Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

AMD XC6SLX25-3FG484C

Part No.:
XC6SLX25-3FG484C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
484-BBGA
Datasheet:
AetrixXC6SLX25-3FG484C.pdf
Description:
IC FPGA 266 I/O 484FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,965

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

XC6SLX25-3FG484C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 24,051 logic cells, 18 Kbits of block RAM, and 186 user I/Os in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -3 speed grade (fastest in Spartan-6 family) with 1.2 V core voltage and supports LVCMOS, LVTTL, SSTL, and differential signaling standards.

For engineers reviewing the XC6SLX25-3FG484C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, speed grade timing closure, embedded memory depth, transceiver absence, and industrial temperature range suitability.

Technical Context

The XC6SLX25-3FG484C implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated DSP48A1 slices for arithmetic operations and CMT clock management tiles supporting PLLs and DCMs. It lacks integrated transceivers, limiting high-speed serial interface use.

Configuration is performed via Master SPI, Slave Serial, or JTAG modes using external PROM or processor-controlled loading. The device supports partial reconfiguration and includes internal configuration monitoring with CRC checking.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells24,051 - determines maximum combinational/sequential logic capacity for custom digital functions
Block RAM18 Kbits - provides on-chip memory for FIFOs, buffers, or small lookup tables without external memory
User I/Os186 - supports parallel interfaces, GPIO expansion, and multi-standard signal routing
Speed Grade-3 - guarantees worst-case timing performance at highest operating frequency in Spartan-6 family
Core Voltage1.2 V - defines power delivery network requirements and impacts dynamic/static power consumption
Operating Temp0°C to +85°C - qualifies for commercial and industrial ambient environments
Package484-pin FBGA (23×23 mm, 1.0 mm pitch) - dictates PCB layout density and thermal dissipation capability

Pinout & Package

XC6SLX25-3FG484C is housed in a 484-ball fine-pitch BGA (FG484) package with 23×23 array, 1.0 mm ball pitch, and standard I/O ballout including dedicated configuration, clock, and JTAG pins.

Pin/TerminalCircuit RoleDesign Meaning
G1CONFIG_DONEOpen-drain output indicating successful configuration completion
H2INIT_BActive-low open-drain status signal reflecting configuration memory readiness
K1PROGRAM_BActive-low input initiating configuration reset and clearing configuration memory
M2TCKJTAG test clock input for boundary-scan and debug access
N1TMSJTAG test mode select controlling state machine transitions
P1TDOJTAG test data output carrying scan-out results
R1TDIJTAG test data input shifting instructions and data into device
U1CCLKConfiguration clock output driving external PROM or master SPI clock

Key Features

FeatureDesign Value
Dedicated DSP48A1 Slices64 slices enable efficient multiply-accumulate and filtering operations without LUT resource overhead
Clock Management Tiles (CMT)Two CMTs each containing DCM and PLL support jitter reduction, frequency synthesis, and phase alignment
Embedded Memory Blocks18 Kbits of distributed and block RAM allow local data storage with single-cycle access latency
Multi-Standard I/O SupportSupports LVCMOS, LVTTL, SSTL, HSTL, and differential standards enabling direct interfacing with diverse peripherals
Partial ReconfigurationEnables dynamic logic module swapping during operation to reduce gate count and increase functional density

Applications

Industrial Control InterfaceVideo Frame Buffering

Use Scenario: Real-time PLC I/O expansion with deterministic timing and fieldbus protocol bridging.

IC Role / Device Role / Timing Role: Configurable logic controller implementing custom state machines and parallel bus arbitration.

Use Value: 186 user I/Os and -3 speed grade ensure tight cycle timing for servo control loops and sensor sampling.

Use Scenario: SD/HD video capture system buffering frames between image sensor and host processor.

IC Role / Device Role / Timing Role: Synchronous memory controller managing dual-port block RAM as frame buffer.

Use Value: 18 Kbits of on-chip block RAM eliminates need for external SRAM, reducing board area and power.

Communications Protocol GatewayTest Equipment Logic Analyzer Core

Use Scenario: Bridging Modbus RTU over RS-485 to Ethernet TCP/IP in edge gateway devices.

IC Role / Device Role / Timing Role: Protocol translation engine with UART, SPI, and MAC interface logic.

Use Value: Multi-standard I/O supports both RS-485 differential signaling and 3.3 V Ethernet PHY interface levels.

Use Scenario: Portable logic analyzer capturing parallel bus signals at up to 100 MHz.

IC Role / Device Role / Timing Role: High-speed acquisition controller with deep sample memory and trigger logic.

Use Value: -3 speed grade enables reliable 100 MHz sampling clock generation and synchronous capture logic.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC6SLX16-3CPG196CFewer logic cells (14,579), smaller 196-pin CSBGA package, lower I/O count (102)Suitable for space-constrained designs with reduced logic density requirementsSelect when board area and cost are prioritized over I/O count and logic capacity
XC6SLX45-3FGG484CHigher logic density (43,661 cells), same FG484 package, identical speed grade and temperature rangeRequired for larger state machines, more complex protocols, or expanded peripheral integrationChoose when XC6SLX25-3FG484C resources are insufficient but same footprint and timing behavior are needed

Compared with XC6SLX25-3FG484C, XC6SLX16-3CPG196C trades logic and I/O for compactness and lower cost, while XC6SLX45-3FGG484C extends capacity within identical mechanical and timing constraints-enabling scalable design reuse.

Availability

XC6SLX25-3FG484C is available at Aetrix Electronics and suitable for industrial control interface, video frame buffering, communications protocol gateway, and test equipment logic analyzer core applications requiring stable component supply and long-term production support.

Supply support for XC6SLX25-3FG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops and markets adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines.

The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring low-power logic implementation, embedded processing, and flexible I/O interfacing-targeting industrial, automotive, and consumer systems.

FAQ

What is the maximum operating frequency supported by XC6SLX25-3FG484C?

The XC6SLX25-3FG484C is rated at speed grade -3, the highest in the Spartan-6 family, guaranteeing timing closure up to 667 MHz for internal logic paths under specified conditions. Actual achievable frequency depends on design complexity, placement, and routing. The XC6SLX25-3FG484C datasheet specifies setup/hold times and clock-to-out delays that define real-world limits for synchronous logic blocks.

Does XC6SLX25-3FG484C include built-in transceivers for high-speed serial communication?

No, the XC6SLX25-3FG484C does not integrate high-speed serial transceivers. It relies on programmable I/O banks supporting LVDS, TMDS, and other differential standards for moderate-speed serial links. For PCIe, SATA, or Gigabit Ethernet physical layer support, external PHY devices or higher-tier Spartan-6 variants with GTP transceivers must be used instead of the XC6SLX25-3FG484C.

What configuration methods are supported by XC6SLX25-3FG484C?

The XC6SLX25-3FG484C supports Master SPI, Slave Serial, JTAG, and Boundary Scan configuration modes. External SPI flash is commonly used for autonomous startup, while JTAG enables programming and debugging during development. The XC6SLX25-3FG484C also allows processor-controlled configuration via its SelectMAP interface for dynamic reconfiguration scenarios.

Can XC6SLX25-3FG484C operate in extended temperature ranges?

The XC6SLX25-3FG484C is specified for 0°C to +85°C operation (Commercial/Industrial grade). It is not qualified for extended temperature ranges such as -40°C to +100°C. For harsh-environment applications, designers must select the XC6SLX25-3FG484I variant (industrial grade) or consider alternative families like Artix-7 with extended temp options-not the XC6SLX25-3FG484C.

How many clock management resources does XC6SLX25-3FG484C provide?

The XC6SLX25-3FG484C integrates two Clock Management Tiles (CMTs), each containing one Digital Clock Manager (DCM) and one Phase-Locked Loop (PLL). These support clock multiplication, division, phase shifting, and duty cycle correction. This architecture enables precise clock domain crossing and jitter reduction across multiple synchronous subsystems in the XC6SLX25-3FG484C design.

XC6SLX25-3FG484C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-6 LX
Package/Case:
484-BBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
1879
Number of Logic Elements/Cells:
24051
Total RAM Bits:
958464
Number of I/O:
266
Number of Gates:
-
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
484-FBGA (23x23)

XC6SLX25-3FG484C FAQ

1.How can I place an order for XC6SLX25-3FG484C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC6SLX25-3FG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC6SLX25-3FG484C reliable?

The price and inventory of XC6SLX25-3FG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX25-3FG484C is usually 5 days.

3.What payment methods are accepted for XC6SLX25-3FG484C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX25-3FG484C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC6SLX25-3FG484C?

XC6SLX25-3FG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC6SLX25-3FG484C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC6SLX25-3FG484C?

For technical support, including XC6SLX25-3FG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX25-3FG484C requirements.

6.How does Aetrix verify that XC6SLX25-3FG484C is sourced from the original manufacturer or authorized distributors?

All XC6SLX25-3FG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX25-3FG484C meets industry standards.

7.What is the process for return or replacement of XC6SLX25-3FG484C?

All XC6SLX25-3FG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX25-3FG484C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC6SLX25-3FG484C part is unused and in its original packaging.

Return procedure for XC6SLX25-3FG484C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC6SLX25-3FG484C Tags

  • XC6SLX25-3FG484C
  • XC6SLX25-3FG484C PDF
  • XC6SLX25-3FG484C Datasheet
  • XC6SLX25-3FG484C Specifications
  • XC6SLX25-3FG484C Images
  • AMD
  • AMD XC6SLX25-3FG484C
  • Buy XC6SLX25-3FG484C
  • XC6SLX25-3FG484C Price
  • XC6SLX25-3FG484C Distributor
  • XC6SLX25-3FG484C Supplier
  • XC6SLX25-3FG484C Wholesale
Related Products
ICE40LP384-SG32
ICE40LP384-SG32

Lattice Semiconductor Corporation

ICE40UL640-CM36AI
ICE40UL640-CM36AI

Lattice Semiconductor Corporation

ICE40UL1K-CM36AI
ICE40UL1K-CM36AI

Lattice Semiconductor Corporation

LCMXO2-256HC-4SG32C
LCMXO2-256HC-4SG32C

Lattice Semiconductor Corporation

10M02DCV36C8G
10M02DCV36C8G

Intel

LCMXO2-256HC-4SG32I
LCMXO2-256HC-4SG32I

Lattice Semiconductor Corporation

ICE5LP1K-SG48ITR
ICE5LP1K-SG48ITR

Lattice Semiconductor Corporation

ICE40LP1K-CM36
ICE40LP1K-CM36

Lattice Semiconductor Corporation

LCMXO2-256ZE-1SG32I
LCMXO2-256ZE-1SG32I

Lattice Semiconductor Corporation

LCMXO2-256HC-4SG48I
LCMXO2-256HC-4SG48I

Lattice Semiconductor Corporation

ICE40LP1K-CM81
ICE40LP1K-CM81

Lattice Semiconductor Corporation

T20W80I4
T20W80I4

Efinix, Inc.

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER