient when mounted on a 4-layer PCB with defined copper pour and airflow ≥200 LFM, with junction temperature remaining within safe limits.
XC6SLX25-2FTG256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1879
- Number of Logic Elements/Cells:
- 24051
- Total RAM Bits:
- 958464
- Number of I/O:
- 186
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC6SLX25-2FTG256I FAQ
1.How can I place an order for XC6SLX25-2FTG256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX25-2FTG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX25-2FTG256I reliable?
The price and inventory of XC6SLX25-2FTG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX25-2FTG256I is usually 5 days.
3.What payment methods are accepted for XC6SLX25-2FTG256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX25-2FTG256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX25-2FTG256I?
XC6SLX25-2FTG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX25-2FTG256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX25-2FTG256I?
For technical support, including XC6SLX25-2FTG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX25-2FTG256I requirements.
6.How does Aetrix verify that XC6SLX25-2FTG256I is sourced from the original manufacturer or authorized distributors?
All XC6SLX25-2FTG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX25-2FTG256I meets industry standards.
7.What is the process for return or replacement of XC6SLX25-2FTG256I?
All XC6SLX25-2FTG256I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX25-2FTG256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX25-2FTG256I part is unused and in its original packaging.
Return procedure for XC6SLX25-2FTG256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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