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AMD XC6SLX25-3FT256I
- Part No.:
- XC6SLX25-3FT256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC6SLX25-3FT256I.pdf
- Description:
- IC FPGA 186 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,953
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Product details
Overview
XC6SLX25-3FT256I from AMD (formerly Xilinx) is a Spartan-6 FPGA with 24,051 logic cells, 186 I/O pins, and -3 speed grade operating at industrial temperature range (-40°C to +100°C). It integrates 92 embedded 18×18 multipliers, 716 kB of block RAM, and supports LVDS, SSTL, HSTL, and differential signaling standards. Used in industrial motor control interface modules requiring deterministic timing and reconfigurable logic.
For engineers reviewing the XC6SLX25-3FT256I datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage flexibility (1.2V/1.8V/2.5V/3.3V), embedded multiplier count for real-time filtering, and industrial-grade thermal reliability.
Technical Context
The XC6SLX25-3FT256I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated DSP slices. It supports SelectIO technology enabling mixed-voltage I/O banks with independent VCCO per bank and internal termination control.
Configuration is performed via SPIx4 or JTAG, with support for dual-boot and fallback modes using external serial flash. The device includes integrated clock management with two DCMs (Digital Clock Managers) providing phase shifting, frequency synthesis, and jitter reduction for up to eight output clocks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,051 - determines maximum combinational and sequential logic capacity for custom digital functions |
| I/O Pins | 186 - supports high-pin-count peripheral interfacing with bank-wise voltage isolation |
| Block RAM | 716 kB - enables on-chip data buffering, FIFOs, and small lookup tables without external memory |
| DSP Slices | 92 × 18×18 multipliers - accelerates FIR filtering, motor control algorithms, and real-time signal processing |
| Speed Grade | -3 - guarantees timing closure at highest operating frequencies within industrial temperature range |
| Operating Temp | -40°C to +100°C - qualified for deployment in enclosed industrial enclosures without active cooling |
| Package | FT256 - 256-pin Fine-Pitch Ball Grid Array (FBGA), 17×17 mm, 1.0 mm pitch, RoHS-compliant |
Pinout & Package
XC6SLX25-3FT256I is housed in a 256-pin FTBGA (Fine-Pitch Ball Grid Array) package with 17×17 array, 1.0 mm ball pitch, and standard JEDEC MO-251AC footprint. I/O banks are organized into eight groups (Bank 0–7), each supporting independent VCCO and configuration voltage (VCCAUX = 2.5 V).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | Output bank supply for Bank 0 - sets I/O voltage level (1.2V/1.35V/1.5V/1.8V/2.5V/3.3V) |
| H2 | IO_L0N_0 | Differential input pair (N) for Bank 0 - used with H1 for LVDS or TMDS reception |
| K15 | CLKIN_1 | Primary clock input for DCM1 - accepts single-ended or differential reference clocks up to 320 MHz |
| T14 | M0 | Mode pin for configuration - low during power-up selects Master Serial (SPI) mode |
| R15 | INIT_B | Open-drain status output - asserted low during configuration, high when user logic is active |
| V16 | GND | Ground reference for core and I/O - requires dedicated PCB plane connection per Xilinx layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO Technology | Per-bank I/O voltage control enables mixed-signal interface to legacy 3.3V sensors and modern 1.8V ADCs in same design |
| Dual-Register Flip-Flops | Each LUT can drive two independent registers - improves timing closure and reduces resource usage in pipelined datapaths |
| Integrated DCMs | Two fully independent Digital Clock Managers - eliminate need for external clock synthesizers in servo drive timing subsystems |
| Configurable I/O Standards | Supports 21 I/O standards including LVDS, RSDS, BLVDS, SSTL, HSTL - simplifies interface to display, memory, and communication ICs |
| Power-Down Mode | Core logic and I/O banks can be selectively disabled - reduces static power to <100 µW in standby for battery-backed systems |
Applications
| Industrial Motor Drive Interface | Programmable Logic Controller (PLC) Expansion Module |
|---|---|
Use Scenario: Real-time PWM generation, encoder feedback decoding, and safety monitoring in 3-phase inverter control. IC Role / Device Role / Timing Role: Configurable logic fabric executing closed-loop control algorithms with sub-microsecond latency. Use Value: Enables field-upgradable motor control firmware and adaptive commutation without hardware change. | Use Scenario: Adding fieldbus (PROFIBUS, CANopen) or analog I/O capability to legacy PLC backplanes. IC Role / Device Role / Timing Role: Protocol bridge and signal conditioning engine handling timing-critical bus arbitration and sample synchronization. Use Value: Reduces BOM count by integrating transceiver control, CRC calculation, and isolation interface logic. |
| Automated Test Equipment (ATE) Pattern Generator | Medical Imaging Data Acquisition Front-End |
Use Scenario: Generating high-speed digital stimulus patterns for semiconductor wafer testing at 100+ MHz rates. IC Role / Device Role / Timing Role: Deterministic pattern sequencer with precise cycle-accurate output alignment across 100+ pins. Use Value: Achieves <±50 ps skew between adjacent I/Os using dedicated routing and output delay calibration. | Use Scenario: Aggregating parallel ADC outputs from ultrasound or MRI sensor arrays with timestamping and preprocessing. IC Role / Device Role / Timing Role: High-throughput data concentrator with on-chip FIR filtering and packet framing before transmission to host processor. Use Value: Offloads 40% of host CPU load by performing real-time beamforming coefficient application in programmable logic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Xilinx XC6SLX16-3FT256I | 14,599 logic cells, 112 I/O, 512 kB block RAM - lower density and I/O count | Suitable for cost-sensitive, lower-complexity control tasks with fewer peripherals | Select when design fits within reduced resources and avoids over-provisioning |
| Xilinx XC6SLX45-3FGG484I | 43,661 logic cells, 316 I/O, 1,824 kB block RAM, larger 484-pin FBGA package | Required for designs needing higher gate count, more DSP slices, or additional I/O banks | Choose when XC6SLX25-3FT256I resource utilization exceeds 85% in synthesis reports |
Compared with XC6SLX16-3FT256I, the XC6SLX25-3FT256I delivers 65% more logic and 66% more I/O while maintaining identical speed grade and industrial temperature rating; compared with XC6SLX45-3FGG484I, it offers footprint compatibility with smaller PCB area and lower power, but with constrained DSP and memory resources.
Availability
XC6SLX25-3FT256I is available at Aetrix Electronics and suitable for industrial motor drives, programmable logic controllers, and automated test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX25-3FT256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan-6 FPGA family. Xilinx pioneered programmable logic architecture and system-on-chip integration for industrial and aerospace applications.
The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring low-power reconfigurable logic, mixed-signal interfacing, and industrial temperature operation - targeting motor control, vision, and communications infrastructure.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX25-3FT256I?
The XC6SLX25-3FT256I supports I/O voltages of 1.2 V, 1.35 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V per bank. Each I/O bank has independent VCCO, allowing mixed-voltage operation. The XC6SLX25-3FT256I does not support 1.0 V or 5.0 V I/O standards. Configuration voltage VCCAUX must be 2.5 V.
Does XC6SLX25-3FT256I include built-in configuration memory?
No, the XC6SLX25-3FT256I does not include non-volatile configuration memory. It requires an external serial PROM or flash memory for storing the bitstream. Configuration is loaded at power-up via Master Serial (SPI) or JTAG mode. The XC6SLX25-3FT256I supports dual-boot and fallback mechanisms using external flash devices.
Can XC6SLX25-3FT256I operate in automotive AEC-Q100 environments?
No, the XC6SLX25-3FT256I is rated for industrial temperature range (–40°C to +100°C) and is not AEC-Q100 qualified. It lacks automotive-specific screening, qualification testing, and failure rate reporting. For automotive applications, AMD recommends the XA Spartan-6 family variants, not the XC6SLX25-3FT256I.
How many DCMs are available in XC6SLX25-3FT256I and what are their key capabilities?
The XC6SLX25-3FT256I contains two Digital Clock Managers (DCMs). Each supports frequency synthesis (multiply/divide), phase shifting (–360° to +360°), duty cycle correction, and jitter reduction. They accept input clocks up to 320 MHz and generate up to eight output clocks per DCM. The XC6SLX25-3FT256I does not include PLLs - only DCMs.
Is XC6SLX25-3FT256I compatible with Vivado Design Suite?
No, the XC6SLX25-3FT256I is supported exclusively by Xilinx ISE Design Suite v14.7 and earlier. Vivado does not support Spartan-6 devices. Synthesis, implementation, and bitstream generation for XC6SLX25-3FT256I must be performed using ISE. AMD provides long-term maintenance for ISE toolchain for Spartan-6 lifecycle support.
XC6SLX25-3FT256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1879
- Number of Logic Elements/Cells:
- 24051
- Total RAM Bits:
- 958464
- Number of I/O:
- 186
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC6SLX25-3FT256I FAQ
1.How can I place an order for XC6SLX25-3FT256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX25-3FT256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX25-3FT256I reliable?
The price and inventory of XC6SLX25-3FT256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX25-3FT256I is usually 5 days.
3.What payment methods are accepted for XC6SLX25-3FT256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX25-3FT256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX25-3FT256I?
XC6SLX25-3FT256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX25-3FT256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX25-3FT256I?
For technical support, including XC6SLX25-3FT256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX25-3FT256I requirements.
6.How does Aetrix verify that XC6SLX25-3FT256I is sourced from the original manufacturer or authorized distributors?
All XC6SLX25-3FT256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX25-3FT256I meets industry standards.
7.What is the process for return or replacement of XC6SLX25-3FT256I?
All XC6SLX25-3FT256I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX25-3FT256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX25-3FT256I part is unused and in its original packaging.
Return procedure for XC6SLX25-3FT256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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