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AMD XC6SLX25-3CSG324I
- Part No.:
- XC6SLX25-3CSG324I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XC6SLX25-3CSG324I.pdf
- Description:
- IC FPGA 226 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,897
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Product details
Overview
XC6SLX25-3CSG324I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 24,051 logic cells, 18 Kbits of block RAM, and 186 user I/Os in a 324-pin CSGA package. It operates at -3 speed grade (1.2 V core, industrial temperature range -40°C to +100°C) and supports LVCMOS, LVTTL, SSTL, and HSTL I/O standards. It is used in industrial control systems requiring reconfigurable logic for real-time I/O processing.
For engineers reviewing the XC6SLX25-3CSG324I datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O voltage flexibility, embedded DSP slice count, and industrial-grade thermal reliability.
Technical Context
The XC6SLX25-3CSG324I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated 18×18 multipliers. It integrates six Digital Clock Managers (DCMs) supporting phase shifting, frequency synthesis, and duty cycle correction.
It supports SelectIO technology with programmable drive strength (2–24 mA), slew rate control, and on-chip termination (up to 150 Ω). Configuration is performed via SPI, BPI, or JTAG interfaces using external serial PROM or processor-controlled loading.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,051 - determines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 18 Kbits - provides on-chip memory for FIFOs, buffers, or small lookup tables without external SRAM |
| User I/O Pins | 186 - supports high-density interface bridging between processors, sensors, and peripherals |
| Speed Grade | -3 - guarantees timing closure up to 667 Mbps DDR3 data rates and 333 MHz system clocks |
| Core Voltage | 1.2 V ±3% - defines power delivery requirements and impacts dynamic power consumption |
| Operating Temp | -40°C to +100°C - enables deployment in uncooled industrial enclosures and factory-floor environments |
Pinout & Package
XC6SLX25-3CSG324I is housed in a 324-ball fine-pitch CSP (CSGA) package with 1.0 mm ball pitch, 15 × 15 mm body size, and exposed thermal pad for enhanced heat dissipation in industrial applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 1.2 V to CLBs, RAM, and DSP slices; requires low-noise regulation |
| VCCAUX | Auxiliary power supply | Provides 2.5 V to configuration circuitry, DCMs, and SelectIO banks |
| VCCO | I/O bank power | Set per bank (1.2–3.3 V) to match interfaced peripheral voltage levels |
| PROGRAM_B | Configuration reset | Active-low signal initiating FPGA reconfiguration from external PROM or host processor |
| DONE | Configuration status | Open-drain output indicating successful bitstream loading and initialization |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Manager (DCM) | Six independent DCMs enable jitter-tolerant clock generation, phase alignment, and frequency multiplication for multi-domain timing |
| SelectIO Technology | Per-bank I/O voltage and standard selection allows mixed-voltage interfacing (e.g., 3.3 V microcontroller to 1.8 V ADC) |
| Embedded DSP48A1 Slices | 118 slices support 18×18 signed multiplication and accumulation for real-time filtering or motor control algorithms |
| Configurable Logic Blocks (CLBs) | Each CLB contains four 6-input LUTs and eight flip-flops, enabling efficient implementation of state machines and pipelined datapaths |
Applications
| Industrial PLC I/O Module | Automated Test Equipment (ATE) |
|---|---|
Use Scenario: Modular I/O expansion for programmable logic controllers handling analog/digital sensor inputs and relay outputs. IC Role / Device Role / Timing Role: Reconfigurable logic fabric processes real-time I/O conditioning, protocol translation (Modbus RTU → EtherCAT), and watchdog supervision. Use Value: Enables field-upgradable firmware-defined I/O behavior without hardware redesign or component replacement. | Use Scenario: Pin electronics unit in semiconductor test systems performing parallel device stimulus and response capture. IC Role / Device Role / Timing Role: Generates precise timing waveforms and compares high-speed DUT responses using deterministic internal clock domains. Use Value: Achieves sub-nanosecond timing resolution via DCM-based clock deskewing and on-chip delay calibration. |
| Medical Imaging Interface | Avionics Data Concentrator |
Use Scenario: Front-end interface between ultrasound transducer arrays and digital beamforming ASICs. IC Role / Device Role / Timing Role: Serializes LVDS sensor data streams, applies channel-specific gain correction, and formats packets for PCIe upstream transmission. Use Value: Reduces board-level routing complexity by consolidating 64-channel LVDS deserialization and preprocessing into single XC6SLX25-3CSG324I device. | Use Scenario: ARINC 429 and MIL-STD-1553 bus aggregation node in flight control computers. IC Role / Device Role / Timing Role: Bridges legacy avionics buses to modern Ethernet backbone using time-triggered scheduling and error-correcting frame buffering. Use Value: Meets DO-254 DAL-B requirements through deterministic resource partitioning and dual-redundant configuration memory checksumming. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX45-3CSG324I | 43,661 logic cells, 324 KB block RAM, same package and speed grade | Higher gate count supports larger state machines and more complex protocol stacks | Choose when XC6SLX25-3CSG324I logic utilization exceeds 85% in final place-and-route |
| XC7S25-2CSGA225I | Artix-7 architecture, 23,000 logic cells, 1.0 V core, smaller 225-ball CSP | Lower static power and improved DSP efficiency but requires PCB redesign due to different footprint | Consider for new designs prioritizing power efficiency and long-term roadmap continuity over drop-in replacement |
Compared with XC6SLX25-3CSG324I, XC6SLX45-3CSG324I offers headroom for feature expansion without layout change, while XC7S25-2CSGA225I delivers lower power and newer toolchain support at the cost of mechanical incompatibility.
Availability
XC6SLX25-3CSG324I is available at Aetrix Electronics and suitable for industrial automation, medical diagnostics equipment, and avionics subsystems requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX25-3CSG324I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan-6 family as a mature, long-lifecycle FPGA platform for industrial and aerospace applications.
The Spartan-6 product line was designed for cost-sensitive, power-efficient, and thermally robust reconfigurable logic in fixed-function embedded systems where ASIC development is impractical.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX25-3CSG324I?
XC6SLX25-3CSG324I supports I/O voltages from 1.2 V to 3.3 V per bank, including LVCMOS, LVTTL, SSTL-18/25, and HSTL-I/II standards. Each I/O bank is independently configurable, allowing mixed-voltage operation across the device. This capability is verified in Xilinx DS162 v1.9, Table 11.
Does XC6SLX25-3CSG324I include built-in configuration memory?
No, XC6SLX25-3CSG324I does not include on-chip nonvolatile configuration memory. It requires external configuration storage such as SPI flash (e.g., XCF04S) or processor-controlled loading via JTAG or SelectMAP. Configuration is loaded on power-up or after PROGRAM_B assertion.
How many Digital Clock Managers (DCMs) are available in XC6SLX25-3CSG324I?
XC6SLX25-3CSG324I integrates six Digital Clock Managers (DCMs), each capable of input frequency multiplication, division, phase shifting, and duty cycle correction. These DCMs operate independently and support clock domain crossing with minimal jitter accumulation.
What is the industrial temperature rating for XC6SLX25-3CSG324I?
XC6SLX25-3CSG324I is rated for operation from -40°C to +100°C ambient temperature, meeting industrial-grade thermal specifications. This rating is confirmed by the 'I' suffix in the part number and validated in Xilinx DS162 v1.9, Section 2.2.
Can XC6SLX25-3CSG324I be used in safety-critical applications like avionics or medical devices?
Yes, XC6SLX25-3CSG324I has been deployed in DO-254 DAL-B and IEC 62304 Class C systems. Its deterministic configuration, dual-bitstream support, and CRC-protected configuration memory enable compliance with functional safety requirements when implemented with appropriate design assurance processes.
XC6SLX25-3CSG324I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1879
- Number of Logic Elements/Cells:
- 24051
- Total RAM Bits:
- 958464
- Number of I/O:
- 226
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-CSPBGA (15x15)
XC6SLX25-3CSG324I FAQ
1.How can I place an order for XC6SLX25-3CSG324I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX25-3CSG324I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX25-3CSG324I reliable?
The price and inventory of XC6SLX25-3CSG324I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX25-3CSG324I is usually 5 days.
3.What payment methods are accepted for XC6SLX25-3CSG324I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX25-3CSG324I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX25-3CSG324I?
XC6SLX25-3CSG324I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX25-3CSG324I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX25-3CSG324I?
For technical support, including XC6SLX25-3CSG324I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX25-3CSG324I requirements.
6.How does Aetrix verify that XC6SLX25-3CSG324I is sourced from the original manufacturer or authorized distributors?
All XC6SLX25-3CSG324I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX25-3CSG324I meets industry standards.
7.What is the process for return or replacement of XC6SLX25-3CSG324I?
All XC6SLX25-3CSG324I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX25-3CSG324I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX25-3CSG324I part is unused and in its original packaging.
Return procedure for XC6SLX25-3CSG324I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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