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AMD XC6SLX25-3FT256C

Part No.:
XC6SLX25-3FT256C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
256-LBGA
Datasheet:
AetrixXC6SLX25-3FT256C.pdf
Description:
IC FPGA 186 I/O 256FTBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,751

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Product details

Overview

XC6SLX25-3FT256C from AMD (formerly Xilinx) is a Spartan-6 FPGA with 24,051 logic cells, 18 Kbits of block RAM, and 186 user I/Os in a 256-pin FTBGA package. It operates at -3 speed grade (1.2 V core, industrial temperature range) and supports LVCMOS/LVDS interfaces for embedded control and digital signal processing.

For engineers reviewing the XC6SLX25-3FT256C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count, speed grade timing closure, and compatibility with Spartan-6 design toolchains and reference clocking schemes.

Technical Context

The XC6SLX25-3FT256C implements a hierarchical FPGA architecture with six-input LUTs, distributed RAM, and dedicated DSP48A1 slices supporting 18×18-bit multiply-accumulate operations. It integrates dual-clock DDR memory controllers and supports configuration via SPI, BPI, or JTAG.

It features SelectIO technology with programmable drive strength, slew rate, and on-chip termination for 1.2–3.3 V I/O standards. The device includes internal clock management using DCMs (Digital Clock Managers) with phase shifting and frequency synthesis capabilities.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells24,051 - determines maximum combinational/sequential logic capacity for RTL implementation
Block RAM18 Kbits - supports on-chip data buffering, FIFOs, and small lookup tables without external memory
User I/O Pins186 - enables direct interface to multiple peripherals including ADCs, displays, and sensors
Speed Grade-3 - guarantees timing closure up to 500 MHz system clock in worst-case industrial conditions
Core Voltage1.2 V ±3% - defines power delivery requirements and impacts dynamic power consumption
Package256-pin FTBGA (17×17 mm, 1.0 mm pitch) - specifies PCB footprint and thermal dissipation profile

Pinout & Package

XC6SLX25-3FT256C is housed in a 256-ball Fine-Pitch Thin BGA (FTBGA) package with 17×17 array, 1.0 mm ball pitch, and exposed thermal pad. Pin functions are defined per UG382 v1.11 (Spartan-6 FPGA Packaging and Pinout Specifications).

Pin/TerminalCircuit RoleDesign Meaning
G1VCCO_0I/O bank 0 supply - sets voltage level for associated LVCMOS/LVDS signals
K1GCLK1Global clock input - routes low-skew clock to all clock regions
P2M0Configuration mode select - determines boot source (SPI/BPI/JTAG)
T3INIT_BOpen-drain status output - indicates configuration completion or error
R1CCLKConfiguration clock - controls synchronous loading of bitstream from external PROM

Key Features

FeatureDesign Value
Dedicated DSP48A1 Slices12 units - enable fixed-point MAC operations at 250+ MHz for filtering and modulation
SelectIO TechnologySupports 19 I/O standards - allows mixed-voltage interfacing without level shifters
Digital Clock Manager (DCM)2 DCMs per device - provide jitter-reduced clock synthesis, phase alignment, and duty cycle correction
Configuration SecurityBitstream encryption option - prevents reverse engineering of programmed logic functionality
Low-Power Architecture1.2 V core + dynamic power gating - reduces active power by ~40% vs. Spartan-3E at comparable density

Applications

Industrial PLC ControlVideo Interface Bridge

Use Scenario: Real-time motion control and I/O expansion in modular automation systems.

IC Role / Device Role / Timing Role: FPGA fabric executes deterministic ladder logic and manages high-speed encoder feedback timing.

Use Value: 186 user I/Os support parallel fieldbus interface plus local sensor/actuator control without glue logic.

Use Scenario: Converting HDMI 1.3a video streams to LVDS for embedded display panels.

IC Role / Device Role / Timing Role: Implements pixel clock domain crossing, color space conversion, and serialization using IOBs and OSERDES.

Use Value: Built-in DCMs stabilize pixel clock recovery; SelectIO supports both 3.3 V HDMI receiver and 2.5 V LVDS transmitter levels.

Medical Imaging Front-EndTest & Measurement Data Acquisition

Use Scenario: Time-of-flight signal processing and analog front-end digitization in portable ultrasound devices.

IC Role / Device Role / Timing Role: Synchronizes multi-channel ADC sampling, applies FIR filtering in DSP48A1 slices, and buffers data in block RAM.

Use Value: 18 Kbits block RAM enables real-time ping-pong buffering of 12-bit, 40 MSPS samples across 8 channels.

Use Scenario: High-precision waveform capture and protocol analysis in benchtop oscilloscopes.

IC Role / Device Role / Timing Role: Manages trigger state machines, decodes serial protocols (I²C, SPI), and controls ADC/DAC timing.

Use Value: -3 speed grade ensures sub-nanosecond setup/hold timing margins for 200+ MHz sampling clocks.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC6SLX16-3CP132CFewer logic cells (14,579), smaller 132-pin CSBGA package, lower I/O count (102)Suitable for cost-sensitive, space-constrained designs with reduced peripheral interface needsSelect when board area and BOM cost outweigh need for >180 I/Os or >20K logic cells
XC6SLX45-3FGG484CHigher logic density (43,661 cells), larger 484-pin FCBGA package, 294 user I/OsRequired for complex protocol stacks, multi-gigabit transceivers, or large on-chip memory buffersChoose when XC6SLX25-3FT256C fails timing closure or exceeds resource utilization in final place-and-route

Compared with XC6SLX16-3CP132C and XC6SLX45-3FGG484C, the XC6SLX25-3FT256C delivers balanced I/O count, logic capacity, and thermal profile in a mid-size BGA-making it optimal for industrial edge nodes where scalability and layout reuse matter.

Availability

XC6SLX25-3FT256C is available at Aetrix Electronics and suitable for industrial automation, medical imaging front-ends, and test equipment requiring stable component supply across extended product lifecycles.

Supply support for XC6SLX25-3FT256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions, including FPGAs, ACAPs, and AI accelerators for data center, embedded, and edge applications.

The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring reliable performance, low power, and long-term availability in industrial and automotive environments.

FAQ

What is the maximum operating frequency supported by XC6SLX25-3FT256C?

The XC6SLX25-3FT256C is rated for a -3 speed grade, guaranteeing timing closure up to 500 MHz for internal logic paths under worst-case industrial temperature and voltage conditions. Actual achievable frequency depends on design complexity, routing congestion, and clock domain structure. The XC6SLX25-3FT256C DCM supports output frequencies up to 500 MHz with jitter specifications defined in UG382.

Does XC6SLX25-3FT256C support JTAG boundary-scan testing?

Yes, XC6SLX25-3FT256C includes IEEE 1149.1-compliant JTAG TAP controller and boundary-scan logic. Pins TDI, TDO, TCK, TMS, and TRTST are dedicated for this function and appear in the FTBGA pinout. The XC6SLX25-3FT256C supports INTEST, EXTEST, and SAMPLE/PRELOAD instructions per the Spartan-6 Configuration User Guide (UG380).

Can XC6SLX25-3FT256C be configured using SPI flash memory?

Yes, XC6SLX25-3FT256C supports master SPI configuration mode. When M0–M2 pins are set to 000, the device boots from a standard quad-SPI or standard SPI flash connected to dedicated CONFIG_IO pins. The XC6SLX25-3FT256C supports up to 33 MHz CCLK during SPI configuration, as specified in UG380.

What I/O standards are supported by XC6SLX25-3FT256C?

XC6SLX25-3FT256C supports 19 SelectIO standards including LVCMOS (1.2 V to 3.3 V), LVDS, RSDS, BLVDS, HSTL, SSTL, and differential signaling. Each I/O bank is independently configurable for voltage and standard. The XC6SLX25-3FT256C does not support PCI Express or high-speed serial transceivers natively.

Is XC6SLX25-3FT256C RoHS compliant and lead-free?

Yes, XC6SLX25-3FT256C is manufactured in a RoHS-compliant, lead-free process. The FTBGA package uses matte tin finish on solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3). Full compliance documentation, including substance declarations, is available in AMD's Product Change Notifications for Spartan-6 devices.

XC6SLX25-3FT256C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-6 LX
Package/Case:
256-LBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
1879
Number of Logic Elements/Cells:
24051
Total RAM Bits:
958464
Number of I/O:
186
Number of Gates:
-
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
256-FTBGA (17x17)

XC6SLX25-3FT256C FAQ

1.How can I place an order for XC6SLX25-3FT256C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC6SLX25-3FT256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC6SLX25-3FT256C reliable?

The price and inventory of XC6SLX25-3FT256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX25-3FT256C is usually 5 days.

3.What payment methods are accepted for XC6SLX25-3FT256C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX25-3FT256C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC6SLX25-3FT256C?

XC6SLX25-3FT256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC6SLX25-3FT256C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC6SLX25-3FT256C?

For technical support, including XC6SLX25-3FT256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX25-3FT256C requirements.

6.How does Aetrix verify that XC6SLX25-3FT256C is sourced from the original manufacturer or authorized distributors?

All XC6SLX25-3FT256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX25-3FT256C meets industry standards.

7.What is the process for return or replacement of XC6SLX25-3FT256C?

All XC6SLX25-3FT256C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX25-3FT256C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC6SLX25-3FT256C part is unused and in its original packaging.

Return procedure for XC6SLX25-3FT256C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC6SLX25-3FT256C Tags

  • XC6SLX25-3FT256C
  • XC6SLX25-3FT256C PDF
  • XC6SLX25-3FT256C Datasheet
  • XC6SLX25-3FT256C Specifications
  • XC6SLX25-3FT256C Images
  • AMD
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  • Buy XC6SLX25-3FT256C
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