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AMD XC6SLX25-3FG484I
- Part No.:
- XC6SLX25-3FG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX25-3FG484I.pdf
- Description:
- IC FPGA 266 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,895
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Product details
Overview
XC6SLX25-3FG484I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 24,051 logic cells, 18 Kbits of block RAM, and 186 user I/Os in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -3 speed grade with industrial temperature range (-40°C to +100°C) and supports LVCMOS, LVTTL, SSTL, and differential signaling standards.
For engineers reviewing the XC6SLX25-3FG484I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O voltage flexibility, embedded memory capacity, and industrial-grade thermal performance for reconfigurable control and interface bridging.
Technical Context
The XC6SLX25-3FG484I implements a hierarchical FPGA architecture with six-input LUTs, dedicated carry logic, and integrated DSP48A1 slices supporting 18×18-bit multiply-accumulate operations. It includes dual-clock domain support and configurable I/O banks with independent VCCO per bank.
Configuration is performed via Master SPI, Slave Serial, or JTAG modes using external configuration PROM or processor-controlled loading. Built-in clock management uses DCMs (Digital Clock Managers) - not PLLs - providing frequency synthesis, phase shifting, and duty-cycle correction across up to eight output clocks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,051 - determines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 18 Kbits - enables on-chip data buffering, FIFOs, and small lookup tables without external memory |
| User I/Os | 186 - supports multi-protocol interface bridging with per-bank voltage selectability (1.2V–3.3V) |
| Speed Grade | -3 - guarantees timing closure at highest operating frequencies for this device family |
| Operating Temp | -40°C to +100°C - qualified for industrial environments without derating |
| Package | 484-pin FBGA (23×23 mm, 1.0 mm pitch) - enables high-density PCB routing with thermal pad for power dissipation |
Pinout & Package
XC6SLX25-3FG484I is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with exposed thermal pad. Pin functions are organized into 12 I/O banks, each supporting independent VCCO and selectable I/O standards including LVCMOS, LVTTL, SSTL, HSTL, and differential pairs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | CONFIG_DONE | Open-drain status signal indicating successful configuration completion |
| D2 | PROGRAM_B | Active-low input that resets configuration logic and clears internal SRAM |
| A1 | INIT_B | Open-drain output reflecting configuration controller readiness state |
| H17 | CLKIN_2N / CLKIN_2P | Differential clock input pair for second DCM, supporting low-jitter reference injection |
| M19 | VCCO_0 | Output bank 0 supply voltage - sets I/O voltage level for pins in Bank 0 |
| T14 | GND | Signal ground reference for adjacent I/O and internal logic domains |
Key Features
| Feature | Design Value |
|---|---|
| DCM-based clock management | Enables precise clock synthesis, phase alignment, and jitter reduction without external PLL components |
| Multi-standard I/O banks | Allows mixed-voltage interface design (e.g., 3.3V PCIe side + 1.8V memory side) on single device |
| Embedded DSP48A1 slices | Performs 18×18-bit signed multiplication with 48-bit accumulation in single cycle for filtering/control loops |
| Configurable SelectIO™ technology | Supports source-synchronous interfaces like DDR2 SDRAM with programmable input delay and output drive strength |
| ISE Design Suite support | Full toolchain compatibility with synthesis, place-and-route, and bitstream generation for legacy industrial designs |
Applications
| Industrial Motor Control | Automotive ADAS Interface |
|---|---|
Use Scenario: Real-time PWM generation and encoder feedback processing in servo drives. IC Role / Device Role / Timing Role: Configurable logic fabric executing closed-loop control algorithms with sub-microsecond latency. Use Value: Eliminates need for discrete gate arrays and microcontroller co-processing by integrating motion control IP cores directly into XC6SLX25-3FG484I fabric. | Use Scenario: Bridging camera sensor MIPI CSI-2 output to FPGA-based image preprocessing pipeline. IC Role / Device Role / Timing Role: Protocol translator and clock domain crossing engine between asynchronous sensor and system clock domains. Use Value: XC6SLX25-3FG484I's SelectIO™ and DCMs enable reliable capture of 1.5 Gbps MIPI lanes without external deserializers. |
| Medical Imaging Data Acquisition | Test & Measurement Equipment |
Use Scenario: High-speed ADC interface and real-time waveform buffering in portable ultrasound systems. IC Role / Device Role / Timing Role: Synchronized data capture engine with on-chip FIFO management and trigger logic. Use Value: 18 Kbits of block RAM provides sufficient depth for 12-bit, 40 MSPS sampling streams before host transfer, reducing DRAM dependency. | Use Scenario: Digital pattern generation and response analysis in automated test equipment (ATE). IC Role / Device Role / Timing Role: Reconfigurable vector generator with deterministic timing control down to 5 ns resolution. Use Value: XC6SLX25-3FG484I's -3 speed grade ensures setup/hold timing margins for 200 MHz pattern rates across industrial temperature range. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX16-3CPG196I | Fewer logic cells (14,579), smaller 196-pin CSBGA package, lower I/O count (102) | Suitable for space-constrained, lower-complexity control tasks where full XC6SLX25-3FG484I resources are unused | Select when board area and cost are prioritized over future scalability and I/O flexibility |
| XC6SLX45-3FG484I | Higher logic density (43,661 cells), same package and speed grade, identical pinout | Enables larger state machines, more parallel interfaces, or additional soft-core processors without layout change | Choose for designs anticipating feature expansion or requiring higher gate count while retaining footprint compatibility |
Compared with XC6SLX16-3CPG196I, XC6SLX25-3FG484I delivers 65% more logic and 82% more I/O in the same package footprint; versus XC6SLX45-3FG484I, it offers cost and power savings where full 45K-cell capacity is unnecessary.
Availability
XC6SLX25-3FG484I is available at Aetrix Electronics and suitable for industrial motor control, medical imaging data acquisition, and test & measurement equipment requiring stable component supply across extended lifecycle planning.
Supply support for XC6SLX25-3FG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan-6 FPGA family for industrial and aerospace applications.
The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring low-power reconfigurable logic, embedded memory, and flexible I/O - especially where long-term availability and industrial temperature operation are critical.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX25-3FG484I?
XC6SLX25-3FG484I supports I/O voltages from 1.2 V to 3.3 V across its 12 configurable I/O banks. Each bank has independent VCCO supply, enabling simultaneous operation with multiple interface standards such as 1.8 V LVCMOS for memory and 3.3 V LVTTL for legacy peripherals - all within a single XC6SLX25-3FG484I device.
Does XC6SLX25-3FG484I include on-chip clock generation capability?
Yes, XC6SLX25-3FG484I integrates two Digital Clock Managers (DCMs), not PLLs. Each DCM provides frequency synthesis, phase shifting, and duty-cycle correction for up to eight output clocks. These are used for internal logic timing, I/O interface synchronization, and clock domain crossing - eliminating need for external clock ICs in many XC6SLX25-3FG484I-based designs.
Can XC6SLX25-3FG484I be configured via JTAG only?
No, XC6SLX25-3FG484I supports three primary configuration modes: JTAG, Master SPI (using external serial PROM), and Slave Serial (controlled by external processor). JTAG is typically used for debugging and programming during development, while SPI mode enables autonomous boot at power-up - a common requirement in deployed XC6SLX25-3FG484I systems.
What is the industrial temperature rating of XC6SLX25-3FG484I?
XC6SLX25-3FG484I is rated for operation from -40°C to +100°C ambient temperature, meeting industrial-grade qualification requirements. This rating applies across all speed grades and I/O configurations, and no derating is required within this range - making XC6SLX25-3FG484I suitable for harsh-environment applications like factory automation and outdoor instrumentation.
Is XC6SLX25-3FG484I pin-compatible with other Spartan-6 devices in the FG484 package?
XC6SLX25-3FG484I shares the same 484-pin FBGA footprint with XC6SLX45-3FG484I and XC6SLX75-3FG484I, but pin functions are not fully interchangeable due to differing I/O bank allocations and internal resource mapping. While mechanical mounting is identical, schematic and PCB layout must be verified per specific device - XC6SLX25-3FG484I cannot be substituted without design review.
XC6SLX25-3FG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1879
- Number of Logic Elements/Cells:
- 24051
- Total RAM Bits:
- 958464
- Number of I/O:
- 266
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX25-3FG484I FAQ
1.How can I place an order for XC6SLX25-3FG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX25-3FG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX25-3FG484I reliable?
The price and inventory of XC6SLX25-3FG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX25-3FG484I is usually 5 days.
3.What payment methods are accepted for XC6SLX25-3FG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX25-3FG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX25-3FG484I?
XC6SLX25-3FG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX25-3FG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX25-3FG484I?
For technical support, including XC6SLX25-3FG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX25-3FG484I requirements.
6.How does Aetrix verify that XC6SLX25-3FG484I is sourced from the original manufacturer or authorized distributors?
All XC6SLX25-3FG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX25-3FG484I meets industry standards.
7.What is the process for return or replacement of XC6SLX25-3FG484I?
All XC6SLX25-3FG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX25-3FG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX25-3FG484I part is unused and in its original packaging.
Return procedure for XC6SLX25-3FG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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