AMD XC6SLX25-3CSG324C

Overview

XC6SLX25-3CSG324C from AMD (formerly Xilinx) is a Spartan-6 FPGA with 24,051 logic cells, 1.8 V core voltage, -3 speed grade, and 324-pin CSG package. It integrates 92 DSP48A1 slices, 1,728 Kbits of block RAM, and supports LVDS, SSTL, and HSTL I/O standards. It is used in industrial control logic and real-time video interface bridging.

For engineers reviewing the XC6SLX25-3CSG324C datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O bank voltage flexibility, embedded memory depth, and supported transceiver protocols for legacy SerDes interfaces.

Technical Context

The XC6SLX25-3CSG324C implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It includes dual-port block RAM blocks up to 18 Kbits each and distributed RAM using LUTs.

It supports SelectIO™ technology with programmable drive strength, slew rate, and on-chip termination across 12 I/O banks. Configuration is performed via Master SPI, Slave Serial, or JTAG modes using external PROM or processor-controlled loading.

Key Specifications

Pinout & Package

XC6SLX25-3CSG324C uses a 324-ball fine-pitch CSPBGA (CSG) package with 1.0 mm pitch, 15 × 15 mm body size, and thermal pad on underside. Pin assignment follows Xilinx DS162 revision 3.0.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA logic and interface bridging applications.

Compared with XC6SLX25-3CSG324C, XC6SLX45-3CSG324C offers scalable logic headroom within identical mechanical constraints, while XC7S25-2CSGA225C trades PCIe hardware integration for reduced area and quiescent current - both require distinct pinout validation and timing re-analysis.

Availability

XC6SLX25-3CSG324C is available at Aetrix Electronics and suitable for industrial motion control, video signal conversion, and automotive ADAS interface applications requiring stable component supply across extended product lifecycles.

Supply support for XC6SLX25-3CSG324C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of the Spartan-6 FPGA family. Xilinx pioneered programmable logic architecture and system-on-chip integration for embedded applications.

The Spartan-6 family targets cost-sensitive, high-volume applications requiring balanced logic density, I/O flexibility, and low-power operation - especially in industrial automation, video infrastructure, and communications edge devices.

FAQ

What is the maximum supported I/O standard voltage for XC6SLX25-3CSG324C?

XC6SLX25-3CSG324C supports I/O voltages from 1.2 V to 3.3 V across its 12 configurable I/O banks. Each bank operates independently, allowing mixed-voltage interfaces such as 3.3 V GPIO alongside 1.8 V DDR2 address/control lines. The VCCO supply per bank must match the selected I/O standard's required voltage, and all banks share a common VCCAUX of 1.8 V.

Does XC6SLX25-3CSG324C include built-in configuration memory?

No, XC6SLX25-3CSG324C does not include on-chip nonvolatile configuration memory. It requires external configuration storage such as SPI flash (e.g., XCFxxP series) or microcontroller-driven loading via JTAG or SelectMAP. Configuration occurs at power-up or upon assertion of PROGRAM_B, and the bitstream is loaded into volatile SRAM-based CLBs and routing resources.

Can XC6SLX25-3CSG324C implement a PCI Express Gen1 x1 endpoint without external components?

Yes, XC6SLX25-3CSG324C contains a hard PCIe Gen1 x1 endpoint block compliant with PCI Express Base Specification 1.1. It handles link training, transaction layer packet (TLP) generation, and data link layer ACK/NAK without external PHY or bridge IC. However, external AC-coupling capacitors and reference clock conditioning remain mandatory per PCIe electrical specifications.

What is the minimum operating temperature range for XC6SLX25-3CSG324C?

XC6SLX25-3CSG324C is rated for commercial temperature range: 0 °C to +85 °C ambient. This applies to the C-grade variant indicated by the final 'C' in the part number. Industrial-grade variants (I-grade) exist under different suffixes (e.g., XC6SLX25-3CSG324I) with –40 °C to +100 °C rating, but XC6SLX25-3CSG324C itself is not qualified for extended temperature operation.

How many clock management tiles does XC6SLX25-3CSG324C contain?

XC6SLX25-3CSG324C contains four Digital Clock Managers (DCMs), each capable of frequency synthesis, phase shifting, duty cycle correction, and jitter filtering. These DCMs support input frequencies from 1.5 MHz to 320 MHz and generate up to eight output clocks per DCM. They are essential for synchronizing disparate interfaces like HDMI pixel clocks and LVDS source-synchronous data capture.